Title of Invention | MOLECULAR ELECTRONIC DEVICE USING METAL-METAL BONDED COMPLEXES |
---|---|
Abstract | The present invention provides a molecular device including a source region and a drain region, a molecular medium extending there between, and an electrically insulating layer between the source region, the drain region and the molecular medium. The molecular medium in the molecular device of present invention is a thin film having alternating monolayer of a metal-metal bonded complex monolayer and an organic monolayer. |
Full Text |
---|
2185-CHENP-2004 AMENDED CLAIMS 21-10-2011.pdf
2185-CHENP-2004 ASSIGNMENT 07-10-2011.pdf
2185-CHENP-2004 CORRESPONDENCE OTHERS 21-10-2011.pdf
2185-chenp-2004 correspondence others 24-12-2010.pdf
2185-CHENP-2004 FORM-1 21-10-2011.pdf
2185-CHENP-2004 OTHER PATENT DOCUMENT 07-10-2011.pdf
2185-CHENP-2004 OTHER PATENT DOCUMENT 1 07-10-2011.pdf
2185-CHENP-2004 AMENDED PAGES OF SPECIFICATION 07-10-2011.pdf
2185-CHENP-2004 AMENDED CLAIMS 07-10-2011.pdf
2185-CHENP-2004 CORRESPONDENCE OTHERS.pdf
2185-CHENP-2004 CORRESPONDENCE PO.pdf
2185-CHENP-2004 DESCRIPTION (COMPLETE).pdf
2185-CHENP-2004 EXAMINATION REPORT REPLY RECEIVED 07-10-2011.pdf
2185-CHENP-2004 FORM-3 07-10-2011.pdf
2185-CHENP-2004 POWER OF ATTORNEY 07-10-2011.pdf
Patent Number | 250310 | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
Indian Patent Application Number | 2185/CHENP/2004 | |||||||||
PG Journal Number | 52/2011 | |||||||||
Publication Date | 30-Dec-2011 | |||||||||
Grant Date | 22-Dec-2011 | |||||||||
Date of Filing | 30-Sep-2004 | |||||||||
Name of Patentee | INTERNATIONAL BUSINESS MACHINES CORPORATION | |||||||||
Applicant Address | New Orchard Road, Armonk, NY 10504. | |||||||||
Inventors:
|
||||||||||
PCT International Classification Number | G06N1/00 | |||||||||
PCT International Application Number | PCT/US2003/009566 | |||||||||
PCT International Filing date | 2003-03-27 | |||||||||
PCT Conventions:
|