Title of Invention | TEMPERABLE GLASS COATING |
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Abstract | The invention relates to a silver low-E coating for glass which is temperable and can be applied by means of sputter processes onto the glass. The individual layers of the coating are cost-effective standard materials. One embodiment of the invention for example is comprised of a glass substrate, an Si3N4 layer disposed thereon of a thickness of approximately 15 nm, a TiO2 layer of 15nm thickness on the Si3N4 layer, a 12.5 nm thick Ag layer on the TiO2 layer, a NiCrOx layer of approximately 5 nm thickness on the Ag layer and a terminating 45 nm thick Si3N4 layer. |
Full Text | FORM 2 THE PATENT ACT 1970 (39 of 1970) & The Patents Rules, 2003 COMPLETE SPECIFICATION (See Section 10, and rule 13) 1. TITLE OF INVENTION TEMPERABLE GLASS COATING 2. APPLICANT(S) a) Name b) Nationality c) Address APPLIED MATERIALS, INC. AMERICAN Company 3 050 BOWERS AVENUE SANTA CLARA, CALIFORNIA 95054, U.S.A. 3. PREAMBLE TO THE DESCRIPTION The following specification particularly describes the invention and the manner in which it is to be performed : - Specification The invention relates to a temperable glass coating according to the preamble of patent claim 1. Coatings on transparent glass or transparent synthetic material serve to reflect or absorb specific wavelengths or wavelength ranges of incident light. Known are coatings on optical lenses and on window panes, also referred to as architectural glass, as well as the coatings on motor vehicle window panes. The most important function of a coating on architectural glass is the reflection of thermal radiation in order for a room not to become too warm during the summer and not too cool during the winter. In the process the visible light is to be minimally weakened, i.e. the coating should have high transmission in the visible range (approximately 400 nm to 700 nm under daylight vision and approximately 390 nm to 650 nm under night vision) and high reflection for thermal and infrared radiation (wavelength > 700 nm). Layer systems fulfilling this function are referred to as low-E layer systems, "E" representing emissivity (= degree of emission or emission capability). This is intended to express that these layer systems only output low thermal radiation from a building room to the outside. As a rule, heat regulation is attained thereby that onto glass electrically high-conducting layers are applied, frequently comprising a metal such as Cu, Ag, Au with a very low radiation emission coefficient. Due to the light reflection of these low-E layers, which is often too high, these layers are sometimes antireflection-coated with the aid of additional transparent layers. By applying the transparent layers, the desired color tint of the glass pane can also be set. A coated substrate is already known which comprises at least one metallic coating layer and further dielectric layers (EP 1 089 947 Bl). This coated substrate is structured such that it can be tempered and bent. A substrate provided with a multilayer system is furthermore known which is also temperable and bendable (US 6 576 349 B2, US 6 686 050 B2). The multilayer system utilized herein comprises two layers which reflect infrared radiation and which are each encompassed by two NiCrOx layers. Further, a heat-insulating layer system is known which, after the coating, is tempered and bent (DE 198 50 023 Al or EP 0 999 192 Bl). This layer system comprises a precious metal layer disposed on a Ti02 layer, the two layers being encompassed by suboxidic NiCrO2- Lastly, temperable coatings are also known which utilize substoichiometric SixNy or SiNxOy (WO 2005/19127 Al, WO 2005/034192 A2). The different layers are, as a rule, produced with the aid of sputter processes, in which by means of positive ions particles are knocked out of so-called targets, which particles are subsequently deposited on the substrate, which may be architectural glass. The known layer systems entail at least one of the following cited disadvantages: expensive or exotic starting materials for sputter targets complex and complicated process control complex layer structuring inadequate optical properties severe changes of the essential properties of the coated glass by a temper process The invention addresses the problem of providing a simple and cost-effective silver low-E coating, which only minimally changes its essential properties after tempering. This problem is solved with the features of patent claim 1. The advantage attained with the invention comprises in particular that only standard target materials, such as boron-doped silicon (Si:B) or titanium-doped silicon aluminum (SiAl:Ti) as well as titanium oxide, silver or nickel-chromium are employed. Since pure silicon is not conductive, silicon sputter targets must be doped, for example, with boron in order for them to be utilizable at all for DC or MF sputtering. The additives boron, aluminum or titanium, which are also contained in the layer, do not have a negative effect. Si3N4 comprises only small quantities of oxygen (Om) as layer material. In the following the process parameters of a sputter process carried out in the production of the invented coating Si3N4 - TiC>2 - Ag - NiCrOx - Si3N4 on glass are compiled in the form of a table. The designations used indicate the following: KT = Cathode seem = standard cubic centimeter per minute (also Nml per minute; Nml = standard millimeter) AC = alternate current DC = direct current V Volt (voltage) A Ampere (current) W Watt (power) k 1000 H 10-6 bar = 0.1 MPa = 105 Pa (Pa = Pascal = pressure) planar = planar cathode rot rotating cathode = doped with KT 1, KT 2 etc. are here the different cathodes of an inline process, past which a substrate - here glass - is successively moved. m = number greater than or equal to zero Cathode KT1 KT2 KT3 KT4 KT5 KT6 KT7 KT8 Material Si3N4 Ti02 TiO2 Ti02 Ag NiCrOx Si3N4:Om Si3N4:Om Gas Inlet Argon 700 sscm 500 seem 450 seem 450 seem 590 seem 480 seem 1000 seem 1000 seem Oxygen 20 seem 293 seem 274 seem 265 seem 10 seem 40 seem 50 seem 50 seem Nitrogen 585 seem 50 seem 50 seem 50 seem 0sccm 0sccm 1070 seem 1195 seem Process AC rot AC rot AC rot AC rot DC planar DC planar AC rot AC rot The TiO2 layer has here a double function as an anti-reflecting dielectric and as a seed layer or blocker for the succeeding silver layer. Application of the Ti02 layer as three layers (KT 2, KT 3, KT 4) takes place for the reason that at given substrate rate one cathode alone would not yield the adequate layer thickness. For the same reason the Si3N4:Om layer is applied in two steps. Before tempering, none of the layers had a gradient. Special doping in the target material of the sputter process was omitted. The dielectric layers - Si3N4 and TiO2 - are preferably sputtered from rotating magnetrons. For the TiC»2 layer ceramic TiOx target can be utilized, which can be sputtered using MF techniques (approximately 10 kHz to 80 kHz) or AC techniques or also DC techniques. The Ag layer and the NiCrOx layers are typically sputtered from metallic targets by means of DC techniques. For all processes planar and/or rotating targets are conceivable. For Ti02 and Si3N4 coatings rotating targets have preferably been used for some time. For Ag and NiCrOx layers planar targets are conventionally used, however rotating targets are also feasible. As is evident based on Table 1, only small quantities of oxygen are required in the Si 3N4 processes. A high pressure is required, in the concluding Si3N4. Si3N4 : O can generally also be written as SixNyOz, wherein x/y 4 applies. The maximum oxygen flow for the NiCrOx process occurs on the metal branch of the hysteresis, for which narrow apertures and a gas inlet below this aperture in the sputter chamber are preconditions. The right columns of Table 1 show ratios N2 : O2 ^ 20 :1. However, the layers can also be generated for example at a gas flow ratio of N2 : O2 = 4 : 1. The layer composition does not reflect this gas flow ratio of N2 : O2. Rather different parameters exert their influence if relatively more oxygen than nitrogen is found in the layers. By metal branch of the hysteresis the following is understood: if the characteristic at constant power and increasing oxygen flow is plotted against the generator data (current, voltage), the voltage increases up to a certain point, the breakover point. If the oxygen quantity is further increased, the voltage decreases markedly. The process has tipped over from metal mode into oxide mode. If the oxygen is again decreased, a point is reached at which the process tips back again into metal mode. However, the two breakover points are not identical, rather the curve describes a hysteresis (cf. Fig. 1 of EP 0 795 890 A2). The small quantities of nitrogen in the Ti02 processes are not unusual per se and typical when using metallic targets for the process stabilization. When employing ceramic targets, the nitrogen can be omitted. It is probable that due to the higher pressure and the oxygen in the uppermost layer of Si3N4 : O two parameters are available, which permit the setting of the barrier effect and/or of the internal mechanical layer stress conformed to the coating and the coating installation. This applies analogously also to the Si3N4 base layer (KT 1), however, here the increased sputter pressure does not yield any advantages. With the continuous variation of oxygen flow and working pressure in the two Si3N 4 processes (KT 1 or KT 7 and KT 8) variable parameters are available (thus virtual control levers) to conform the layer system to the particular tempering process. A "tuning range" is consequently available in order to attain for the particular coating installation, glass quality and further processing (specifically the tempering) an optimum conformation on the part of the coating. The layer combination cited in the Table 1 before and after the tempering has the properties listed in the following Table 2. Herein the symbols and abbreviations of the CIE LAB color system indicate the following: a* = color value on the red-green axis (dimensionless) b* = color value on the yellow-blue axis (dimensionless) Ty = transmission averaged in the visible range in percent RGy = reflection averaged in the visible range from the glass side of the sample in percent RFy = reflection averaged in the visible range from the layer side of the sample in percent Haze = opacity or "milkiness" (stray-light loss), stray-light component in % R/sq = surface resistivity in Ohm (cf. Hans Joachim Glaser: Dunnfilmtechnologie auf Flachglas, pp. 134 -137). The thickness of the first Si3N4 layer is preferably 5 to 25 nm. The second layer of TiG"2 has preferably also a thickness of 5 to 25 nm. The third layer, comprised of Ag, is preferably 8 to 18 nm thick. The succeeding layer of NiCrOk is 3 to 8 nm thick. The last layer of SixNyOz is preferably 25 to 65 nm thick. Before Tempering After Tempering Difference Ty 82.25 Ty 82.58 Ty 1.33 a* -1.06 a* -1.63 a* -0.57 b* 1.93 b* 1.26 b* -0.67 RGy 9.95 RGy 9.63 RGy -0.32 a* -1.99 a* -0.35 a* 1.64 b* -5.70 b* -4.78 b* 0.92 RFy 6.43 RFy 6.95 RFy 0.52 a* -0.54 a* -0.82 a* 1.36 b* -5.36 b* -3.87 b* 1.49 Haze 0.16 Haze 0.33 Haze 0.17 R/sq 4.80 R/sq 3.30 R/sq -1.50 Table 2 shows that there are only minimal differences in the essential properties of the coating before and after tempering. The tempering was carried out at a temperature of approximately 620 to 700 °C. The substrate was therein heated for 2 to 20 minutes and subsequently cooled very rapidly by means of compressed air. Adhesive strength was tested by means of the so-called Erichsen Wash Test according to ISO 11998. The results were faultless for all samples. The storage life was also tested, and specifically according to the so-called Storage Test for Resistance to Moisture according to DIN EN ISO 6270 (DIN- 50017). Here also only positive values were determined. In addition, the transmission Ty is above 80%, the layer resistance is less than 5.0 Ohm/sq and for the colors in the reflection from the glass side applies - 4 WE CLAIM: 1. Temperable substrate provided with a coating, comprising 1.1 glass as the substrate 1.2 a first layer on the glass of SixNyOZ/ 1.3 a second layer of Ti02 on the first layer, 1.4 a third layer of Ag on the second layer, 1.5 a fourth layer of NiCrOk on the third layer, 1.6 a fifth layer of SixNyOz on the fourth layer, wherein x/y 4 as well as 0 Temperable substrate provided with a coating as claimed in claim 1, characterized in that the first layer is Si3N4. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the fifth layer is Si3N4. Temperable substrate provided with a coating as claimed in claim 1 and/or claim 2, characterized in that the Si3N4 layers have an oxygen content Om, m being between 1 and 10~3. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the fourth layer is NiCr. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the first layer has a thickness of approximately 5 to 25 nm. 7. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the second layer has a thickness of approximately 5 to 25 ran. 8. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the third layer has a thickness of approximately 8 to 18 ran. 9. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the fourth layer has a thickness of 3 to 8 run. 10. Temperable substrate provided with a coating as claimed in claim 1, characterized in that the fifth layer has a thickness of 25 to 65 ran. 11. Temperable substrate provided with a coating as claimed in claim 6, characterized in that the first layer has a thickness of 15 ran. 12. Temperable substrate provided with a coating as claimed in claim 7, characterized in that the second layer has a thickness of 15 nm. 13. Temperable substrate provided with a coating as claimed in claim 8, characterized in that the third layer has a thickness of 12.5 nm. 14. Temperable substrate provided with a coating as claimed in claim 9, characterized in that the fourth layer has a thickness of 5 nm. 15. Temperable substrate provided with a coating as claimed in claim 10, characterized in that the fifth layer has a thickness of 40 to 50 nm. 16. Temperable substrate provided with a coating as claimed in claim 1, characterized in that between the T1O2 layer and the Ag layer a layer is provided for setting the transmission. 17. Temperable substrate provided with a coating as claimed in claim 16, characterized in that the layer for setting the transmission is transmission-increasing and comprised of 4 to 20 nm ZnO. 18. Temperable substrate provided with a coating as claimed in claim 16, characterized in that the layer for setting the transmission is transmission-increasing and comprised of 5 to 10 nm ZnO : Al. 19. Temperable substrate provided with a coating as claimed in claim 16, characterized in that the layer for setting the transmission is transmission-reducing and comprised of 1 to 10 nm NiCr. 20. Temperable substrate provided with a coating as claimed in claim 16, characterized in that the layer for setting the transmission is transmission-reducing and comprised of 2 to 5 nm NiCrO. 21. Method for the production of layers as claimed in claim 1 by means of sputtering, characterized in that in the production of the fifth layer the ratio of N2 to O2 is greater than or equal to 4 :1. 22. Method for the production of layers as claimed in claim 1 by means of sputtering, characterized in that the mechanical layer stress of the coating can be set by affecting pressure and oxygen flow in the production of the individual SixNyOz layer. 23. Method for the production of layers as claimed in claim 1 by means of sputtering, characterized in that the working pressure in the deposition of the fifth layer is in the range of 4.5 x 10~3 to 15 x 10~3 mbar. 24. Method for the production of layers as claimed in claim 1 by means of sputtering, characterized in that in the production of the first and fifth layer an oxygen quantity is supplied to the sputter process which is smaller than the supplied nitrogen quantity. Dated this 19th day of December, 2007 ABSTRACT The invention relates to a silver low-E coating for glass which is temperable and can be applied by means of sputter processes onto the glass. The individual layers of the coating are cost-effective standard materials. One embodiment of the invention for example is comprised of a glass substrate, an Si3N4 layer disposed thereon of a thickness of approximately 15 nm, a Ti02 layer of 15 nm thickness on the Si3N4 layer, a 12.5 nm thick Ag layer on the Ti02 layer, a NiCrOx layer of approximately 5 nm thickness on the Ag layer and a terminating 45 nm thick Si3N4 layer. To, The Controller of Patents, The Patent Office, Mumbai |
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2508-MUM-2007-ABSTRACT(GRANTED)-(26-3-2012).pdf
2508-MUM-2007-CANCELLED PAGES(20-1-2012).pdf
2508-MUM-2007-CLAIMS(AMENDED)-(14-5-2012).pdf
2508-MUM-2007-CLAIMS(AMENDED)-(20-1-2012).pdf
2508-MUM-2007-CLAIMS(AMENDED)-(26-3-2012).pdf
2508-MUM-2007-CLAIMS(GRANTED)-(26-3-2012).pdf
2508-MUM-2007-CLAIMS(MARKED COPY)-(14-5-2012).pdf
2508-MUM-2007-CLAIMS(MARKED COPY)-(26-3-2012).pdf
2508-mum-2007-correspondence (29-1-2008).pdf
2508-MUM-2007-CORRESPONDENCE(14-5-2012).pdf
2508-MUM-2007-CORRESPONDENCE(20-1-2012).pdf
2508-MUM-2007-CORRESPONDENCE(25-8-2010).pdf
2508-MUM-2007-CORRESPONDENCE(29-2-2012).pdf
2508-MUM-2007-CORRESPONDENCE(IPO)-(26-3-2012).pdf
2508-mum-2007-correspondence-others.pdf
2508-mum-2007-correspondence-received.pdf
2508-mum-2007-description (complete).pdf
2508-MUM-2007-DESCRIPTION(GRANTED)-(26-3-2012).pdf
2508-mum-2007-form 1 (13-3-2008).pdf
2508-MUM-2007-FORM 13(14-5-2012).pdf
2508-MUM-2007-FORM 2(GRANTED)-(26-3-2012).pdf
2508-mum-2007-form 2(title page)-(24-12-2007).pdf
2508-MUM-2007-FORM 2(TITLE PAGE)-(GRANTED)-(26-3-2012).pdf
2508-mum-2007-form 26 (17-3-2008).pdf
2508-MUM-2007-FORM 26(26-3-2012).pdf
2508-MUM-2007-FORM 3(20-1-2012).pdf
2508-MUM-2007-PETITION UNDER RULE 137(20-1-2012).pdf
2508-MUM-2007-REPLY TO EXAMINATION REPORT(14-5-2012).pdf
2508-MUM-2007-REPLY TO EXAMINATION REPORT(20-1-2012).pdf
2508-MUM-2007-REPLY TO HEARING(26-3-2012).pdf
2508-MUM-2007-SPECIFICATION(AMENDED)-(20-1-2012).pdf
2508-MUM-2007-SPECIFICATION(MARKED COPY)-(20-1-2012).pdf
2508-MUM-2007-US DOCUMENT(14-5-2012).pdf
2508-MUM-2007-US DOCUMENT(26-3-2012).pdf
Patent Number | 251602 | |||||||||||||||
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Indian Patent Application Number | 2508/MUM/2007 | |||||||||||||||
PG Journal Number | 13/2012 | |||||||||||||||
Publication Date | 30-Mar-2012 | |||||||||||||||
Grant Date | 26-Mar-2012 | |||||||||||||||
Date of Filing | 24-Dec-2007 | |||||||||||||||
Name of Patentee | APPLIED MATERIALS, INC. | |||||||||||||||
Applicant Address | 3050 BOWERS AVENUE SANTA CLARA, CALIFORNIA. | |||||||||||||||
Inventors:
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PCT International Classification Number | C03C17/36; C23C14/34 | |||||||||||||||
PCT International Application Number | N/A | |||||||||||||||
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PCT Conventions:
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