Title of Invention

IMPLANT, IMPLANTATION DEVICE AND A KIT

Abstract

In order to form positive connections with human or animal tissue parts, particularly bones, implants (7) are used that at least partially consist of a material that can be liquefied by means of mechanical energy. Particularly suitable materials of this type are thermoplastics (e.g. resorbable thermoplastics) or thixotropic materials. The implants (7) are brought into contact with the tissue part, are subjected to the action of ultrasonic energy and are simultaneously pressed against the tissue part. The liquefiable material then liquefies and is pressed into openings or surface asperities of the tissue part so that, once solidified, it is positively joined thereto. The implantation involves the use of an implantation device comprising a generator (2), an oscillating element and a resonator (6), whereby the generator (2) causes the oscillating element to mechanically oscillate, and the element transmits the oscillations to the resonator (6). The resonator (6) is used to press the implant (7) against the tissue part whereby causing oscillations to be transmitted to the implant (7). The implants (7) are, for example, pin-shaped or dowel-shaped and are used in lieu of screws for forming connections with bone tissue, whereby the bone tissue is optionally pre-bored for positioning the implant (7). By virtue of the fact that it is unnecessary to transmit any torsional forces to the implants (7), these implants can be provided with a design that is weaker, i.e. slimmer than that of known screws made of the same material, and they can be implanted more quickly. (FIG.)1

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Documents:

1209-kolnp-2003-granted-abstract.pdf

1209-kolnp-2003-granted-assignment.pdf

1209-kolnp-2003-granted-claims.pdf

1209-kolnp-2003-granted-correspondence.pdf

1209-kolnp-2003-granted-description (complete).pdf

1209-kolnp-2003-granted-examination report.pdf

1209-kolnp-2003-granted-form 1.pdf

1209-kolnp-2003-granted-form 13.pdf

1209-kolnp-2003-granted-form 18.pdf

1209-kolnp-2003-granted-form 3.pdf

1209-kolnp-2003-granted-form 5.pdf

1209-kolnp-2003-granted-gpa.pdf

1209-kolnp-2003-granted-letter patent.pdf

1209-kolnp-2003-granted-reply to examination report.pdf

1209-kolnp-2003-granted-specification.pdf