| Title of Invention | A SUBSTRATE FOR A CARD WITH AN INTEGRATED CIRCUIT AND METHOD OF PRODUCTION THEREOF |
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| Abstract | The invention relates to the throughplating of flexible printed boards, wherein two electrically conductive layers (2, 3) located on surfaces opposite each other are electrically connected to one another, wherein the printed board (1) is cut through using a simple cutting tool with the purpose of producing an opening (7, 8). A defined amount of a conductive material is then optionally placed in the through hole (7, 8). (FIG.1A,1B) |
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1340-kolnp-2003-granted-abstract.pdf
1340-kolnp-2003-granted-assignment.pdf
1340-kolnp-2003-granted-claims.pdf
1340-kolnp-2003-granted-correspondence.pdf
1340-kolnp-2003-granted-description (complete).pdf
1340-kolnp-2003-granted-drawings.pdf
1340-kolnp-2003-granted-examination report.pdf
1340-kolnp-2003-granted-form 1.pdf
1340-kolnp-2003-granted-form 18.pdf
1340-kolnp-2003-granted-form 3.pdf
1340-kolnp-2003-granted-form 5.pdf
1340-kolnp-2003-granted-gpa.pdf
1340-kolnp-2003-granted-letter patent.pdf
1340-kolnp-2003-granted-reply to examination report.pdf
1340-kolnp-2003-granted-specification.pdf
1340-kolnp-2003-granted-translated copy of priority document.pdf
| Patent Number | 220837 | ||||||||||||
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| Indian Patent Application Number | 01340/KOLNP/2003 | ||||||||||||
| PG Journal Number | 23/2008 | ||||||||||||
| Publication Date | 06-Jun-2008 | ||||||||||||
| Grant Date | 06-Jun-2008 | ||||||||||||
| Date of Filing | 20-Oct-2003 | ||||||||||||
| Name of Patentee | GIESECKE & DEVRIENT GMBH, | ||||||||||||
| Applicant Address | PRINZREGENTENSTRASSE 159,81677 MUNCHEN | ||||||||||||
Inventors:
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| PCT International Classification Number | H05K 3/40 | ||||||||||||
| PCT International Application Number | PCT/EP02/04985 | ||||||||||||
| PCT International Filing date | 2002-05-06 | ||||||||||||
PCT Conventions:
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