Title of Invention

SEMICONDUCTOR CERAMIC MATERIAL

Abstract Disclosed is a semiconductor ceramic material having PTC characteristics, which contains no Pb while having a high Curie point and a low resistivitv. Specifically disclosed is a semiconductor ceramic material having PIC characteristics, which is represented by the following general formula: ABO3, wherein A contains Ba, Ca, an alkali metal element. Bi and a rare earth element, and B contains Ti. This semiconductor ceramic material contains 5-20 parts by mole, preferably 12.5-17.5 parts by mole of Ca per 100 parts by mole of Ti. The alkali metal content/(Bi content + rare earth element content) ratio is preferably within the range of 1.0-1.06. In addition, this semiconductor ceramic material preferably contains 0.01-0.2 part by mole of Mn per 100 parts by mole of Ti.
Full Text DESCRIPTION
SEMICONDUCTOR CERAMIC MATERIAL
Technical Field
[0001]
The present invention relates to a semiconductor ceramic
material having PTC characteristics.
Background Art
[0002]
Semiconductor ceramic materials for use in positive
temperature coefficient thermistors have such PTC
characteristics that the resistances thereof sharply
increase when the semiconductor ceramic materials are heated
to predetermined temperatures (Curie points). Known
examples of such semiconductor ceramic materials having PTC
characteristics include BaTiO; materials.
[0003]
The semiconductor ceramic materials need to be usable at
elevated temperatures for applications such as thermistors
for heaters. The following material is known: a (Ba,
PbjTiO. semiconductor ceramic material, prepared by partly
replacing Ba in BaTiO; with Pb, having a high Curie point.
[0004]
However,there is a problem in that a material of which
the Curie point is increased by the addition of Pb as
described above has a small temperature coefficient of
resistance and the temperature coefficient of resistance
thereof is voltage-dependent as described in Japanese
Unexamined Patent Application Publication No. 56-169301
(Patent Document 1). Therefore, the following material is
demanded: a semiconductor ceramic material which contains
no Pb, which has a high Curie point, and which is suitable
for use in positive temperature coefficient thermistors.
[0005]
For example, Patent Document 1 or Japanese Unexamined
Patent Application Publication No. 2005-255493 (Patent
Document 2) discloses a (3a, Na, Bi, Ln)TiO:. semiconductor
ceramic material (Ln is a rare-earth element) for use in
positive temperature coefficient thermistors as recently
known.
[0006]
However, an increase in Curie point tends to cause an
increase in electrical resistivity. Therefore, compositions
disclosed in Patent Document 1 or 2 have a high Curie point
of 120°C or higher and an electrical resistivity of about 70
Q-cm, which is relatively large. Therefore, compositions
having lower resistivity are demanded for use in thermistors
for heaters.
Patent Document 1: Japanese Unexamined Patent Application
Publication No. 56-169301
Patent Document 2: Japanese Unexamined Patent Application
Publication No. 2005-255493
Disclosure of Invention
Problems to be Solved by the Invention
[0007]
It is an object of the present invention to provide a
semiconductor ceramic material which contains no Pb and
which has a high Curie point, low electrical resistivity/
and PTC characteristics.
Means for Solving the Problems
[0008]
The present invention is shown to a semiconductor
ceramic material which is represented by the formula ABO-: and
which has PTC characteristics, wherein A includes Ea, Ca, an
alkali metal element, Bi, and a rare-earth element and B
includes Ti. The semiconductor ceramic material contains 5
to 20 molar parts of Ca per 100 molar parts of Ti.
[0009]
The content of Ca is preferably 12.5 to 17.5 molar parts
per 100 molar parts of Ti.
[0010]
The content of the alkali metal element, the content of
Bi, and the content of the rare-earth element are preferably
selected such that a ratio of the content of the alkali
metal element to the sum of the content of the bismuth plus
the content of the rare earth element is from 1.00 to 1.06.
[0011]
The semiconductor ceramic material according to the
present invention preferably further contains 0.01 to 0.2
molar parts of Mn per 100 molar parts of Ti.
Advantages
[0012]
In a semiconductor ceramic material according to the
present invention, an A-site (Ba site) is partly replaced
with Ca such that the content of Ca is 5 to 20 molar parts
of Ca per 100 molar parts of Ti; hence, the electrical
resistivity thereof can be reduced while the Curie point
thereof is kept high. Therefore, if the semiconductor
ceramic material according to the present invention is
applied to a positive temperature coefficient thermistor, a
large current can be supplied through the thermistor and
therefore a high-power PTC heater can be obtained.
[0013]
If the content of Ca is selected within a limited range
from 12.5 to 17.5 molar parts per 100 molar parts of Ti, the
electrical resistivity can be further reduced.
[0014]
If a ratio of the content of the alkali metal element to
the sum of the content of the bismuth plus the content of
the rare earth element, is from 1.00 to 1.06, a good carrier
balance and high rare of change in resistance can be
obtained and PTC characteristics can be improved.
[0015]
When the semiconductor ceramic material according to the
present invention further contains 0.01 to 0.2 molar parts
of Mn, which serves as an acceptor, per 100 molar parts of
Ti, acceptor levels can be formed at grain boundaries, rare
of change in resistance can be enhanced, and PTC
characteristics can be further improved.
Erief Description of Drawings
[0016]
[Fig. 1] Fig. 1 is a graph showing the relationship
between the content of Ca in a ceramic crystal in each
evaluation sample prepared in Example 1, the length of the
a-axis and c-axis of the ceramic crystal, and the axial
ratio (c/a axial ratio) of the ceramic crystal, the a-axis
and c-axis thereof being determined by X-ray diffraction.
[Fig. 2] Fig. 2 includes illustrations prepared by
tracing grain boundaries of ceramic crystals in SEM images
of chemically etched surfaces of samples of sintered bodies
obtained in Example 1.
Best Modes for Carrying Out the Invention
[0017]
A semiconductor ceramic material, having PTC
characteristics, according to the present invention has a
composition represented by the formula ABO;. In the formula
ABO;., A includes Ba, Ca, an alkali metal element (such as Na,
K, or Li), Bi, and a rare-earth element (such as La) serving
as a donor and B includes Ti. The semiconductor ceramic
material contains two to 20 molar parts and preferably 12.5
to 17.5 molar parts of Ca per 100 molar parts of Ti.
[0018]
In general, Ca is sometimes added to BaTi02
semiconductor ceramic materials such that PTC thermistors
have increased withstand voltage. This is because the
addition of Ca allows fine grains to be formed and therefore
results in an increase in withstand voltage. In other
words, the addition of Ca allows fine grains to be formed
and therefore is likely to result in an increase in
electrical resistivity. Kence, the following advantage is
not usually available: an advantage that the addition of Ca
results in a reduction in withstand voltage as described in
the present invention.
[0019]
When the composition of the semiconductor ceramic
material according to the present invention is (Ba, Na, Bi,
Ln)TiO3 (Na may be replaced with another alkali metal element
and Ln is a rare-earth element), grains therein are fine.
It has been found that the addition of Ca to the
semiconductor ceramic material allows the grains to grow
(see experiments below).
[0020]
Semiconductor ceramic materials having PTC
characteristics have low resistance because grain boundary
barriers are reduced due to spontaneous polarization in
ceramic crystal grains. It has been found that the
tetragonalinity of a crystal is increased, that is, the
axial ratio (c/a axial ratio) of the crystal is increased in
such a manner that Ba is partly replaced with Ca in
accordance with the present invention. From this result, it
can be inferred that an increase in spontaneous polarization
reduces the grain boundary barriers to cause a reduction in
resistance.
[0021]
In the semiconductor ceramic material according to the
present invention, the content of the alkali metal element,
the content of Ei, and the content of the rare-earth
element, which serves as a donor, are preferably selected
such that a ratio of the content of the alkali metal element
to the sum of the content of the bismuth plus the content of
the rare earth element, is from 1.00 to 1.06. This range
provides a good carrier balance and high rare of change in
resistance and can improve PTC characteristics.
[0022]
The semiconductor ceramic material according to the
present invention preferably further contains 0.01 to 0.2
molar parts of Mn, which serves as an acceptor, per 100
molar parts of Ti. The addition of Mn allows acceptor
levels to be formed at grain boundaries and allows an
increase in rare of change in resistance and an improvement
in PTC characteristics.
[0023]
SiO: is likely to react with Bi and Na to produce a
glass component. Therefore, even if, for example, a major
component is calcined and a mixture of the major component
and SiC. is then fired, Na and Bi that remain without
reacting during calcination are readily taken into glass
during firing. This can result in a shift in the
composition of a mother crystal to cause an increase in
resistance. Therefore, in the case of adding SiO:, the
content thereof is preferably 0.2 molar parts or less per
100 molar parts of Ti.
[0024]
Experiments performed to determine the scope of the
present invention and to confirm advantages of the present
invention will now be described.
[0025]
[Experiment 1]
The following powders were weighed and compounded such
that compositions shown in Table 1 were obtained after
firing: powders of BaCO1, CaCO1, Na:CO1, Bi2O3, TiO2, and La2O2
that was a semiconducting agent that were raw materials.
[0026]
Each compounded powder mixture was mixed with an
ethanol-based solvent for 24 hours using zirconia balls,
dried by removing the solvent, and then screened with a #50-
mesh sieve. The screened powder mixture was heat-treated at
a temperature of 800°C to 1000°C for two hours, whereby a
calcined powder was obtained.
[0027]
The calcined powder was mixed with vinyl acetate, which
was used as an organic binder, poly(ammonium carboxylate),
which was used as a dispersant, and water for 16 hours using
zirconia balls. The slurry thereby obtained was dried and
then screened with a #50-mesh sieve, whereby a source
material for pressing was obtained.
[0028]
The source material was formed into a disk shape at a
pressure of 1000 kgf/cni- using a single-shaft press, whereby
a disk sample was obtained. The disk sample was debinded in
air and then fired at a top temperature of 1250°C to 1400°C
for two hours in a nitrogen atmosphere. This allowed the
disk sample to have a diameter of 12 mm and a thickness of 2
mm. The compositions shown in Table 1 were determined by
inductively coupled plasma atomic emission spectrometry
(ICP-AES) analysis.
[0029]
Both principal surfaces of the disk sample fired as
described above were polished with a piece of sandpaper.
Ni/Ni-Cu alloy/Ag electrodes were formed on the polished
principal surfaces thereof by dry plating, whereby an
evaluation sample was obtained. The evaluation sample was
evaluated for properties as shown in Table 1.
[0030]
The "electrical resistivity" of the evaluation sample
was determined as follows: a direct-current voltage of 0.1
V was applied to the evaluation sample at room temperature
(25°C), the room-temperature resistance of the evaluation
sample was measured by a direct current four-terminal
method, and the room-temperature resistance per unit length
of the evaluation sample was calculated, whereby the
electrical resistivity thereof was obtained.
[0031]
The "PTC digit" of the evaluation sample was determined
in such a manner that the evaluation sample was measured for
resistance at 25°C and 250°C by the same method as that used
to measure the room-temperature resistance thereof and the
rate of change in resistance determined by the equation ?R =
log(Rsec/R25) was used to express the "PTC digit" thereof,
wherein ?R represents the rate of change in resistance of
the evaluation sample, R2e represents the resistance of the
evaluation sample at 25°C, and R250 represents the resistance
thereof at 250°C.
[0032]
The "Tc (Curie point)" of the evaluation sample was
defined to be the temperature at which the electrical
resistivity of the evaluation sample doubled.
[0033]
[0034]
As is clear from Table 1, Samples 4 to 9, in which the
content of Ca ranges from 5 to 20 molar parts per 100 molar
parts of Ti, have a high Curie point of 150°C or higher and
an electrical resistivity of 30 O.cm or less. Samples 6 to
8, in which the content of Ca is within a limited range from
12.5 to 17.5 molar parts, have a particularly low electrical
resistivity.
[0035]
In contrast, Samples 1 to 3, in which the content of Ca
is less than 5 molar parts, and Samples 10 to 12, in which
the content of Ca is greater than 20 molar parts, have an
electrical resistivity of greater than 30 O.cm.
[0036]
The reason why Samples 4 to 9, which are within the
scope of the present invention, have low electrical
resistivity can be inferred as described below.
[0037]
Fig. 1 shows the relationship between the content of Ca
in each ceramic crystal, the length of the a-axis and c-axis
of the ceramic crystal, and the axial ratio (c/a axial
ratio) of the ceramic crystal, the a-axis and c-axis thereof
being determined by X-ray diffraction (XRD). With reference
to Fig. 1, an increase in the content of Ca tends to
increase the c/a axial ratio. This suggests that the
ceramic crystal has strong ferroelectricity. Therefore,
this advantageously acts on semiconductor ceramic materials
having such PTC characteristics that spontaneous
polarization causes a reduction in resistance; hence, the
presence of Ca and an increase in the content thereof
probably result in a reduction in resistance. The reason
why a Ca content exceeding 20 molar parts causes an increase
in electrical resistivity as shown in Table 1 is probably
that this content exceeds the solubility limit of Ca.
[0038]
Figs. 2(a), 2(b), 2(c), and 2(d) are illustrations
prepared by tracing grain boundaries of ceramic crystals in
SEM images of chemically etched surfaces of sintered bodies
obtained from Samples 1, 4, 9, and 11, which have a Ca
content of zero, 5, 20, and 25 molar parts, respectively.
[0039]
Fig. 2 illustrates that the increase of the content of
Ca from 5 molar parts to 20 molar parts allows the ceramic
crystals to have a large grain size because of the growth of
grains of the ceramic crystals. This suggests that the
number of grain boundaries per unit thickness of a sintered
body can be reduced by selecting the content of Ca within a
range from 5 to 20 molar parts and this leads to a reduction
in resistance.
[0040]
The sample, shown in Fig. 2(d), having a Ca content of
25 molar parts contains a slight number of grown grains.
White heterophases (indicated by hatched portions in this
figure) are present at boundaries between these grains.
This suggests that Ca precipitates at grain boundaries of
ceramic crystals and this results in an increase in
electrical resistivity.
[0041]
[Experiment 2]
Evaluation samples were prepared and then evaluated in
substantially the same manner as that described in
Experiment 1 except that a Mn3Oj powder was prepared and then
added to the above-mentioned calcined powders such that
compositions shown in Table 2 were obtained after firing.
[0043]
Table 2 illustrates that although the addition of Mn
tends to cause a slight increase in electrical resistivity,
Samples 23 to 25, in which the content of Mn is 0.01 to 0.2
molar parts per 100 molar parts of Ti, are not significantly
increased in electrical resistivity and the PTC digit
thereof can be increased to 4.0 or more without
significantly reducing the Tc (Curie point) thereof. The
increase of the PTC digit thereof is probably due to the
fact that the addition of a predetermined amount of Mn
allowed acceptor levels to be formed at grain boundaries of
ceramic crystals.
[0044]
[Experiment 3]
Evaluation samples were prepared and then evaluated in
substantially the same manner as that described in
Experiment 1 except that the ratio "Na/(Bi + La)" was varied
in fired compositions as shown in Table 3.
[0046]
As shown in Table 3, Samples 33 to 36, in which the
ratio "Na/(Bi + La)" is within a range from 1.0 to 1.06,
have a larger PTC digit and can be improved in PTC
characteristics as compared to Samples 31, 32, and 37, in
which the ratio "Na/(Bi + La)" is outside this range.
[0047]
[Experiment 4]
Evaluation samples were prepared and then evaluated in
substantially the same manner as that described in
Experiment 1 except that a Mn3O4 powder and a SiO2 powder
were prepared and then added to the above-mentioned calcined
powders such that compositions shown in Table 4 were
obtained after firing.
[0048]
[0049]
Table 4 illustrates that Samples 56 to 62, in which the
content of SiO; is zero molar parts or 0.2 molar parts or
less per 100 molar parts of Ti, have low electrical
resistivity, a large PTC digit, and a high Tc. However,
Sample 63, in which the content of SiO; is 0.3 molar parts
per 100 molar parts of Ti, has high electrical resistivity
and a small PTC digit.
CLAIMS
1. A semiconductor ceramic material which is represented
by the formula ABO:- and which has PTC characteristics,
wherein A includes Ba, Ca, an alkali metal element, Bi, and
a rare-earth element and B includes Ti,
and the semiconductor ceramic material containing 5 to 20
molar parts of Ca per 100 molar parts of Ti.
2. The semiconductor ceramic material according to Claim
1, wherein the content of Ca is 12.5 to 17.5 molar parts per
100 molar parts of Ti.
3. The semiconductor ceramic material according to Claim
1, wherein the content of the alkali metal element, the
content of Bi, and the content of the rare-earth element are
selected such that a ratio of the content of the alkali
metal element to the sum of the content of the bismuth plus
the content of the rare earth element, is from 1.00 to 1.06.
4. The semiconductor ceramic material according to any
one of Claims 1 to 3, further containing 0.01 to 0.2 molar
parts of Mn per 100 molar parts of Ti.



Disclosed is a semiconductor ceramic material having
PTC characteristics, which contains no Pb while having a high Curie
point and a low resistivitv. Specifically disclosed is a semiconductor
ceramic material having PIC characteristics, which is represented by
the following general formula: ABO3, wherein A contains Ba, Ca, an
alkali metal element. Bi and a rare earth element, and B contains Ti. This
semiconductor ceramic material contains 5-20 parts by mole, preferably
12.5-17.5 parts by mole of Ca per 100 parts by mole of Ti. The alkali
metal content/(Bi content + rare earth element content) ratio is preferably
within the range of 1.0-1.06. In addition, this semiconductor ceramic
material preferably contains 0.01-0.2 part by mole of Mn per 100 parts
by mole of Ti.

Documents:

4314-KOLNP-2009-(01-07-2014)-CORRESPONDENCE.pdf

4314-KOLNP-2009-(03-05-2013)-CORRESPONDENCE.pdf

4314-KOLNP-2009-(03-05-2013)-OTHERS.pdf

4314-KOLNP-2009-(08-05-2014)-CORRESPONDENCE.pdf

4314-kolnp-2009-(16-08-2013)-ABSTRACT.pdf

4314-kolnp-2009-(16-08-2013)-ANNEXURE TO FORM 3.pdf

4314-kolnp-2009-(16-08-2013)-CLAIMS.pdf

4314-kolnp-2009-(16-08-2013)-CORRESPONDENCE.pdf

4314-kolnp-2009-(16-08-2013)-DESCRIPTION (COMPLETE).pdf

4314-kolnp-2009-(16-08-2013)-DRAWINGS.pdf

4314-kolnp-2009-(16-08-2013)-FORM-2.pdf

4314-kolnp-2009-(16-08-2013)-OTHERS.pdf

4314-kolnp-2009-(16-08-2013)-PA.pdf

4314-kolnp-2009-(16-08-2013)-PETITION UNDER RULE 137.pdf

4314-kolnp-2009-abstract.pdf

4314-kolnp-2009-ASSIGNMENT.pdf

4314-kolnp-2009-claims.pdf

4314-kolnp-2009-CORRESPONDENCE 1.1.pdf

4314-kolnp-2009-correspondence.pdf

4314-kolnp-2009-description (complete).pdf

4314-kolnp-2009-drawings.pdf

4314-kolnp-2009-form 1.pdf

4314-KOLNP-2009-FORM 18.pdf

4314-kolnp-2009-form 2.pdf

4314-kolnp-2009-FORM 3.1.1.pdf

4314-kolnp-2009-form 3.pdf

4314-kolnp-2009-form 5.pdf

4314-kolnp-2009-gpa.pdf

4314-kolnp-2009-international publication.pdf

4314-kolnp-2009-others pct form.pdf

4314-kolnp-2009-pct priority document notification.pdf

4314-kolnp-2009-specification.pdf

4314-kolnp-2009-TRANSLATED COPY OF PRIORITY DOCUMENT.pdf

abstract-4314-kolnp-2009.jpg


Patent Number 263440
Indian Patent Application Number 4314/KOLNP/2009
PG Journal Number 44/2014
Publication Date 31-Oct-2014
Grant Date 29-Oct-2014
Date of Filing 14-Dec-2009
Name of Patentee MURATA MANUFACTURING CO., LTD.
Applicant Address 10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU 617-8555 JAPAN
Inventors:
# Inventor's Name Inventor's Address
1 KATSU, HAYATO C/O (A170) INTELLECTUAL PROPERTY DEPARTMENT, MURATA MANUFACTURING CO., LTD 10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU 617-8555 JAPAN
PCT International Classification Number C04B35/46; H01C7/02; C04B35/46
PCT International Application Number PCT/JP2008/060424
PCT International Filing date 2008-06-06
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 2007-157420 2007-06-14 Japan