Title of Invention | PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS, AND A MACHINE FOR THIS PURPOSE |
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Abstract | Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, on raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits. The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected. |
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01971-kolnp-2005-description complete.pdf
01971-kolnp-2005-international publication.pdf
1971-kolnp-2005-granted-abstract.pdf
1971-kolnp-2005-granted-assignment.pdf
1971-kolnp-2005-granted-claims.pdf
1971-kolnp-2005-granted-correspondence.pdf
1971-kolnp-2005-granted-description (complete).pdf
1971-kolnp-2005-granted-drawings.pdf
1971-kolnp-2005-granted-examination report.pdf
1971-kolnp-2005-granted-form 1.pdf
1971-kolnp-2005-granted-form 18.pdf
1971-kolnp-2005-granted-form 3.pdf
1971-kolnp-2005-granted-form 5.pdf
1971-kolnp-2005-granted-letter patent.pdf
1971-kolnp-2005-granted-pa.pdf
1971-kolnp-2005-granted-reply to examination report.pdf
1971-kolnp-2005-granted-specification.pdf
Patent Number | 221882 | |||||||||
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Indian Patent Application Number | 01971/KOLNP/2005 | |||||||||
PG Journal Number | 28/2008 | |||||||||
Publication Date | 11-Jul-2008 | |||||||||
Grant Date | 09-Jul-2008 | |||||||||
Date of Filing | 05-Oct-2005 | |||||||||
Name of Patentee | CHEMPLATE MATERIALS, S.L. | |||||||||
Applicant Address | S.N., CALLE URGELL, POLIGON INDUSTRIAL URVASA, E-08130 SANTA PERPERTUA DE MOGODA | |||||||||
Inventors:
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PCT International Classification Number | H05K 3/46 | |||||||||
PCT International Application Number | PCT/EP2004/002072 | |||||||||
PCT International Filing date | 2004-03-02 | |||||||||
PCT Conventions:
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