| Abstract |
The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R<sub>1</sub> is hydrogen or C<sub>1</sub>,-C<sub>4</sub>.-Alkyl, R<sub>2</sub> is hydrogen or C<sub>1</sub>,-C<sub>4</sub>-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C<sub>1</sub>,-C<sub>6</sub>alkyl, C<sub>1</sub>,C<sub>6</sub>alkoxy, hydroxy, NHCOR<sub>3</sub>,NHSO<sub>2</sub>,R<sub>4</sub> or SO<sub>2</sub>NHR5, wherein R<sub>3</sub>, is C<sub>1</sub>,-C<sub>4</sub>,-Alkyl or phenyl, R<sub>4</sub>, is C<sub>1</sub>-C<sub>4</sub>-Alkyl or phenyl and R<sub>5</sub> is C<sub>1</sub>,-C<sub>4</sub>-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards. |