Title of Invention	A RADIATION CURABLE CONDUCTIVE INK AND MANUFACTURING METHOD FOR USING THE SAME
Abstract	The invention relates to a radiation curable conductive ink capable of achieving chemical crosslinking reaction when irradiated with radiation, the coductive ink comprising a conductive powder having a covering layer, wherein the weight of the silver content of the conductive powder before being covered with the covering layer accounts for iess than 90% of the weight of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for iess than 80% of the total weight of the conductive powder and the covering layer, and wherein average size of the conductive powder is less than 40 micro; and a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization.

Title of Invention

A RADIATION CURABLE CONDUCTIVE INK AND MANUFACTURING METHOD FOR USING THE SAME

Abstract

The invention relates to a radiation curable conductive ink capable of achieving chemical crosslinking reaction when irradiated with radiation, the coductive ink comprising a conductive powder having a covering layer, wherein the weight of the silver content of the conductive powder before being covered with the covering layer accounts for iess than 90% of the weight of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for iess than 80% of the total weight of the conductive powder and the covering layer, and wherein average size of the conductive powder is less than 40 micro; and a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization.

Full Text	RADIATION CURABLE CONDUCTIVE INK AND MANUFACTURING METHOD FOR USING THE SAME BACKGROUND OF THE INVENTION (a) Field of the Invention The present invention relates to a radiation curable conductive ink and manufacturing method for conductive substrate using conductive ink, which is particularly applicable for use in electronic materials, including radio frequency identification (RFID) antenna, printed-circuit boards, smart cards (non-contact chip cards) components, smart labels, printed electronics, anti-electromagnetic interference (EMI) and anti- electrostatic materials. (b) Description of the Prior Art The driving force of technological progress has accentuated multifunctionality and continuous miniaturization in the design of various electronic products. More particularly, rapid development in networking and wireless communication in recent years has seen the perpetual modification in a diverse range of portable electronic products, which has altered the unlimited potentiality of 21st century modes of business. There is an inseparable relationship between advancement in the miniaturization of electronic products and electronic materials, for instance, laminate type antenna are replacing traditional stem antenna, and the lamination of printeo-circuit boards has made miniature cellular phones available to the market. Moreover, rapid growth in radio frequency Identification (RFID) in recent years has seen the application of RFID in electronic money, animal chip readers, smart cards (non- contact chip cards), smart store shopping, and so on, which have already become an intimate part of the lives of consumers. Although lamination of the aforementioned laminate type antenna, printed-circuit boards and radio frequency identification systems offer convenience of use, however, the current cost of manufacture is still very high, with the result that many innovative products or new modes of business are still speculative and non-viable. Referring to FIG. 1, which shows an example of the radio frequency identification (RFID) applied in a smart card (non-contact chip card), the principle of which involves the transmission of signals from a chip 11 on a smart card 10 to a reader 20 through a laminated antenna 12. An antenna 21 of the reader 20 then receives the signals, and a microprocessor 22 decodes the signals to form readable information. Furthermore, the reader 20 can also deliver other data to the smart card 10, whereupon the chip 11 on the smart card 10 proceeds with writing operations. Because the transmission method implemented is an inductive type (using a coil resonance producing high frequency signal induction), thus, a power supply does not need to be installed in the smart card 10. In principle, the aforementioned transmitting terminal of the radio frequency identification can be configured on any type of inexpensive product, and can even altogether replace current bar codes as used on all types of commodities, thus bringing infinite convenience and completely changing current lifestyle trends. However, current technology is still unable to overcome the problem of the high cost of radio frequency identification systems, primarily because of the high cost of the aforementioned antenna compared, which can cost higher than the chips. Referring to FIG. 2, which shows the aforementioned antenna 12 of the smart card 10 primarily structured by disposing a wound coil on a laminated substrate 13, thereby forming the antenna 12 that is able to transmit and receive signals. A traditional etching method is used to dispose the wound coil onto the laminated substrate 13. However, even mass production is unable to reduce costs because of complications in the job program. Hence, working procedure can be effectively reduced and savings on costs made if a screen printing method is used to directly mount the wound coil onto the laminated substrate. Even though current technology has enabled the universal adoption of screen printing in the manufacture of circuit substrate, however, the current primary use of traditional thermal curable conductive ink containing pure silver powder is unable to effectively reduce manufacturing costs when used on the aforementioned radio frequency identification antenna or circuit board. Accordingly, the inventor of the present invention has developed a radiation curable conductive ink and a manufacturing method for conductive substrate using the conductive ink that effectively reduces manufacturing costs. SUMMARY OF THE INVENTION In an embodiment of radiation curable conductive ink the present invention, a chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is either ultraviolet ray, visible light ray electron beam or a combination of more than one of these three different rays. The conductive ink contains at least the following components: (a) The conductive powder having a covering layer, wherein the weight of the silver content of the conductive powder before covering with the covering layer accounts for less than 90% of the weight of the conductive powder without the covering layer; (b) The covering layer covering surface of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer; (c) The conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; (d) A photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization, such as reactive cyclized monomer or reactive cyclized oligomer. In another embodiment of the radiation curable conductive ink of the present invention, a chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays. The conductive ink contains at least the following components: (a) The conductive powder having a covering layer, wherein the weight of copper content of the conductive powder before covering with the covering layer accounts for more than 30% of the weight of the conductive powder without the covering layer; (b) The covering layer covering surface of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer; (c) The conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; (d) The photosensitive binder having a viscosity less than 5,000 cps under temperature concition at 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer. In another embodiment of the radiation curable conductive ink of the present invention, a chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays. The conductive ink contains at least the following components: (a) The conductive powder having a covering layer, wherein the weight of aluminum content of the conductive powder before covering with the covering layer accounts for more than 30% of the weight of the conductive powder without the covering layer; (b) The covering layer covering surface of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer; (c) The conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; (d) The photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25°C and contains at least one reactive cyclized crganic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer. In another embodiment of the radiation curable conductive ink of the present invention, a chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays. The conductive ink contains at least the following components: (a) Metallic conductive powder, wherein the average size of the of the conductive powder is less than 40 micro; (b) A photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer. A manufacturing method tor conductive substrate using screen printing is realized using the aforementioned components of the radiation curable conductive ink of the present invention, thereby foreshortening working procedure and reducing cost, wherein method adopted is disclosed below: The manufacturing method for conductive substrate comprises the following steps: (a) Apply the conductive powder, wherein weight of silver content of the conductive powder accounts for less than 90% of the weight of the conductive powder; (b) Cover the conductive powder with the covering layer, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer, and the conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; (c) Mix the conductive powder having the covering layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of less than 5,000 cps at a temperature of 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization ,such as reactive cyclized monomer or reactive cyclized oligorrer, thereby forming the radiation curable conductive ink; (d) Print the radiation curable conductive ink onto a surface of a substrate using a screen printing method; (e) Expose the radiation curable conductive ink to radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction, and the conductive substrate is formed therefrom. A manufacturing method for conductive substrate using the radiation curable conductive ink comprises the following steps: (a) Apply the conductive powder, wherein weight of copper content of the conductive powder accounts for more than 30% of the weight of the conductive powder; (b) Cover the conductive pcwder with the covering layer, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer, and the conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; (c) Mix the conductive powder having the covering layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of less than 5,000 cps at a temperature of 25°C and at least one reactive cyclized organic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer, thereby forming the radiation curable conductive ink; (d) Print the radiation cunable conductive ink onto a surface of the substrate using a screen printing method; (e) Expose the radiation curable conductive ink to radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction, and the conductive substrate is formed therefrom. A manufacturing method for conductive substrate using the radiation curable conductive ink comprises the following steps: (a) Apply the conductive powder, wherein weight of aluminum content of the conductive powder accounts for more than 30% of the weight of the conductive powder; (b) Cover the conductive powder with the covering layer, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer, and the conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; (c) Mix the conductive powder having the covering layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of less than 5,000 cps at a temperature of 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer, thereby forming the radiation curable conductive ink; (d) Print the radiation curable conductive ink onto a surface of the substrate using a screen printing method; (e) Expose the radiation curable conductive ink to radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction, and the conductive substrate is formed therefrom. A manufacturing method for conductive substrate using the radiation curable conductive ink comprises the following steps: (a) Apply the metallic conductive powder, wherein the average size of the of the conductive powder is less than 40 micro; (b) A photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer; (c) Mix the conductive pov/der and the aforementioned photosensitive binder, thereby forming the radiation curable conductive ink; (d) Print the radiation curable conductive ink onto a surface of the substrate using a screen printing method; (e) Expose the radiation curable conductive ink to radiation, wherein the radiation used is either ultraviolet ray, visible light ray, electron beam or a combination of more than one of these three different rays, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction, and the conductive substrate is formed therefrom. A manufacturing method for conductive substrate using screen printing is realized usinc the aforementioned radiation curable conductive ink of the present invention and the method of using conductive ink to manufacture the conductive substrate, thereby achieving objectives of foreshortening working procedure and reducing cost. The method is particularly applicable for applications in radio frequency identification RFID antenna, printed-circuit boards, smart cards (non-contact chip cards) component members, smart labels, printed electronics, anti-EMI and anti-static materials. Furthermore, the radiation curable conductive ink mixed with the aforementioned components undergoes a chemical crooslinking reaction that generally occurs within a few seconds compared to between 3 minutes to 2 hours and a temperature around 80°C - 220°C needed by general thermal curable resins (for example: thermal curable type epoxy resin and polyester resin), thereby providing the present invention with advantages of raoid curable and energy savings. After the conductive powder applied by combining properties of the aforementioned materials has undergone radiation crosslinking, apart from having the advantage of rapid curing speed, moreover, the resulting conductive substrate is provided with superior electrical conductivity and resistance to oxidation. In addition, because of a light-screening effect and high specific gravity of the conductive powder, rapid sedimentation of the metallic powder easily causes, which makes it difficult for the radiation curable conductive ink to achieve an ideal degree of cure. Moreover, it is difficult for the metallic powder to be uniformly dispersed and achieve a substantially thick conductive ink. The present invention has made improvements that resolve the aforementioned shortcomings, and enables the radiation curable conductive ink to undergo a rapid and curing reaction that achieves favorable metallic powder dispersibility and superior electrical conductivity, as well as superior electrical conductivity stability, resistance to oxidation and low cost. To enable a further understanding of said objectives and the technological methods of the invention herein, brief description of the drawings is provided below fallowed by detailed description of the preferred embodiments. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a schematic view of an application of a radio frequency identification system in a smart card according to prior art. FIG. 2 shows a structural schematic view depicting a radio frequency identification within a smart card according to prior art. FIG. 3 shows a flow diagram of a manufacturing method for conductive substrate using radiation curable conductive ink according to the present invention. FIG. 4 shows another flow diagram of manufacturing method of conductive substrate using radiation curable conductive ink according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A radiation curable conductive ink of the present invention undergoes a chemical crosslinking reaction by irradiating conductive ink with radiation, wherein the conductive ink contains at least the following components: (a) Conductive powder having a covering layer, wherein the weight of the silver content of the conductive powder before covering with the covering layer having less than 90% by weight of silver content, more than 30% by weight of copper or more than 30% by weight of aluminum; (b) The covering layer covering surface of the conductive powder, wherein weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer; (c) The conductive powder having the covering layer, wherein average size of conductive powder is less than 40 micro; (d) A photosensitive binder having a viscosity less than 5,000 cps under temperature conditions at 25° and contains at least one reactive cyclized organic compound that can undergo polymerization, such as reactive cyclized monomer or reactive cyclized oligomer. Referring to FIG. 3, which depicts a rapid manufacturing process for a conductive substrate material, wherein the radiation curable conductive ink of the present invention primarily comprises the conductive powder having the covering layer and the photosensitive binder. The manufacturing process adopted has the following steps: (a) Apply the conductive powder; (b) Cover the conductive powder with the covering layer, wherein weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accou its for less than 80% of the total weight of the conductive powder and the covering layer; (c) Mix the conductive powder having the covering layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of less than 5,000 cps at a temperature of 25°C, thereby forming the radiation curable conductive ink; (d) Print the radiation curable conductive ink onto a surface of the substrate using a screen printing method; (e) Expose the radiation curable conductive ink to radiation, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking leaction, and the conductive substrate is formed therefrom. The conductive material manufactured by the present invention using the aforementioned method has an application range including at least radio frequency identification (RFID) antenna, printed-circuit boards, smart card inductive components, smart labels, printed electronics, anti- EMI (electromagnetic interference), and anti-electrostatic materials. In addition, the aforementioned step (d) in FIG 3 uses screen printing to print the radiation curable conductive ink onto the substrate, and the form of the printed lines include at least reticular form, lattice form and honeycomb form, thereby enabling the radiation to irradiate within interstices of the aforementioned forms, which increases irradiating area and enhances curable efficiency, thus achieving a substantially greater thickness. Furthermore, the radiation used in the aforementioned radiation curable conductive printing ink and manufacturing method for conductive substrate using conductive ink of the present invention is one or more than one of the following three examples of radiation: (1) Ultraviolet ray; (2) Visible light ray; (3) Electron beam. The conductive powder within the components of the aforementioned radiation curable conductive printing ink and manufacturing method for conductive substrate using conductive ink of the present invention contains silver, copper or aluminum, content of which is one or more than one of the following three embodiments: (1) The weight of silver content of the conductive powder before covering with a covering layer accounts for less than 90% of the weight of the conductive powder without the covering layer; (2) The weight of copper ccntent of the conductive powder before covering with a covering ayer accounts for more than 30% of the weight of the conductive powder without the covering layer; (3) The weight of aluminum content of the conductive powder before covering with a covering layer accounts for more than 30% of the weight of the conductive powder without the covering layer. The aforementioned conductive powder with covering layer, wherein average size of the conductive powder is less than 40 micro. The conductive powder having the covering layer mixed with the photosensitive binder, wherein, the photosensitive binder contains at least one reactive cyclizec organic compound that can undergo polymerization , such as reactive cyclized monomer or reactive cyclized oligomer, and in addition, the photosensitive binders contains at least one photoinitiator that is able to absorb visible light within a 390-800 mm wavelength range, wherein weight of the photoinitiator content accounts for less than 20% of the total weight of the radiation curable conductive ink. The photoinitiator can be TPO (diphenyl-(2.4.6-trimethylbenzoyl) phosphine oxide, CAS No. 75980 - 60 - 8), Ciba lrgacure-819 (Bis(2,4,6-rimethylbenzoyl)-phenylphosphineoxide), ITX (isopropyl thioxanthone, CAS No. 5495-34-1 and 83846-86-0), CPTX (1-Chloro-4- propoxythioxanthone 1 -chlo o-4-propoxythioxanthone 1 -chloro-4-Hs propoxy-9s-thioxanthen-9-one CAS No. 142770-42-1), EPD (ethyl 4- (dimethylamino) benzoate ethyl p-(dimethylamino) benzoate, CAS No. 10287-53-3), and so on, increasing curable efficiency therewith. In another embodiment of the radiation curable conductive ink of the present invention, a radiation curable conductive ink of the present invention undergoes a chemical crosslinking reaction by irradiating conductive ink with radiation, wherein the conductive ink contains at least the following components: (a) Metallic conductive powder, wherein the average size of the of the conductive powder is less than 40 micro; (b) A photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25°C and contains at least one reactive cyclized organic compound that can undergo polymerization, such as reactive cyclized monomer or reactive cyclized oligomer. Referring to FIG. 4, which depicts a rapid manufacturing process for a conductive substrate material, wherein the radiation curable conductive ink of the present invention primarily comprises the conductive powder and the photosensitive binder. The manufacturing process adopted has the following steps: (a) Apply the metallic conductive powder; (b) Mix the conductive powder and the photosensitive binder, thereby forming the radiation curable conductive ink; (c) Print the radiation curable conductive ink onto a surface of the substrate using a screen printing method; (d) Expose the radiation curable conductive ink to radiation, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking eaction, and the conductive substrate is formed therefrom. The conductive material manufactured by the present invention using the aforementioned method has an application range including at least: radio frequency identificatior (RFID) antenna, printed-circuit boards, smart card inductive components, smart labels, printed electronics, anti- EMI (electromagnetic interference), and anti-electrostatic materials. In addition, the aforementioned step (c) in FIG 4 uses screen printing to print the radiation curable conductive ink onto the substrate, and the form of the printed lines include at least reticular form, lattice form and honeycomb form, thereby enabling the radiation to irradiate within interstices of the aforementioned forms, which increases irradiating area and enhances curable efficiency, thus achieving a substantially greater thickness. Furthermore, the radiation used in the aforementioned radiation curable conductive printing ink and manufacturing method for conductive substrate using conductive ink of the present invention is one or more than one of the following three examples of radiation: (1) Ultraviolet ray; (2) Visible light ray; (3) Electron beam. The conductive powder mixed with the photosensitive binder contains at least one photoinitiator that is able to absorb visible light within a 390- 800 mm wavelength range, wherein weight of the photoinitiator content accounts for less than 20% of the total weight of the radiation curable conductive ink. The photoinitiator can be TPO (diphenyl-(2.4.6- trimethylbenzoyl) phosphine oxide, CAS No. 75980 - 60 - 8), Ciba lrgacure-819 (Bis(2.4.6-rime!thylbenzoyl)-phenylphosphineoxide), ITX (isopropyl thioxanthone, CAS No. 5495-84-1 and 83846-86-0), CPTX (1 -Chloro-4-propoxythioxanthone 1 -chloro-4-propoxythioxanthone 1 - chloro-4-Hs propoxy-9s-thioxanthen-9-one. CAS No. 142770-42-1), EPD (ethyl 4-(dimethylamino) benzoate ethyl p-(dimethylamino) benzoate, CAS No. 10287-53-3), and so on, increasing curable efficiency therewith. The components of the aforementioned radiation curable conductive printing inks and manufacturing methods for conductive material using conductive inks of the present invention can further contain of volatile organic compound, anti-settling agent (anti-precipatant) less than 10% of the total weight or contain an organic dispersant less than 15% of the total weight. The anti-setting agent is a silicate and the organic dispersant is surfactant, therewith increasing dispersibility of the conductive powder and preventing or retarding rate of precipitation, thereby providing the conductive printing ink after undergoing radiation curable with superior electrical conductivity and electrical conducting stability. The components of the aforementioned radiation curable conductive printing inks and manufacturing methods for conductive material using conductive inks of the present invention further contain at least one coupling agent, weight content of which accounts for less than 25% of the total weight of the conductive ink, therewith enhancing material properties of the conductive ink after undergoing radiation crooslinking, thereby improving the electrical conducting stability and bonding strength with inorganic materials (such as conductive powder, glass, ceramic, and so on). The components of the aforementioned radiation curable conductive printing inks and manufacturing methods for conductive material using conductive inks of the present invention further contain an antioxidant or a metal corrosion inhibitor, weight content of which accounts for less than 5% of the total weight, therewith further improving the heat resisting property, durability and electrical conducting stability of the conductive ink, particularly when placed in environments of high temperature and high humidity or corrosive environments. The components of the aforementioned radiation curable conductive printing inks and manufacturing methods for conductive material using conductive inks of the present invention further contain 15 ppm- 5000ppm of a polymerization inhibitor. The polymerization inhibitor can be either MEHQ (monomethyl ether hydroquinone) or HQ (hydroquinone), therewith further improving storage stability. It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims. I CLAIM: 1. A radiation curable conductive ink capable of achieving chemical crosslinking reaction when irradiated with radiation, the coductive ink comprising: — a conductive ponder having a covering layer, wherein the weight of the silver content of the conductive powder before being covered with the covering layer accounts for less than 90% of the weight of the conductive powder, wherein the weight of silver content of the covering layer accounts, for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer, and wherein average size of the conductive powder is less than 40 micro, and — a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization. '2. A radiation curable conductive ink capable of achieving a chemical crusslinking reaction when irradiated with radiation, the conductive ink at least comprising: a conductive povrder having a covering layer, wherein the weight of copper content of the conductive powder before being cowered with the covering layer accounts for more than 30% of the weight of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts, for less than 8O% of the total weight of the conductive powder and the covering layers, and wherein average size of the covered conductive powder is less than 40 micro; and — a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization. 3. A radiation curable conductive ink capable of achieving a chemical crosslinking reaction when irridated with radiation, the conductive ink at least comprising: — a conductive powder having a covering layer, wherein the weight of the aluminum content of the conductive powder before covering with the covering layer accounts for more than 30% of the weight of the conductive powder before covering with the covering layer, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer, and wherein average size of the covered conductive powder is less than 40 micro; and - a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization. 4. A radiation curable conductive ink capable of achieving a chemical crosslinking reaction when irradiated with radiation, wherein the conductive ink at least comprising: — a metallic conductive powder, wherein the average size of the metal lit: conductive powder is less than 40 micro; and — a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization. 5. A manufacturing method for conductive substrate using the radiation curable ink as claimed in claim 1 comprising the following steps: — applying the conductive powder component of the radiation curable ink, wherein the weight of silver content of the conductive powder accounts for less than 90% of the weight of the conductive powder; — covering the conductive powder with the covering layer component of the radiation curable ink wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layers and the weight of the covering layer accounts for less than 80%, of the total weight of the conductive powder and the covering layer, and the conductive powder having the covering layers wherein average size of the covered conductive powder is less than 40 micro, — mixing the conductive powder including the covering layer and the photosensitive binders wherein the photo— sentitive hinder has a viscosity of less than 5,000 cps at a temperature of 25 °C and contains at least one reactive cyclized organic compound that can undergo polymerization, thereby forming the radiator durable conductive ink; — printing the ratliation curable conductive ink onto a surface of a substrate using a screen printing method* and — exposing the radiation curable conductive ink to radiat- ion* thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reactions and the conductive substrate being formed therefrom. 6. A manufacturing method for conductive substrate using the radiation curable ink as claimed in claim 2, comprising the steps of: — applying the conductive powder component of the radiat- ion curable ink, wherein the weight of copper content of the conductive powder accounts for more than 30% of the weight of the conductive powder} — covering the conductive powder with the covering layer component of the radiation curable ink, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layers and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layer* and the conductive powder having the covering layer, wherein average size of the covered conductive powder is less than 40 micro; — mixing the conductive powder including the covering layer and the photosensitive binder, wherein the photo- sensitive binder has a viscosity of less than 5,000 cps under temperature conditions at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization, thereby forming the radiation curable conductive ink: — printing the radiation curable conductive ink onto surface of the substrate using a screen printing method; and — exposing the radiation curable conductive ink to radiations thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reactions and the conductive substrate being formed therefrom. 7. A manufacturing method for conductive substrate using the radiation curable ink as claimed in claim 3, comprising the steps of: — applying the conductive powder component of the radiation curable ink, wherein the weight of aluminum content of the conductive powder accounts for more than 30% of the weight of the conductive powder; — covering the conductive powder with the covering layer component of the radiation curable ink, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layers, and the weight of the covering layer accounts for less than 80% of the total weight of the conductive powder and the covering layers, and the conductive powder having the covering layer, wherein average size of the conductive powder is less than 40 micro; — mixing the conductive powder including the covering layer and the photosensitive binder* wherein the photo- sensitive bimler has a viscosity of less than 5,000 cps at a temperature of 25 °C and contains at least one reactive cyclized organic compound that can undergo polymerization, thereby forming the radiation curable conductive ink, printing the radiation curable conductive ink onto surface of the substrate using a screen printing method 5 and exposing the radiation curable conductive ink to radiation, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction, and the conductive substrate is formed therefrom. 8. A manufacturing method for conductive substrate using the radiation curable ink as claimed in claim 4, comprising the steps of* - applying the metallic conductive powder, wherein the average size of the conductive powder is less than 40 micro; — mixing the corductive powder and a photosensitive hinder, wherein the photosensitive binder has a viscosity of lens than 5,000 cps at a temperature of 23 ºC, and contains at least one reactive cyclized mono- mer or reactive cyclized oligomer, thereby forming the radiation curable conductive ink; — printing the radiation curable conductive ink onto surface of the substrate using a screen printing method; and — exposing the radiation curable conductive ink to radiation, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction, and the conductive substrate is formed there- from. 9. The radiation curable conductive ink as claimed in claims 1 or 2, or 3 or 4, wherein the radiation used for irradiating is ultraviolet ray, visible light ray or electron bean. 10. A photosensitive binder comprising at least one photoinitiator that is able to absorb visible light within a 390-800 mm wavelength range, and wherein weight of the photo- initiator content accounts 1 or less than 20% of the total weight of the radiation curable conductive ink. 11. A photosensitive binder as claimed in claim 10, comprising at least one coupling agent* weight content of which accounts for less than 25%, of the total weight of the conductive ink. The invention relates to a radiation curable conductive ink capable of achieving chemical crosslinking reaction when irradiated with radiation, the coductive ink comprising a conductive powder having a covering layer, wherein the weight of the silver content of the conductive powder before being covered with the covering layer accounts for iess than 90% of the weight of the conductive powder, wherein the weight of silver content of the covering layer accounts for more than 30% of the weight of the covering layer, and the weight of the covering layer accounts for iess than 80% of the total weight of the conductive powder and the covering layer, and wherein average size of the conductive powder is less than 40 micro; and a photosensitive binder having a viscosity less than 5,000 cps under temperature condition at 25 ºC and contains at least one reactive cyclized organic compound that can undergo polymerization.

Full Text

RADIATION CURABLE CONDUCTIVE INK AND MANUFACTURING
METHOD FOR USING THE SAME
BACKGROUND OF THE INVENTION
(a) Field of the Invention
The present invention relates to a radiation curable conductive ink
and manufacturing method for conductive substrate using conductive
ink, which is particularly applicable for use in electronic materials,
including radio frequency identification (RFID) antenna, printed-circuit
boards, smart cards (non-contact chip cards) components, smart labels,
printed electronics, anti-electromagnetic interference (EMI) and anti-
electrostatic materials.
(b) Description of the Prior Art
The driving force of technological progress has accentuated
multifunctionality and continuous miniaturization in the design of various
electronic products. More particularly, rapid development in networking
and wireless communication in recent years has seen the perpetual
modification in a diverse range of portable electronic products, which
has altered the unlimited potentiality of 21st century modes of business.
There is an inseparable relationship between advancement in the

miniaturization of electronic products and electronic materials, for
instance, laminate type antenna are replacing traditional stem antenna,
and the lamination of printeo-circuit boards has made miniature cellular
phones available to the market. Moreover, rapid growth in radio
frequency Identification (RFID) in recent years has seen the application
of RFID in electronic money, animal chip readers, smart cards (non-
contact chip cards), smart store shopping, and so on, which have
already become an intimate part of the lives of consumers.
Although lamination of the aforementioned laminate type antenna,
printed-circuit boards and radio frequency identification systems offer
convenience of use, however, the current cost of manufacture is still
very high, with the result that many innovative products or new modes
of business are still speculative and non-viable.
Referring to FIG. 1, which shows an example of the radio frequency
identification (RFID) applied in a smart card (non-contact chip card), the
principle of which involves the transmission of signals from a chip 11 on
a smart card 10 to a reader 20 through a laminated antenna 12. An
antenna 21 of the reader 20 then receives the signals, and a
microprocessor 22 decodes the signals to form readable information.
Furthermore, the reader 20 can also deliver other data to the smart card

10, whereupon the chip 11 on the smart card 10 proceeds with writing
operations. Because the transmission method implemented is an
inductive type (using a coil resonance producing high frequency signal
induction), thus, a power supply does not need to be installed in the
smart card 10.
In principle, the aforementioned transmitting terminal of the radio
frequency identification can be configured on any type of inexpensive
product, and can even altogether replace current bar codes as used on
all types of commodities, thus bringing infinite convenience and
completely changing current lifestyle trends.
However, current technology is still unable to overcome the problem
of the high cost of radio frequency identification systems, primarily
because of the high cost of the aforementioned antenna compared,
which can cost higher than the chips.
Referring to FIG. 2, which shows the aforementioned antenna 12 of
the smart card 10 primarily structured by disposing a wound coil on a
laminated substrate 13, thereby forming the antenna 12 that is able to
transmit and receive signals. A traditional etching method is used to
dispose the wound coil onto the laminated substrate 13. However, even
mass production is unable to reduce costs because of complications in

the job program.
Hence, working procedure can be effectively reduced and savings on
costs made if a screen printing method is used to directly mount the
wound coil onto the laminated substrate. Even though current
technology has enabled the universal adoption of screen printing in the
manufacture of circuit substrate, however, the current primary use of
traditional thermal curable conductive ink containing pure silver powder
is unable to effectively reduce manufacturing costs when used on the
aforementioned radio frequency identification antenna or circuit board.
Accordingly, the inventor of the present invention has developed a
radiation curable conductive ink and a manufacturing method for
conductive substrate using the conductive ink that effectively reduces
manufacturing costs.
SUMMARY OF THE INVENTION
In an embodiment of radiation curable conductive ink the present
invention, a chemical crosslinking reaction is achieved by irradiating the
conductive ink with radiation, wherein the radiation used is either
ultraviolet ray, visible light ray electron beam or a combination of more
than one of these three different rays. The conductive ink contains at
least the following components:

(a) The conductive powder having a covering layer, wherein the
weight of the silver content of the conductive powder before
covering with the covering layer accounts for less than 90% of
the weight of the conductive powder without the covering layer;
(b) The covering layer covering surface of the conductive powder,
wherein the weight of silver content of the covering layer
accounts for more than 30% of the weight of the covering layer,
and the weight of the covering layer accounts for less than 80%
of the total weight of the conductive powder and the covering
layer;
(c) The conductive powder having the covering layer, wherein
average size of the conductive powder is less than 40 micro;
(d) A photosensitive binder having a viscosity less than 5,000 cps
under temperature condition at 25°C and contains at least one
reactive cyclized organic compound that can undergo
polymerization, such as reactive cyclized monomer or reactive
cyclized oligomer.
In another embodiment of the radiation curable conductive ink of the
present invention, a chemical crosslinking reaction is achieved by
irradiating the conductive ink with radiation, wherein the radiation used

is either ultraviolet ray, visible light ray, electron beam or a combination
of more than one of these three different rays. The conductive ink
contains at least the following components:
(a) The conductive powder having a covering layer, wherein the
weight of copper content of the conductive powder before
covering with the covering layer accounts for more than 30% of
the weight of the conductive powder without the covering layer;
(b) The covering layer covering surface of the conductive powder,
wherein the weight of silver content of the covering layer
accounts for more than 30% of the weight of the covering layer,
and the weight of the covering layer accounts for less than 80%
of the total weight of the conductive powder and the covering
layer;
(c) The conductive powder having the covering layer, wherein
average size of the conductive powder is less than 40 micro;
(d) The photosensitive binder having a viscosity less than 5,000 cps
under temperature concition at 25°C and contains at least one
reactive cyclized organic compound that can undergo
polymerization , such as reactive cyclized monomer or reactive
cyclized oligomer.

In another embodiment of the radiation curable conductive ink of the
present invention, a chemical crosslinking reaction is achieved by
irradiating the conductive ink with radiation, wherein the radiation used
is either ultraviolet ray, visible light ray, electron beam or a combination
of more than one of these three different rays. The conductive ink
contains at least the following components:
(a) The conductive powder having a covering layer, wherein the
weight of aluminum content of the conductive powder before
covering with the covering layer accounts for more than 30% of
the weight of the conductive powder without the covering layer;
(b) The covering layer covering surface of the conductive powder,
wherein the weight of silver content of the covering layer accounts
for more than 30% of the weight of the covering layer, and the
weight of the covering layer accounts for less than 80% of the
total weight of the conductive powder and the covering layer;
(c) The conductive powder having the covering layer, wherein
average size of the conductive powder is less than 40 micro;
(d) The photosensitive binder having a viscosity less than 5,000 cps
under temperature condition at 25°C and contains at least one
reactive cyclized crganic compound that can undergo

polymerization , such as reactive cyclized monomer or reactive
cyclized oligomer.
In another embodiment of the radiation curable conductive ink of the
present invention, a chemical crosslinking reaction is achieved by
irradiating the conductive ink with radiation, wherein the radiation used
is either ultraviolet ray, visible light ray, electron beam or a combination
of more than one of these three different rays. The conductive ink
contains at least the following components:
(a) Metallic conductive powder, wherein the average size of the of the
conductive powder is less than 40 micro;
(b) A photosensitive binder having a viscosity less than 5,000 cps
under temperature condition at 25°C and contains at least one
reactive cyclized organic compound that can undergo
polymerization , such as reactive cyclized monomer or reactive
cyclized oligomer.
A manufacturing method tor conductive substrate using screen
printing is realized using the aforementioned components of the
radiation curable conductive ink of the present invention, thereby
foreshortening working procedure and reducing cost, wherein method
adopted is disclosed below:

The manufacturing method for conductive substrate comprises the
following steps:
(a) Apply the conductive powder, wherein weight of silver content of
the conductive powder accounts for less than 90% of the weight
of the conductive powder;
(b) Cover the conductive powder with the covering layer, wherein the
weight of silver content of the covering layer accounts for more
than 30% of the weight of the covering layer, and the weight of
the covering layer accounts for less than 80% of the total weight
of the conductive powder and the covering layer, and the
conductive powder having the covering layer, wherein average
size of the conductive powder is less than 40 micro;
(c) Mix the conductive powder having the covering layer and the
photosensitive binder, wherein the photosensitive binder has a
viscosity of less than 5,000 cps at a temperature of 25°C and
contains at least one reactive cyclized organic compound that can
undergo polymerization ,such as reactive cyclized monomer or
reactive cyclized oligorrer, thereby forming the radiation curable
conductive ink;
(d) Print the radiation curable conductive ink onto a surface of a

substrate using a screen printing method;
(e) Expose the radiation curable conductive ink to radiation, wherein
the radiation used is either ultraviolet ray, visible light ray,
electron beam or a combination of more than one of these three
different rays, thereby causing the radiation curable conductive
ink to undergo a chemical crosslinking reaction, and the
conductive substrate is formed therefrom.
A manufacturing method for conductive substrate using the radiation
curable conductive ink comprises the following steps:
(a) Apply the conductive powder, wherein weight of copper content of
the conductive powder accounts for more than 30% of the weight
of the conductive powder;
(b) Cover the conductive pcwder with the covering layer, wherein the
weight of silver content of the covering layer accounts for more
than 30% of the weight of the covering layer, and the weight of
the covering layer accounts for less than 80% of the total weight
of the conductive powder and the covering layer, and the
conductive powder having the covering layer, wherein average
size of the conductive powder is less than 40 micro;
(c) Mix the conductive powder having the covering layer and the

photosensitive binder, wherein the photosensitive binder has a
viscosity of less than 5,000 cps at a temperature of 25°C and at
least one reactive cyclized organic compound that can undergo
polymerization , such as reactive cyclized monomer or reactive
cyclized oligomer, thereby forming the radiation curable conductive
ink;
(d) Print the radiation cunable conductive ink onto a surface of the
substrate using a screen printing method;
(e) Expose the radiation curable conductive ink to radiation, wherein
the radiation used is either ultraviolet ray, visible light ray, electron
beam or a combination of more than one of these three different
rays, thereby causing the radiation curable conductive ink to
undergo a chemical crosslinking reaction, and the conductive
substrate is formed therefrom.
A manufacturing method for conductive substrate using the radiation
curable conductive ink comprises the following steps:
(a) Apply the conductive powder, wherein weight of aluminum content
of the conductive powder accounts for more than 30% of the
weight of the conductive powder;
(b) Cover the conductive powder with the covering layer, wherein the

weight of silver content of the covering layer accounts for more
than 30% of the weight of the covering layer, and the weight of
the covering layer accounts for less than 80% of the total weight
of the conductive powder and the covering layer, and the
conductive powder having the covering layer, wherein average
size of the conductive powder is less than 40 micro;
(c) Mix the conductive powder having the covering layer and the
photosensitive binder, wherein the photosensitive binder has a
viscosity of less than 5,000 cps at a temperature of 25°C and
contains at least one reactive cyclized organic compound that
can undergo polymerization , such as reactive cyclized monomer
or reactive cyclized oligomer, thereby forming the radiation
curable conductive ink;
(d) Print the radiation curable conductive ink onto a surface of the
substrate using a screen printing method;
(e) Expose the radiation curable conductive ink to radiation, wherein
the radiation used is either ultraviolet ray, visible light ray,
electron beam or a combination of more than one of these three
different rays, thereby causing the radiation curable conductive
ink to undergo a chemical crosslinking reaction, and the

conductive substrate is formed therefrom.
A manufacturing method for conductive substrate using the radiation
curable conductive ink comprises the following steps:
(a) Apply the metallic conductive powder, wherein the average size of
the of the conductive powder is less than 40 micro;
(b) A photosensitive binder having a viscosity less than 5,000 cps
under temperature condition at 25°C and contains at least one
reactive cyclized organic compound that can undergo
polymerization , such as reactive cyclized monomer or reactive
cyclized oligomer;
(c) Mix the conductive pov/der and the aforementioned photosensitive
binder, thereby forming the radiation curable conductive ink;
(d) Print the radiation curable conductive ink onto a surface of the
substrate using a screen printing method;
(e) Expose the radiation curable conductive ink to radiation, wherein
the radiation used is either ultraviolet ray, visible light ray,
electron beam or a combination of more than one of these three
different rays, thereby causing the radiation curable conductive
ink to undergo a chemical crosslinking reaction, and the
conductive substrate is formed therefrom.

A manufacturing method for conductive substrate using screen
printing is realized usinc the aforementioned radiation curable
conductive ink of the present invention and the method of using
conductive ink to manufacture the conductive substrate, thereby
achieving objectives of foreshortening working procedure and reducing
cost. The method is particularly applicable for applications in radio
frequency identification RFID antenna, printed-circuit boards, smart
cards (non-contact chip cards) component members, smart labels,
printed electronics, anti-EMI and anti-static materials.
Furthermore, the radiation curable conductive ink mixed with the
aforementioned components undergoes a chemical crooslinking
reaction that generally occurs within a few seconds compared to
between 3 minutes to 2 hours and a temperature around 80°C - 220°C
needed by general thermal curable resins (for example: thermal curable
type epoxy resin and polyester resin), thereby providing the present
invention with advantages of raoid curable and energy savings.
After the conductive powder applied by combining properties of the
aforementioned materials has undergone radiation crosslinking, apart
from having the advantage of rapid curing speed, moreover, the
resulting conductive substrate is provided with superior electrical

conductivity and resistance to oxidation.
In addition, because of a light-screening effect and high specific
gravity of the conductive powder, rapid sedimentation of the metallic
powder easily causes, which makes it difficult for the radiation curable
conductive ink to achieve an ideal degree of cure. Moreover, it is difficult
for the metallic powder to be uniformly dispersed and achieve a
substantially thick conductive ink.
The present invention has made improvements that resolve the
aforementioned shortcomings, and enables the radiation curable
conductive ink to undergo a rapid and curing reaction that achieves
favorable metallic powder dispersibility and superior electrical
conductivity, as well as superior electrical conductivity stability,
resistance to oxidation and low cost.
To enable a further understanding of said objectives and the
technological methods of the invention herein, brief description of the
drawings is provided below fallowed by detailed description of the
preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a schematic view of an application of a radio frequency
identification system in a smart card according to prior art.

FIG. 2 shows a structural schematic view depicting a radio frequency
identification within a smart card according to prior art.
FIG. 3 shows a flow diagram of a manufacturing method for
conductive substrate using radiation curable conductive ink according to
the present invention.
FIG. 4 shows another flow diagram of manufacturing method of
conductive substrate using radiation curable conductive ink according to
the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
A radiation curable conductive ink of the present invention undergoes
a chemical crosslinking reaction by irradiating conductive ink with
radiation, wherein the conductive ink contains at least the following
components:
(a) Conductive powder having a covering layer, wherein the weight of
the silver content of the conductive powder before covering with
the covering layer having less than 90% by weight of silver
content, more than 30% by weight of copper or more than 30% by
weight of aluminum;
(b) The covering layer covering surface of the conductive powder,
wherein weight of silver content of the covering layer accounts for

more than 30% of the weight of the covering layer, and the
weight of the covering layer accounts for less than 80% of the
total weight of the conductive powder and the covering layer;
(c) The conductive powder having the covering layer, wherein
average size of conductive powder is less than 40 micro;
(d) A photosensitive binder having a viscosity less than 5,000 cps
under temperature conditions at 25° and contains at least one
reactive cyclized organic compound that can undergo
polymerization, such as reactive cyclized monomer or reactive
cyclized oligomer.
Referring to FIG. 3, which depicts a rapid manufacturing process for a
conductive substrate material, wherein the radiation curable conductive
ink of the present invention primarily comprises the conductive powder
having the covering layer and the photosensitive binder. The
manufacturing process adopted has the following steps:
(a) Apply the conductive powder;
(b) Cover the conductive powder with the covering layer, wherein
weight of silver content of the covering layer accounts for more
than 30% of the weight of the covering layer, and the weight of
the covering layer accou its for less than 80% of the total weight

of the conductive powder and the covering layer;
(c) Mix the conductive powder having the covering layer and the
photosensitive binder, wherein the photosensitive binder has a
viscosity of less than 5,000 cps at a temperature of 25°C, thereby
forming the radiation curable conductive ink;
(d) Print the radiation curable conductive ink onto a surface of the
substrate using a screen printing method;
(e) Expose the radiation curable conductive ink to radiation, thereby
causing the radiation curable conductive ink to undergo a
chemical crosslinking leaction, and the conductive substrate is
formed therefrom.
The conductive material manufactured by the present invention using
the aforementioned method has an application range including at least
radio frequency identification (RFID) antenna, printed-circuit boards,
smart card inductive components, smart labels, printed electronics, anti-
EMI (electromagnetic interference), and anti-electrostatic materials.
In addition, the aforementioned step (d) in FIG 3 uses screen printing
to print the radiation curable conductive ink onto the substrate, and the
form of the printed lines include at least reticular form, lattice form and
honeycomb form, thereby enabling the radiation to irradiate within

interstices of the aforementioned forms, which increases irradiating area
and enhances curable efficiency, thus achieving a substantially greater
thickness.
Furthermore, the radiation used in the aforementioned radiation
curable conductive printing ink and manufacturing method for
conductive substrate using conductive ink of the present invention is
one or more than one of the following three examples of radiation:
(1) Ultraviolet ray;
(2) Visible light ray;
(3) Electron beam.
The conductive powder within the components of the aforementioned
radiation curable conductive printing ink and manufacturing method for
conductive substrate using conductive ink of the present invention
contains silver, copper or aluminum, content of which is one or more
than one of the following three embodiments:
(1) The weight of silver content of the conductive powder before
covering with a covering layer accounts for less than 90% of the
weight of the conductive powder without the covering layer;
(2) The weight of copper ccntent of the conductive powder before
covering with a covering ayer accounts for more than 30% of the

weight of the conductive powder without the covering layer;
(3) The weight of aluminum content of the conductive powder before
covering with a covering layer accounts for more than 30% of the
weight of the conductive powder without the covering layer.
The aforementioned conductive powder with covering layer, wherein
average size of the conductive powder is less than 40 micro.
The conductive powder having the covering layer mixed with the
photosensitive binder, wherein, the photosensitive binder contains at
least one reactive cyclizec organic compound that can undergo
polymerization , such as reactive cyclized monomer or reactive cyclized
oligomer, and in addition, the photosensitive binders contains at least
one photoinitiator that is able to absorb visible light within a 390-800 mm
wavelength range, wherein weight of the photoinitiator content accounts
for less than 20% of the total weight of the radiation curable conductive
ink. The photoinitiator can be TPO (diphenyl-(2.4.6-trimethylbenzoyl)
phosphine oxide, CAS No. 75980 - 60 - 8), Ciba lrgacure-819
(Bis(2,4,6-rimethylbenzoyl)-phenylphosphineoxide), ITX (isopropyl
thioxanthone, CAS No. 5495-34-1 and 83846-86-0), CPTX (1-Chloro-4-
propoxythioxanthone 1 -chlo o-4-propoxythioxanthone 1 -chloro-4-Hs
propoxy-9s-thioxanthen-9-one CAS No. 142770-42-1), EPD (ethyl 4-

(dimethylamino) benzoate ethyl p-(dimethylamino) benzoate, CAS
No. 10287-53-3), and so on, increasing curable efficiency therewith.
In another embodiment of the radiation curable conductive ink of the
present invention, a radiation curable conductive ink of the present
invention undergoes a chemical crosslinking reaction by irradiating
conductive ink with radiation, wherein the conductive ink contains at
least the following components:
(a) Metallic conductive powder, wherein the average size of the of the
conductive powder is less than 40 micro;
(b) A photosensitive binder having a viscosity less than 5,000 cps
under temperature condition at 25°C and contains at least one
reactive cyclized organic compound that can undergo
polymerization, such as reactive cyclized monomer or reactive
cyclized oligomer.
Referring to FIG. 4, which depicts a rapid manufacturing process for a
conductive substrate material, wherein the radiation curable conductive
ink of the present invention primarily comprises the conductive powder
and the photosensitive binder. The manufacturing process adopted has
the following steps:
(a) Apply the metallic conductive powder;

(b) Mix the conductive powder and the photosensitive binder, thereby
forming the radiation curable conductive ink;
(c) Print the radiation curable conductive ink onto a surface of the
substrate using a screen printing method;
(d) Expose the radiation curable conductive ink to radiation, thereby
causing the radiation curable conductive ink to undergo a
chemical crosslinking eaction, and the conductive substrate is
formed therefrom.
The conductive material manufactured by the present invention using
the aforementioned method has an application range including at least:
radio frequency identificatior (RFID) antenna, printed-circuit boards,
smart card inductive components, smart labels, printed electronics, anti-
EMI (electromagnetic interference), and anti-electrostatic materials.
In addition, the aforementioned step (c) in FIG 4 uses screen printing
to print the radiation curable conductive ink onto the substrate, and the
form of the printed lines include at least reticular form, lattice form and
honeycomb form, thereby enabling the radiation to irradiate within
interstices of the aforementioned forms, which increases irradiating area
and enhances curable efficiency, thus achieving a substantially greater
thickness.

Furthermore, the radiation used in the aforementioned radiation
curable conductive printing ink and manufacturing method for
conductive substrate using conductive ink of the present invention is
one or more than one of the following three examples of radiation:
(1) Ultraviolet ray;
(2) Visible light ray;
(3) Electron beam.
The conductive powder mixed with the photosensitive binder contains
at least one photoinitiator that is able to absorb visible light within a 390-
800 mm wavelength range, wherein weight of the photoinitiator content
accounts for less than 20% of the total weight of the radiation curable
conductive ink. The photoinitiator can be TPO (diphenyl-(2.4.6-
trimethylbenzoyl) phosphine oxide, CAS No. 75980 - 60 - 8), Ciba
lrgacure-819 (Bis(2.4.6-rime!thylbenzoyl)-phenylphosphineoxide), ITX
(isopropyl thioxanthone, CA*S No. 5495-84-1 and 83846-86-0), CPTX
(1 -Chloro-4-propoxythioxanthone 1 -chloro-4-propoxythioxanthone 1 -
chloro-4-Hs propoxy-9s-thioxanthen-9-one. CAS No. 142770-42-1),
EPD (ethyl 4-(dimethylamino) benzoate ethyl p-(dimethylamino)
benzoate, CAS No. 10287-53-3), and so on, increasing curable
efficiency therewith.

The components of the aforementioned radiation curable conductive
printing inks and manufacturing methods for conductive material using
conductive inks of the present invention can further contain of volatile
organic compound, anti-settling agent (anti-precipatant) less than 10%
of the total weight or contain an organic dispersant less than 15% of the
total weight. The anti-setting agent is a silicate and the organic
dispersant is surfactant, therewith increasing dispersibility of the
conductive powder and preventing or retarding rate of precipitation,
thereby providing the conductive printing ink after undergoing radiation
curable with superior electrical conductivity and electrical conducting
stability.
The components of the aforementioned radiation curable conductive
printing inks and manufacturing methods for conductive material using
conductive inks of the present invention further contain at least one
coupling agent, weight content of which accounts for less than 25% of
the total weight of the conductive ink, therewith enhancing material
properties of the conductive ink after undergoing radiation crooslinking,
thereby improving the electrical conducting stability and bonding
strength with inorganic materials (such as conductive powder, glass,
ceramic, and so on).

The components of the aforementioned radiation curable conductive
printing inks and manufacturing methods for conductive material using
conductive inks of the present invention further contain an antioxidant or
a metal corrosion inhibitor, weight content of which accounts for less
than 5% of the total weight, therewith further improving the heat
resisting property, durability and electrical conducting stability of the
conductive ink, particularly when placed in environments of high
temperature and high humidity or corrosive environments.
The components of the aforementioned radiation curable conductive
printing inks and manufacturing methods for conductive material using
conductive inks of the present invention further contain 15 ppm-
5000ppm of a polymerization inhibitor. The polymerization inhibitor can
be either MEHQ (monomethyl ether hydroquinone) or HQ
(hydroquinone), therewith further improving storage stability.
It is of course to be understood that the embodiments described
herein are merely illustrative of the principles of the invention and that a
wide variety of modifications thereto may be effected by persons skilled
in the art without departing from the spirit and scope of the invention as
set forth in the following claims.

I CLAIM:
1. A radiation curable conductive ink capable of
achieving chemical crosslinking reaction when irradiated with
radiation, the coductive ink comprising:
— a conductive ponder having a covering layer, wherein
the weight of the silver content of the conductive
powder before being covered with the covering layer
accounts for less than 90% of the weight of the
conductive powder, wherein the weight of silver
content of the covering layer accounts, for more than
30% of the weight of the covering layer, and the
weight of the covering layer accounts for less than
80% of the total weight of the conductive powder and
the covering layer, and wherein average size of the
conductive powder is less than 40 micro, and
— a photosensitive binder having a viscosity less than
5,000 cps under temperature condition at 25 ºC and
contains at least one reactive cyclized organic
compound that can undergo polymerization.

'2. A radiation curable conductive ink capable of
achieving a chemical crusslinking reaction when irradiated with
radiation, the conductive ink at least comprising:
a conductive povrder having a covering layer, wherein
the weight of copper content of the conductive powder
before being cowered with the covering layer accounts
for more than 30% of the weight of the conductive
powder, wherein the weight of silver content of the
covering layer accounts for more than 30% of the weight
of the covering layer, and the weight of the covering
layer accounts, for less than 8O% of the total weight of
the conductive powder and the covering layers, and
wherein average size of the covered conductive powder
is less than 40 micro; and
— a photosensitive binder having a viscosity less than
5,000 cps under temperature condition at 25 ºC and
contains at least one reactive cyclized organic
compound that can undergo polymerization.

3. A radiation curable conductive ink capable of
achieving a chemical crosslinking reaction when irridated with
radiation, the conductive ink at least comprising:
— a conductive powder having a covering layer, wherein
the weight of the aluminum content of the conductive
powder before covering with the covering layer
accounts for more than 30% of the weight of the
conductive powder before covering with the covering
layer, wherein the weight of silver content of the
covering layer accounts for more than 30% of the
weight of the covering layer, and the weight of the
covering layer accounts for less than 80% of the
total weight of the conductive powder and the covering
layer, and wherein average size of the covered
conductive powder is less than 40 micro; and
- a photosensitive binder having a viscosity less than
5,000 cps under temperature condition at 25 ºC and
contains at least one reactive cyclized organic
compound that can undergo polymerization.

4. A radiation curable conductive ink capable of
achieving a chemical crosslinking reaction when irradiated with
radiation, wherein the conductive ink at least comprising:
— a metallic conductive powder, wherein the average size
of the metal lit: conductive powder is less than 40
micro; and
— a photosensitive binder having a viscosity less than
5,000 cps under temperature condition at 25 ºC and
contains at least one reactive cyclized organic
compound that can undergo polymerization.
5. A manufacturing method for conductive substrate
using the radiation curable ink as claimed in claim 1 comprising
the following steps:
— applying the conductive powder component of the
radiation curable ink, wherein the weight of silver
content of the conductive powder accounts for less
than 90% of the weight of the conductive powder;

— covering the conductive powder with the covering layer
component of the radiation curable ink* wherein the
weight of silver content of the covering layer accounts
for more than 30% of the weight of the covering layers
and the weight of the covering layer accounts for less
than 80%, of the total weight of the conductive powder
and the covering layer, and the conductive powder
having the covering layers wherein average size of the
covered conductive powder is less than 40 micro,
— mixing the conductive powder including the covering
layer and the photosensitive binders wherein the photo—
sentitive hinder has a viscosity of less than 5,000 cps
at a temperature of 25 °C and contains at least one
reactive cyclized organic compound that can undergo
polymerization, thereby forming the radiator durable
conductive ink;
— printing the ratliation curable conductive ink onto a
surface of a substrate using a screen printing method*
and

— exposing the radiation curable conductive ink to radiat-
ion* thereby causing the radiation curable conductive
ink to undergo a chemical crosslinking reactions and the
conductive substrate being formed therefrom.
6. A manufacturing method for conductive substrate
using the radiation curable ink as claimed in claim 2, comprising
the steps of:
— applying the conductive powder component of the radiat-
ion curable ink, wherein the weight of copper content
of the conductive powder accounts for more than 30% of
the weight of the conductive powder}
— covering the conductive powder with the covering layer
component of the radiation curable ink, wherein the
weight of silver content of the covering layer accounts
for more than 30% of the weight of the covering layers
and the weight of the covering layer accounts for less
than 80% of the total weight of the conductive powder

and the covering layer* and the conductive powder
having the covering layer, wherein average size of the
covered conductive powder is less than 40 micro;
— mixing the conductive powder including the covering
layer and the photosensitive binder, wherein the photo-
sensitive binder has a viscosity of less than 5,000 cps
under temperature conditions at 25 ºC and contains at
least one reactive cyclized organic compound that can
undergo polymerization, thereby forming the radiation
curable conductive ink:
— printing the radiation curable conductive ink onto
surface of the substrate using a screen printing
method; and
— exposing the radiation curable conductive ink to
radiations thereby causing the radiation curable
conductive ink to undergo a chemical crosslinking
reactions and the conductive substrate being formed
therefrom.

7. A manufacturing method for conductive substrate
using the radiation curable ink as claimed in claim 3, comprising
the steps of:
— applying the conductive powder component of the
radiation curable ink, wherein the weight of aluminum
content of the conductive powder accounts for more than
30% of the weight of the conductive powder;
— covering the conductive powder with the covering layer
component of the radiation curable ink, wherein the
weight of silver content of the covering layer accounts
for more than 30% of the weight of the covering layers,
and the weight of the covering layer accounts for less
than 80% of the total weight of the conductive powder
and the covering layers, and the conductive powder having
the covering layer, wherein average size of the
conductive powder is less than 40 micro;
— mixing the conductive powder including the covering
layer and the photosensitive binder* wherein the photo-
sensitive bimler has a viscosity of less than 5,000 cps

at a temperature of 25 °C and contains at least one
reactive cyclized organic compound that can undergo
polymerization, thereby forming the radiation curable
conductive ink,
printing the radiation curable conductive ink onto
surface of the substrate using a screen printing
method 5 and
exposing the radiation curable conductive ink to
radiation, thereby causing the radiation curable
conductive ink to undergo a chemical crosslinking
reaction, and the conductive substrate is formed
therefrom.
8. A manufacturing method for conductive substrate
using the radiation curable ink as claimed in claim 4, comprising
the steps of*
- applying the metallic conductive powder, wherein the
average size of the conductive powder is less than 40
micro;

— mixing the corductive powder and a photosensitive
hinder, wherein the photosensitive binder has a
viscosity of lens than 5,000 cps at a temperature of
23 ºC, and contains at least one reactive cyclized mono-
mer or reactive cyclized oligomer, thereby forming the
radiation curable conductive ink;
— printing the radiation curable conductive ink onto
surface of the substrate using a screen printing
method; and
— exposing the radiation curable conductive ink to
radiation, thereby causing the radiation curable
conductive ink to undergo a chemical crosslinking
reaction, and the conductive substrate is formed there-
from.
9. The radiation curable conductive ink as claimed in
claims 1 or 2, or 3 or 4, wherein the radiation used for
irradiating is ultraviolet ray, visible light ray or electron
bean.

10. A photosensitive binder comprising at least one
photoinitiator that is able to absorb visible light within
a 390-800 mm wavelength range, and wherein weight of the photo-
initiator content accounts 1 or less than 20% of the total weight
of the radiation curable conductive ink.
11. A photosensitive binder as claimed in claim 10,
comprising at least one coupling agent* weight content of which
accounts for less than 25%, of the total weight of the conductive
ink.

The invention relates to a radiation curable conductive ink
capable of achieving chemical crosslinking reaction when
irradiated with radiation, the coductive ink comprising a
conductive powder having a covering layer, wherein the weight
of the silver content of the conductive powder before being
covered with the covering layer accounts for iess than 90% of
the weight of the conductive powder, wherein the weight of
silver content of the covering layer accounts for more than 30%
of the weight of the covering layer, and the weight of the
covering layer accounts for iess than 80% of the total weight of
the conductive powder and the covering layer, and wherein average
size of the conductive powder is less than 40 micro; and a photosensitive
binder having a viscosity less than 5,000 cps under
temperature condition at 25 ºC and contains at least one
reactive cyclized organic compound that can undergo polymerization.

Documents:

2-kol-2006-granted-abstract.pdf

2-kol-2006-granted-claims.pdf

2-kol-2006-granted-correspondence.pdf

2-kol-2006-granted-description (complete).pdf

2-kol-2006-granted-drawings.pdf

2-kol-2006-granted-examination report.pdf

2-kol-2006-granted-form 1.pdf

2-kol-2006-granted-form 18.pdf

2-kol-2006-granted-form 2.pdf

2-kol-2006-granted-form 26.pdf

2-kol-2006-granted-form 3.pdf

2-kol-2006-granted-reply to examination report.pdf

2-kol-2006-granted-specification.pdf

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Patent Number

231735

Indian Patent Application Number

2/KOL/2006

PG Journal Number

11/2009

Publication Date

13-Mar-2009

Grant Date

09-Mar-2009

Date of Filing

02-Jan-2006

Name of Patentee

YUNG-SHU YANG

Applicant Address

TAIWAN R.O.C. NO. 3, LANE 441, SEC 6, JHONGSHAN N. RD. SHILIN DIST, TAIPEI CITY

Inventors:

#	Inventor's Name	Inventor's Address
1	YUNG-SHU YANG	TAIWAN R.O.C. NO. 3, LANE 441, SEC 6, JHONGSHAN N. RD. SHILIN DIST, TAIPEI CITY 111

PCT International Classification Number

C08F 2/46

PCT International Application Number

N/A

PCT International Filing date

PCT Conventions:

#	PCT Application Number	Date of Convention	Priority Country
1			NA