Title of Invention

A METHOD FOR THE ELECTRICAL CONDUCTIVE CONNECTION OF AT LEAST TWO WIRES PROVIDED WITH AN INSULATING LACQUER BY EFFECT OF ULTRASOUND

Abstract N/A
Full Text

Documents:

108-kolnp-2005-granted-abstract.pdf

108-kolnp-2005-granted-claims.pdf

108-kolnp-2005-granted-correspondence.pdf

108-kolnp-2005-granted-description (complete).pdf

108-kolnp-2005-granted-drawings.pdf

108-kolnp-2005-granted-examination report.pdf

108-kolnp-2005-granted-form 1.pdf

108-kolnp-2005-granted-form 18.pdf

108-kolnp-2005-granted-form 2.pdf

108-kolnp-2005-granted-form 26.pdf

108-kolnp-2005-granted-form 3.pdf

108-kolnp-2005-granted-form 5.pdf

108-kolnp-2005-granted-reply to examination report.pdf

108-kolnp-2005-granted-specification.pdf

108-kolnp-2005-granted-translated copy of priority document.pdf


Patent Number 233766
Indian Patent Application Number 108/KOLNP/2005
PG Journal Number 15/2099
Publication Date 10-Apr-2009
Grant Date 08-Apr-2009
Date of Filing 31-Jan-2005
Name of Patentee STAPLA ULTRASCHALLTECHNIK GMBH
Applicant Address AM SUDPARK 7C, 65451 KELSTERBACH
Inventors:
# Inventor's Name Inventor's Address
1 STAPEL ANTON LUDWIGSTR. 13, 63773 GOLDBACH
PCT International Classification Number H01R 43/02
PCT International Application Number PCT/EP2003/006915
PCT International Filing date 2003-06-30
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 102 29 565.4 2002-07-01 Germany