| Title of Invention | A LEAD FREE SOLDER INTERCONNECT STRUCTURE FOR ELECTRONIC PACKAGE INTERCONNECTIONS |
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| Abstract | A lead free solder hierarchy struct1;lre for electronic packaging that includes organic interposers (50). The assembly may also contain passive components (100) as well as underfill material (80). The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink (75) to the circuit chip (10) with a suitable lead free solder alloy. |
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3131-chenp-2005 complete specification as granted.pdf
3131-CHENP-2005 CORRESPONDENCE OTHERS.pdf
3131-CHENP-2005 CORRESPONDENCE PO.pdf
3131-CHENP-2005 DESCRIPTION (COMPLETE).pdf
3131-CHENP-2005 POWER OF ATTORNEY.pdf
| Patent Number | 234192 | |||||||||
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| Indian Patent Application Number | 3131/CHENP/2005 | |||||||||
| PG Journal Number | 24/2009 | |||||||||
| Publication Date | 12-Jun-2009 | |||||||||
| Grant Date | 08-May-2009 | |||||||||
| Date of Filing | 24-Nov-2005 | |||||||||
| Name of Patentee | INTERNATIONAL BUSINESS MACHINES CORPORATION | |||||||||
| Applicant Address | ARMONK, NEW YORK 10504, | |||||||||
Inventors:
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| PCT International Classification Number | H01L 23/48 | |||||||||
| PCT International Application Number | PCT/US03/37952 | |||||||||
| PCT International Filing date | 2003-11-25 | |||||||||
PCT Conventions:
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