Title of Invention

NITROGEN-CONTAINING ORGANOSILICON COMPOUND, METHOD OF MANUFACTURE, AND METHOD OF TREATING SURFACES

Abstract A new nitrogen-containing organosilicon compound contains tertiary amine groups and carbonyl groups wherein the tertiary amine groups are selected from R1R2N- (where Rl and R2 are the same or different univalent hydrocarbon groups of 1-15 carbon atoms), alicyclic amino groups, or heterocyclic amino groups containing in their rings One or more tertiary amine groups.
Full Text DESCRIPTION
Nitrogen-Containing Organosilicon Compound, Method of Manufacture,
and Method of Treating Surfaces
FIELD OF THE INVENTION
[0001] This invention is related to a nitrogen-containing organosilicon compound and to a
method of manufacture, as well as to a silane coupling agent prepared from the nitrogen-
containing organosilicon compound.
BACKGROUND OF THE INVENTION
[0002] Organosilicon compounds that contain amino groups and alkoxysilyl groups are
used as silane coupling agents. For example, alkoxysilanes that contain primary amino
groups and expressed by the formulae
H2NC3H6Si(OC2H5)3 and H2NC2H4NHC3H6Si(OCH3)3 are known.
However, a disadvantage of such compounds is that when compounds that contain primary
amino groups are used in conjunction with organic resins, such as epoxy resins that utilize
amines as curing catalysts, the amino-group containing compounds exert an adverse effect
on the curability of the resins. Therefore, it has been proposed to use alkoxysilanes of the
formulae shown as disclosed in USP 5,476,884 and JP 2002-193976 A, with secondary
amino groups such as P h NH C3H6Si(0 C H3)3 where P h is a phenyl group,
CH3(CH2)3NHC3H6Si(O CH3)3, or alkoxysilanes with tertiary amino groups such
as(G4H9)2NC3H6Si(OCH3)3.
[0003] Although the alkoxysilanes with such secondary or tertiary amino groups reduce
the effect on curability of the resins to some extent, their adhesion-improving effect with
respect to various substrates is insignificant, and their silane coupling function is
insufficient. Another disadvantage of the last mentioned compounds is that, in the
manufacturing process, they produce a large amount of by-products in the form of amine
hydrochloric salts.

[0004] On the other hand, organosilicon compounds with amide groups are known in the
art including alkoxysilanes such as
H2N C O NH C3H6Si(O C2H5)3 and H2N C O C3H6Si(0 C2H5)3 as in US
Patent 3,033,815 (May 8, 1962). Furthermore, US Patent 4,209,455
(June 24,1980) discloses alkoxysilanes which contain secondary amide groups such as
H2N C2H4NHC O C3H6Si(0 C2H5)3 and
C18H37NHCOC2H4NHC3H6Si(OC2H5)3.
[0005] However, even these alkoxysilanes still exert unfavorable effect on curability and
adhesion-imparting properties of the resins, and therefore are not yet sufficient in their
function as silane coupling agents.
SUMMARY OF THE INVENTION
[0006] It is therefore an object of the present invention to provide novel nitrogen-
containing organosilicon compounds with tertiary amino and carbonyl groups.
[10007] It is anotlier object to provide a method for manufacturing such nitrogen-
containing compounds, and silane coupling agents prepared from these nitro gen-containing
organosilicon compounds.
[0008] These and other features of the invention will become apparent from a
consideration of the detailed description.
ACCOMPANYING
BRIEF DESCRIPTION OF THE DRAWING
[0009] Figure 1 is a graph that shows an IR spectrum of the nitrogen-containing
organosilicon compound obtained in Practical Example 1.
DETAILED DESCRIPTION OF THE INVENTION
[0010] The present invention relates to nitrogen-containing organosilicon compounds of
the following general Formula( I) and to a method for manufacturing the compounds :


where R1 and R 2 are the same or different univalent hydrocarbon groups with 1-15
carbon atoms, R3 is a bivalent hydrocarbon group with 1-15 carbon atoms, or an
alkyleneoxy group of the formula - C n H2nO- where n is an integer from 1-15; R4 IS a
bivalent hydrocarbon group with 1-15 carbon atoms; R5 is a univalent hydrocarbon group
with 1-15 carbon atoms; R6 is a univalent hydrocarbon group with 1-15 carbon atoms or
an alkoxyalkyl group; R? is an alkyl group such as methyl or a hydrogen atom; R8 is a
hydrogen atom, an alkyl group with 1-20 carbon atoms, or an aryl group; m is 0 or 1; x is
0-2; and y is 1-5.
[0011] The invention also relates to nitrogen-containing organosilicon compounds of
general Formula (II) below and to a method for manufacturing such compounds :

where R9 is an alicyclic amino group or a heterocyclic amino group composed of 1-4
nitrogen atoms, 3-17 carbon atoms, 0-2 oxygen atoms, and 4-34 hydrogen atoms; R 3 is a

bivalent hydrocarbon group with 1-15 carbon atoms or an alkyleneoxy group of the
formula - C n H2 n O-where n is 1-15; R4 is a bivalent hydrocarbon group with 1-15
carbon atoms; R5 is a univalent hydrocarbon group with 1-15 carbon atoms; R6 is a
univalent hydrocarbon group with 1-15 carbon atoms or an alkoxyalkyl group; R 7 is a an
alkyl group such as methyl or a hydrogen atom; R8 is a hydrogen atom, an alkyl group
with 1-20 carbon atoms, or an aryl group; m is 0 or 1; x is 0-2; and y is 1-5.
[0012] The invention also relates to silane coupling agents prepared from nitrogen-
containing organosilicon compounds represented by general Formulae ( I) or (IT) above.
[0013] In general, the nitrogen-containing organosilicon compounds of the present
invention are silane compounds represented by general Formulae (I ) and (H). In those
Formulae, R1 and R2 may designate the same or different univalent hydrocarbon groups
with 1-15 carbon atoms including alkyl groups such as methyl groups, ethyl groups, propyl
groups, and butyl groups; alkenyl groups such as vinyl groups, allyl groups, and butenyl
groups; aryl groups such as phenyl groups, tolyl groups, and xylyl groups; and aralkyl
groups such as benzyl groups and phenethyl groups.
[0014] Of these groups, most preferred because of availability are alkyl groups, especially
methyl or ethyl groups, In the above formulae; R3 is a bivalent hydrocarbon group with 1-
15 carbon atoms or an alkyleneoxy group of the formula - C n H2n O- where n is 1-15,
as well as a bivalent hydrocarbon group including alkylene groups such as methylene
groups, ethylene groups, propylene groups, pentylene groups, and hexylene groups; arylene
groups such as phenylene groups, naphthalenyl groups, and biphenylene groups; phenyl
substituted alkylene groups such as 4,4'-bismethylene phenyl groups,
3,4'-bismethylenephenyl groups, and 4,4'-bis-ethylenephenyl groups; alkylene arylene
groups such as 4,4'-bis-mcthylenebiphenylene groups; and alkyleneoxy groups such as
-C H2O-, -C2H4O-, and -C3H5-O-. Of these groups, most preferred for ease of
synthesis are alkylene groups and alkyleneoxy groups.
[0015] In the above formulae, R4 indicates bivalent hydrocarbon groups with 1-15

carbon atoms including alkylene groups such as methylene groups, ethylene groups,
propylene groups, pentylene groups, and hexylene groups; arylene groups such as
phenyleiae groups, naphthalenyl groups, and biphenylene groups; phenyl substituted groups
such as 4,4'-bismethylene phenyl groups, 3,4'-bismethylene phenyl groups, and 4,4'-
bisethylene phenyl groups; and alkylene arylene groups such as 4,4'-bismethylene
biphenylene groups. Of these, most preferred as being readily available are alkylene groups,
in particular propylene groups.
[0016] In the above formulae, R5 designates univalent hydrocarbon groups with 1-15
carbon atoms including alkyl groups such as methyl groups, ethyl groups, propyl groups,
and butyl groups; alkenyl groups such as vinyl groups, allyl groups, and butenyl groups;
aryl groups such as phenyl groups, tolyl groups, and xylyl groups; and aralkyl groups such
as benzyl groups and phenethyl groups.
[0017] R6 designates univalent hydrocarbon groups with 1-15 carbon atoms or
alkoxyalkyl groups including alkyl groups such as methyl groups, ethyl groups, propyl
groups, and butyl groups; alkenyl groups such as vinyl groups, allyl groups, and butenyl
groups; aryl groups such as phenyl groups, tolyl groups, and xylyl groups; aralkyl groups
such as benzyl groups, and phenethyl groups; and alkoxyalkyl groups such as methoxyethyl
groups, and methoxypropyl groups.
[0018] When the nitrogen-containing organosilicon compounds of the present invention
are used as silane coupling agents, better reactivity of the compounds can be achieved when
R.5 and R6 are methyl and ethyl groups,
[0019] In the above formulae, R 7 designates alkyl groups such as methyl groups or
hydrogen atoms; R 8 designates a hydrogen atom, an alkyl groups with 1-20 carbon atoms
such as methyl groups, ethyl groups, propyl groups, and butyl groups, or aryl groups with
6-20 carbon atoms such as phenyl groups, tolyl groups, and xylyl groups. In each molecule,
the R8 groups can be the same or different. Of these, most preferred because of availability
are hydrogen atoms. R 9 is an alicyclic amino group or a heterocyclic amino group with 1-4
nitrogen atoms, 3-17 carbon atoms, 0-2 oxygen atoms, and 4-34 hydrogen atoms.

[0020] Cyclic structures of these groups contain one or more tertiary amino groups. Such
groups are exemplified by N-cyclopentylamino groups, N-cyclohexylamino groups,
N-cycloheptylamino groups, N~(4-methylcyclohexyl)amino groups, and morpholino
groups. Of these, most preferred for availability are N-cyclohexylarnino groups or
morpholino groups.
[0021] In the above formulae, m is 0 or 1; and x is 0-2. Most preferred because of
availability and reactivity of coupling agents are groups wherein m and x are equal to 0.
Lu the formulae, y is 1-5, preferably 1 or 2. The following are examples of groups where y
is 2: N-ethylene-3-anhnopropylene groups, N-emylene-N'-ethylene-3-aminopropylene
groups, N-ethylene-4-aminoplienylene groups, and N-ethylene-2-aminoethyl-l- ethylenephenylene groups. Of these, N-ethylene-3-aminopropylene groups are preferred.
[0022] The mtrogen-containing organosilicon compounds of the present invention include
alkoxysilane compounds such as represented by the following formulae wherein Me
represents the methyl group and Et represents the ethyl group:
(C H3)2N C O C2H4NH C3H6Si(O C2H5)3
(CH3)2NCOC2H4NHC2H4NHC3H6Si(OCH3)3
(C2H5)2N C O C2H4NH C3H6Si(O C2H5)3
(C2H5)2NCOC2H4NHC2H4NHC3H6Si(OC2H5)3
(n-C4H9)2NCOC2H4NHC3H6Si(OC2H5)3
(n-C4H9)2NC O C2H4NH C2H4NH C3H6Si(O C H3)3
(CH3)2NC2H4COC2H4NHC3H6Si(OC2H5)3
(C H3)2N C2H4C O C2H4NH C2H4NH C3H6Si(O CH3)3
(CH3)2NC2H4OCOC2H4NHC3H6Si(OCH3)3
(C2H5)2N C2H4O C O C2H4NHC3H6Si(0 C2H5)3
(n-C4H9)2N C2H40 C O C2H4NH C3H6Si(O C2H5)3
(C H3)2N C2H40 C OC2H4NH C2H4NH C3H6Si(O C H3)3


[0023] The nitrogen-containia.g organosilicon compounds of the present invention can be
obtained by causing an addition reaction between compound (A) of the following general
formula(IV) :
wherein R4, R5, R 6, R 8 , x , and y, are the same as defined above;
and a compound (B) of the following general formula(III) :

wherein R1, R2, R3, R7, and m, are the same as defined above;
or a compound (B) of the following general formula(V) :

wherein R9, R3 R7, and m, are the same as defined above.
[0024] Component (A) represented by the general formula (IV) is a commercially
available organosilicon compound such as
3 -aminopropyltrimethoxysilane, 3 -aminopropyltriethoxysilane,
3-aminopropylmethyldiniethoxysilaneJ3-aminopropyltri(metboxyethoxy)silane,
4-aminobutyltrirnethoxysilane, 5-aminopentyltrimethoxysilane,
N-(2-aminoethyl)-3-aminopropyltrimethoxysilane,
N -(2-aminoethyl)-3 -aminopropyltriethoxysilane,
N-(2-aininoethyl)-3-aminopropyltri(rnethoxyethoxy)silane, and
N-(2-aminoethyl)-4-aniinobutyltrimethoxysilane, Of these, the most preferred are 3-
aminopropyltrimethoxysilane and 3-aminopropyltriethoxysilane.
[0025] Component (B) of Formulae (III) or (V)can be a acrylamide or acrylester with
tertiary amino groups. These compounds are commercially available and are exemplified
by N.N-dimethylacrylamide,
N, N-dimethylmethacrylamide, N, N-diethylacrylamide,
N,N-dipropylacrylamide, N,N-methylethylacrylamide,
N, N -dimethylmethacrylamide, N, N -dibutyttnethacrylamide,
N-piperazinoacrylamide, N-acryloylmorphohne, N.N-dimethylaminoethylacrylamide,
N,N-diethylaminopropylmethacrylamide, 2-(dimethylamino)ethyl acrylate,
2-(diethylamino)ethyl acrylate, and 2-(dibutylamino)ethyl acrylate.

Of these, most preferred are N,N-dimethylacrylarnide and N-acryloylmorpholine.
[0026] Although a reaction of addition between components A and B can be carried out
at room temperature, it is preferred to conduct the reaction with heating at a temperature not
exceeding 150 °C, most preferably at a. temperature between 60-100 °C. It is also preferred
to fill the interior of the reactor with an inert gas such as argon or nitrogen. The addition
reaction can be carried out as a consecutive reaction or a one-stage reaction. It is preferred
to heat one of the components (A) or (B), while the other component is added gradually.
[0027] One distinguishing feature of the invention is that when the nitrogen-containing
organosilicon compound is used in conjunction with an organic resin to which an amine
functions as a curing catalyst, the unfavorable effect of the compound on curability of the
resin is reduced because of the tertiary amine group on the molecular terminal. Another
distinguishing feature of the invention is that the nitrogen-containing organosilicon
compounds can be produced with high yield using commercially available starting
materials. A further distinguishing feature of the manufacturing method of the invention is
that the reaction can proceed efficiently even without the use of any catalyst and any
solvent. The manufacturing process can be carried out without the use of any special
reactor and can be performed on conventional equipment.
[0028] The nitrogen-containing organosilicon compounds of the invention provide
improved adhesion between various substrates, in particular between organic resins and
inorganic materials, or metal materials, when x in the general Formulae (I ) and (II) is 0 or
1. Because of these features, nitrogen-containing organosilicon compounds of the present
invention are suitable for use as surface-treatment agents, adhesion improvers, primers, and
silane coupling agents, for improving the properties of organic resins. The organic resins
suitable for purposes of the invention include epoxy resins, phenol resins, urethane resins,
melamine resins, polycarbonate resins, polyethylene resins, polyvinylchloride resins, and
polyamide resins.
[0029] In use as silane coupling agents, the nitrogen-containing organosilicon compounds
of general Formulae ( I ) or (II) may be diluted with water or an organic solvent. The
organic solvent suitable for this purpose include methanol, ethanol, or similar water soluble

organic solvent. The coupling agent can be applied onto the surface of substrate to be
treated or it can be added to the organic resins. The former method is preferred.
[0030] Several processes can be used for applying the coupling agent. The coupling agent
alone can be sprayed onto the substrate; the coupling agent can be diluted in an organic
solvent and the solution can be sprayed onto the surface of the substrate; the coupling agent
can be diluted in a water/organic solvent mixture and sprayed onto-the substrate; the
substrate can be impregnated with the treatment solution obtained with the coupling agent
and an organic solvent; and the substrate can be impregnated with the treatment liquid
obtained by mixing the coupling agent with the water/organic solvent mixture.
These treatments can be completed by the application of heat.
[0031] Substrates which can be treated with the silane coupling agent of the invention
include powdered materials such as fumed silica, wet-process silica, baked silica, fumed
titanium dioxide, powdered quartz, diatomaceous earth, alurninum hydroxide, aluminum
oxide, magnesium oxide, aluminosilicate, iron oxide, zinc oxide, calcium oxide, zinc
carbonate, mica, and magnesium carbonate; fibrous materials such as glass fiber, Nylon
fiber, and carbon fiber; and plates such as glass plates, copper plates, iron plates, stainless-
steel plates, and aluminum plates.
EXAMPLES
[0032] The following examples are set forth in order to illustrate the invention in more
detail.
Practical Example 1
[0033] A four neck flask equipped with a thermometer, stirrer, and cooler, was filled with
156.7 parts by weight of 3-aminopropyltriemoxysilane, and the content of the flask was
heated in a nitrogenous atmosphere to 70 °C. Then, 77.2 parts by weight of N7N-
dimethylacrylamide was added dropwise over 3 0 minutes, and the mixture was stirred and
heated for 8 hours at 100 °C. The reaction mixture was distilled under a reduced pressure at
138 °C and 1.3 hPa to produce 170.2 parts by weight of a colorless transparent liquid, at a

yield of 75 percent. Results of13 C nuclear magnetic resonance spectral analysis (NMR),
infrared analysis (IR), and G C /M S analysis, defined the product as a nitrogen-containing
organosilicon compound of the formula
(CH3)2NCOC2H4NHC3H6Si(OC2H5)3.
Pratctical Example 2
[0034] A four neck flask equipped with, a thermometer, stirrer, and cooler, was filled with
298.1 parts by weight of 3-aminopropyltrimethoxysilane, and the content of the flask was
heated in a nitrogenous atmosphere to 700C.Then, I81.0partsby weight of N,N-
dimethylacrylamide was added dropwise over 60 minutes, and the mixture was stirred and
heated for 8 hours at 100 0C The reaction mixture was distilled under a reduced pressure at
130°C and 1.3 hPa to produce 360.5 parts by weight of a colorless transparent liquid, at a
yield of 78 percent Results of 13 C nuclear magnetic resonance spectral analysis (NMR),
infrared analysis (IR), and G C/M S analysis, defined the product as a nitrogen-containing
organosilicon compound of the formula
(CH3)2NCOC2H4NHC3H6Si(OCH3)3.
Practical Example 3
[0035] A four neck flask equipped with a thermometer, stirrer, and cooler, was filled with
33.21 parts by weight of 3-aminopropyltriethoxysilane, and the content of the flask was
heated in a nitrogenous atmosphere to 70 "C. Then, 23.3 parts by weight of N-acryloyl
morpholine was added dropwise over 10 minutes, and the mixture was stirred and heated
for 3 hours at 100 "C. The reaction mixture was distilled under a reduced pressure at 130QC
and 1.3 hPa to produce 53.7 parts by weight of a yellow transparent liquid, at a yield of 95
percent. Results of 13 C nuclear magnetic resonance spectral analysis (NMR), and
infrared analysis (IR), defined the product as a nitrogen-containing organosilicon
compound of the formula


Practical Example 4
[0036] A four neck flask equipped with a thermometer, stirrer, and cooler, was filled with
33.21 parts by weight of 3-aminopropyltriethoxysilane, and the content of the flask was
heated in a nitrogenous atmosphere to 70 °C. Then, 23-6 parts by weight of 2-
(dimethylamino) ethylacrylate was added dropwise over 10 minutes, and the mixture was
stirred and heated for 3 hours at 100 °C. The reaction mixture was distilled under a reduced
pressure at 130°C and 1.3 hPa to produce 53.7 parts by weight of a yellow transparent
liquid, at a yield of 96 percent, Results of 13 C nuclear magnetic resonance spectral
analysis (NMR), and infrared analysis (IR), defined the product as a nitrogen-containing
organosilicon compound of the formula
(C H3)2N C2H40 C O C2H4NH C3H6Si(0 C2H5)3.
Practical Example 5
[0037] A four neck flask equipped with a thermometer, stirrer, and cooler, was filled with
222.4 parts by weight of N-(2-ammoethyl)-3-ammopjx>pyltrimethoxysilane, and the content
of the flask was heated in a nitrogenous atmosphere to 700C. Then, 109.0 parts by weight
of N,N-dimethylacrylamide was added dropwise over 30 minutes, and the mixture was
stirred and heated for S hours at 1001. The reaction mixture was distilled under a reduced
pressure at 130°C and 1.3 hPa to produce 324.8 parts by weight of a yellowish transparent
liquid, at a yield of 98 percent. Results of 13 C nuclear magnetic resonance spectra]
analysis (NMR), and infrared analysis (IR), defined the product as a nitrogen-containing
organosilicon compound of the formula
(C H3)2NC O C2H4NH C2H4NH C3H6Si(O C H3)3.

Practical Example 6
[003 8] The nitrogen-containing organosilicon compounds obtained in Practical Examples
1-5 were diluted with a mixture of water and ethanol in a 1:1 weight ratio of water to
ethanol. This produced treatment liquids with a concentration of 0.4 weight percent of the
organosilicon compound. Glass plates were immersed for 10 seconds in these solutions,
respectively, and then dried for one hour at 120 °C. Then, a curable epoxy resin
composition consisting of 100 parts by weight of a bisphenol type A epoxy resin sold under
the name EPICOAT 828 having an epoxy equivalent of 185; 8 parts by weight of
dicyandiamide; and 0.4 parts by weight of N-dimethylbenzylarnine, was applied to the
surfaces of the glass plates. The coatings were dried for 90 minutes at 170 °C. There was
obtained cured epoxy resin coatings firmly adhered to the glass surface, having a
cylindrical shape with a 5 mm diameter and 5 mm height.
[0039] The coated samples were analyzed for adhesion of the cured epoxy resin using a
durometer. The adhesive force was also measured prior and after a Pressure Cooker Test
(PCT) which consisted of heating the samples for 24 hours at 121 °C and 100 % Relative
Humidity. The results of the PCT tests are shown in Table 1.
[0040J In Comparative Examples, adhesive force was measured using silane coupling
agents as noted below:
Comparative Example 1: H2NCONHC3H6Si(0 C2H5)3
Comparative Example 2: P h NHC3H6Si(O CH3)3 where P h is phenyl.
Comparative Example 3; C18H37NHCO C2H4NHC3H6Si(0 C2H5)3,
The results are shown in Table 1.


[0041] In Table 1, (*) is the compound H2NCONHC3H0-Si(OC2H5)3;
(**) is the compound PhNHC3H6Si(OCH3)3; and (***) is the compound
C18H37NHCOC2H4NHC3H6Si(OC2H5)3.
INDUSTRIAL APPLICABILITY
[0042] In view of the above, it should be apparent that the nitrogen-containing
organosilicon compounds of the present invention are new and novel compounds
containing tertiary-amine and carbonyl groups; that the method for preparing the nitrogen-
containing compound provides a high yield; and that when the compounds are used as
silane coupling agents, there is obtained improved adhesion between various substrates.
[0043] Other variations may be made in compounds, compositions, and methods
described herein without departing from the essential features of the invention. The
embodiments of the invention specifically illustrated herein are exemplary only and not
intended as limitations 011 their scope except as defined in the appended claims.

WE CLAIM:
1. A nitrogen-containing organosilicon compound of the formula:

wherein R1 and R2 are the same or different univalent hydrocarbon groups with 1-15
carbon atoms; R3 is a bivalent hydrocarbon group with 1-15 carbon atoms, or an
alkyleneoxy group of the formula -C n H 2 n O- where n is 1-15; R4 is a bivalent
hydrocarbon group with 1-15 carbon atoms; R5 is a univalent hydrocarbon group with
1-15 carbon atoms; R6 is a univalent hydrocarbon group with 1-15 carbon atoms or an
alkoxyalkyl group; R7 is an alkyl group or a hydrogen atom; R8 is a hydrogen atom, an
alkyl group with 1-20 carbon atoms, or anaryl group; m is 0 or 1; x is 0-2; and y is 1-5.
2. The nitrogen-containing organosilicon compound as claimed in Claim 1, wherein
m is 0.
3. A nitrogen-containing organosilicon compound of the formula:


wherein R9 is an alicyclic amino group or a heterocyclic amino group containing 1-4
nitrogen atoms, 3-17 carbon atoms, 0-2 oxygen atoms, and 4-34 hydrogen atoms;
i) When R9 is an alicyclic amino group, R3 is a bivalent hydrocarbon group with
1-15 carbon atoms;
ii) When R " is a heterocyclic amino group, R3 is a bivalent hydrocarbon group
with 1-15 carbon atoms or an alkyleneoxy group of the formula -C n H 2 nO-
where n is 1-15;
R4 is a bivalent hydrocarbon group with 1-15 carbon atoms; R5 is a univalent
hydrocarbon group with 1-15 carbon atoms; R 6 is a univalent hydrocarbon group with
1-15 carbon atoms or an alkoxyalkyl group; R7 is an alkyl group or a hydrogen atom; R8
is a hydrogen atom, an alkyl group with 1-20 carbon atoms, or an aryl group; m is 0 or
1; x is 0-2; and y is 1-5.
4. The nitrogen-containing organosilicon compound as claimed in Claim 3, wherein
m is 0.
5. The nitrogen-containing organosilicon compound as claimed in Claim 3, wherein
R9 is a heterocyclic amino group.
6. The nitrogen-containing organosilicon compound as claimed in Claim 3, wherein
R 3 is an alkyleneoxy group of the formula -C n H 2 n O- where n is 1-15.
7. A method of manufacturing a nitrogen-containing organosilicon compound
comprising the addition reaction of a compound of the formula;


wherein Rl and R 2 are the same or different univalent hydrocarbon groups with 1-15
carbon atoms; R3 is a bivalent hydrocarbon group with 1-15 carbon atoms, or an
alkyleneoxy group of the formula-C n H 2 n O-where n is 1-15; R4 is a bivalent
hydrocarbon group with 1-15 carbon atoms; R5 is a univalent hydrocarbon group with
1-15 carbon atoms; R6 is a univalent hydrocarbon group with 1-15 carbon atoms or an
alkoxyalkyl group; R7 is an alkyl group or a hydrogen atom; R8 is a hydrogen atom, an
alkyl group with 1-20 carbon atoms, or anaryl group; m is 0 or 1; x is 0-2; and y is 1-5.
8. A method as claimed in claim 7, for manufacturing the nitrogen-containing
organosilicon compound defined in Claim 1.
9. A method of manufacturing a nitrogen-containing organosilicon compound
comprising the addition reaction of a compound of the formula:


wherein R9 is an alicyclic amino group or a heterocyclic amino group containing 1-4
nitrogen atoms, 3-17 carbon atoms, 0-2 oxygen atoms, and 4-34 hydrogen atoms;
i) When R9 is an alicyclic amino group, R3 is a bivalent hydrocarbon group with
1-15 carbon atoms;
ii) When R9 is a heterocyclic amino group, R3 is a bivalent hydrocarbon group
with 1-15 carbon atoms or an alkyleneoxy group of the formula -C n H 2 n O-
where n is 1-15;
R5 is a univalent hydrocarbon group with 1-15 carbon atoms; R 6 is a univalent
hydrocarbon group with 1-15 carbon atoms or an alkoxyalkyl group; R7is an alkyl
group or a hydrogen atom; R8 is a hydrogen atom, an alkyl group with 1-20 carbon
atoms, or an aryl group; m is 0 or 1; X is 0-2; and y is 1-5.
10. A method as claimed in claim 9, for manufacturing the nitrogen-containing
organosilicon compound defined in Claim 3.

11. A method of treating surfaces comprising applying to the surfaces a nitrogen-
containing organosilicon compound as claimed in Claim 1.
12. A method of treating surfaces comprising applying to the surfaces a nitrogen-
containing organosilicon compound as claimed in Claim 3.
13. A method of treating surfaces comprising applying to the surfaces a solution
containing the nitrogen-containing organosilicon compound as claimed in Claim 1.
14. A method of treating surfaces comprising applying to the surfaces a solution
containing the nitrogen-containing organosilicon compound as claimed in Claim 3.

A new nitrogen-containing organosilicon compound contains tertiary amine groups and carbonyl groups wherein the
tertiary amine groups are selected from R1R2N- (where Rl and R2 are the same or different univalent hydrocarbon groups of 1-15
carbon atoms), alicyclic amino groups, or heterocyclic amino groups containing in their rings One or more tertiary amine groups.

Documents:

1838-KOLNP-2005-FORM-27.pdf

1838-kolnp-2005-granted-abstract.pdf

1838-kolnp-2005-granted-assignment.pdf

1838-kolnp-2005-granted-claims.pdf

1838-kolnp-2005-granted-correspondence.pdf

1838-kolnp-2005-granted-description (complete).pdf

1838-kolnp-2005-granted-drawings.pdf

1838-kolnp-2005-granted-examination report.pdf

1838-kolnp-2005-granted-form 1.pdf

1838-kolnp-2005-granted-form 13.pdf

1838-kolnp-2005-granted-form 18.pdf

1838-kolnp-2005-granted-form 3.pdf

1838-kolnp-2005-granted-form 5.pdf

1838-kolnp-2005-granted-gpa.pdf

1838-kolnp-2005-granted-reply to examination report.pdf

1838-kolnp-2005-granted-specification.pdf


Patent Number 227777
Indian Patent Application Number 1838/KOLNP/2005
PG Journal Number 04/2009
Publication Date 23-Jan-2009
Grant Date 20-Jan-2009
Date of Filing 15-Sep-2005
Name of Patentee DOW CORNING TORAY CO., LTD.
Applicant Address 1-3, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO
Inventors:
# Inventor's Name Inventor's Address
1 IWAI, MAKOTO C/O DOW CORNING TORAY SILICONE CO., LTD. 2-2, CHIGUSAKAIGAN, ICHIHARA-SHI, CHIBA 2990108
2 HAMADA, MITSUYOSHI C/O RESEARCH & DEVELOPMENT CENTER, HITACHI CHEMICAL CO., LTD. 48 WADAI, TSUKUBA-SHI, IBARAKI 3004247
PCT International Classification Number C07F 7/18
PCT International Application Number PCT/JP2004/004562
PCT International Filing date 2004-03-30
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 2003-093337 2003-03-31 Japan