| Title of Invention | A SUPERCONDUCTING ARTICLE AND A METHOD FOR FORMING A SUPERCONDUCTING ARTICLE |
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| Abstract | A superconducting tape is disclosed, including a substrate, a buffer layer overlying the substrate, a superconductor layer overlying the buffer layer, and an electroplated stabilizer layer overlying the superconductor layer. Also disclosed are components incorporating superconducting tapes, methods for manufacturing same, and methods for using same. |
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3552-CHENP-2005 CORRESPONDENCE OTHERS.pdf
3552-CHENP-2005 CORRESPONDENCE PO.pdf
3552-CHENP-2005 POWER OF ATTORNEY.pdf
| Patent Number | 234190 | |||||||||
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| Indian Patent Application Number | 3552/CHENP/2005 | |||||||||
| PG Journal Number | 24/2009 | |||||||||
| Publication Date | 12-Jun-2009 | |||||||||
| Grant Date | 08-May-2009 | |||||||||
| Date of Filing | 27-Dec-2005 | |||||||||
| Name of Patentee | SUPERPOWER, INC | |||||||||
| Applicant Address | 450 DUANE AVENUE, SCHENECTADY, NY 12304, | |||||||||
Inventors:
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| PCT International Classification Number | H01L | |||||||||
| PCT International Application Number | PCT/US04/20558 | |||||||||
| PCT International Filing date | 2004-06-25 | |||||||||
PCT Conventions:
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