Title of Invention	ELECTRONIC COMPONENT AND METHOD FOR FIXING THE SAME
Abstract	Disclosed is an electronic component, especially a coil with a coil core, in which the turns of the coil winding are spaced apart from each other at least at one point in the longitudinal direction of the coil. A plastic retaining element which overlaps both the coil core and at least the two adjacent turns of the coil winding in a longitudinal direction is sprayed on in the area of said point, whereby a connection between the coil core and the coil winding is created at the same time. The retaining element can be sprayed around a closed circumference of the coil while covering only a portion of the coil in the longitudinal direction thereof. Preferably, the retaining element is placed approximately in the center relative to the longitudinal extension of the coil.

Title of Invention

ELECTRONIC COMPONENT AND METHOD FOR FIXING THE SAME

Abstract

Disclosed is an electronic component, especially a coil with a coil core, in which the turns of the coil winding are spaced apart from each other at least at one point in the longitudinal direction of the coil. A plastic retaining element which overlaps both the coil core and at least the two adjacent turns of the coil winding in a longitudinal direction is sprayed on in the area of said point, whereby a connection between the coil core and the coil winding is created at the same time. The retaining element can be sprayed around a closed circumference of the coil while covering only a portion of the coil in the longitudinal direction thereof. Preferably, the retaining element is placed approximately in the center relative to the longitudinal extension of the coil.

Full Text	P 45285 WO - 1 - Description Electronic component and method for fixing the same The invention relates to an electronic component, especially a coil and a method for its manufacture. Coils with coil cores are often required in electronics. They are implemented and fixed in components, printed circuit boards or in other arrangements. Placement and fixing often takes place with the help of devices that grasp the coils and place them at the required place. After placing, they can, for instance, automatically be soldered to establish the electrical connection. When moving the coil with the help of automatic appliances very high speeds can occur and especially also jerky accelerations. Upon the occurrence of jerky accelerations the danger exists that the coil cores may be thrown out of the coil winding. Commonly, the coil cores are a bit longer than the coil winding, but grasping with automatic appliances generally occurs in the middle of the longitudinal extension of the coil - thus on the coil winding. To enable grasping on the coil winding, it is already known to attach a small plate made of plastic, with the help of an adhesive, which can involve an encapsulating material to be applied on the top side of the coil winding (DE 9410532). The task of the invention is to form an electronic component in such a manner that it is particularly suitable for automatic assembly. P 45285 WO - 2 - To solve this task, the invention proposes a component with the features mentioned in Claim 1 and/or a method with the features of Claim 11. Further developments of the invention are object of dependent claims. The component can by grasped by using a grasper on the holding element, and moved to the assembly point. The electronic component can be a capacitor, for example. Particularly, the invention is suitable for fastening coils. In the normal case the windings of the coil lie adjacent to one another in order to occupy little space as possible. Now, it is provided according to the invention that, at a point between two sections of winding or also between two adjacent windings, a gap is provided for instance in longitudinal direction of the coil. Through this gap the coil core is open outwards so that the holding element can be connected both with the coil core as well as with the two adjacent coil windings. The holding element made of plastic is injection-molded at this point. It connects itself with the coil core and with the neighboring windings. Through this, a permanent connection between the coil core and the coil winding established so that the initially mentioned difficulties can no longer occur. For an automatic assembly, the coils are generally formed such that they allow one to see which side of the coil is meant to be the assembly side on the printed circuit board. This can be identified, for instance, in that the two connection ends of the coil winding run tangentially to the coil core and lie in one plane. The invention now proposes that the holding element is injection-molded on the side turned away from the assembly side of the coil. P 45285 WO - 3 - Thus, expressed otherwise, this allows that the holding element is injection molded from this side. This results in that the holding element can also be used to form an action point for a gripping device, for instance for a suction pipette . According to the invention it can be provided in a further development that the holding element extends at least over a part of the circumference of the coil. In yet another further development of the invention it can be provided that the holding element only extends over a part of the length of the coil. Thus, the rest of the coil, particularly of the coil winding, remains free of the material of the holding element so that no restrictions occur with regard to the heat dissipation capability. It can, however, also be provided that the holding element extends over an entire circumference of the coil so that it is therefore injection-molded around the coil. In yet another further development of the invention, it can be provided that the holding element features a plane surface on the side turned away from the assembly side of the coil. This plane surface is meant and is suitable for being held by means of a grasper. According to the invention it can likewise be provided that the holding element is injection-molded from a plastic that develops an adhesive effect at higher temperatures, for instance at a temperature that corresponds to the soldering temperature. This leads to the effect that, during its electrical connection via the soldering process, the coil is concurrently additionally connected mechanically with the printed circuit board at a further point. P 45285 WO - 4 - For the manufacture of the coil, the invention proposes that first from the wire the coil winding is made in such a manner that said coil features a gap at least at one point between two adjacent windings in the longitudinal direction. Thereafter, in this coil winding, a coil core is inserted and the unit comprising the coil winding and the core is introduced into an injection die. In this injection die, many similar units of coil winding and coil core can be introduced. Finally, at the said point of the gap between the two windings and the two adjacent windings, the holding element itself is injection- molded. Further features, details, and preferences of the invention are derived from the claims and the abstract, whose wording refers to the content of the description, and to the following description of a preferred embodiment as well as to the drawing. The following figures show: Figure 1: a view of a coil winding with a coil core from the direction turned away from the assembly side of the coil; Figure 2: the view of the coil of Figure 1 from the bottom in Figure 1; Figure 3: the view of the coil corresponding to Figure 2 with an attached holding element; Figure 4: an illustration corresponding to Figure 3 for the second embodiment. Figure 5: a plan view of a coil to be vertically mounted. Figure 6: a side view of the coil according to Figure 5 with a partially sectioned illustration of the holding element. P 45285 WO - 5 - Figure 1 shows a coil with a coil core 1, for instance made of ferrite. The coil core 1 is formed as a circular cylindrical rod. It contains two plane end faces 2. The coil core 1 is surrounded by a coil winding 3, which features numerous adjacent coil windings 4. The two ends 5, 6 of the coil winding 3 are tangentially led away from the coil core 1. The two ends 5, 6 can also be longer, the illustration is only schematically considered. They lie in one plane. This plane depicts the assembly side of the coil. The windings 4 of the coil winding 3 are wound at a point 7 such that they feature a gap in the longitudinal direction of the coil. This forms a gap through which a part of the surface of the coil core 1 is visible. Figure 2 shows the view of the coil of Figure 1 from below in Figure 1, thus from a direction offset by 90°. Here, one sees how the gap between two adjacent windings 4 occurs. The pitch of the windings is enlarged at this point and finally led back to the normal value. The unit depicted in Figures 1 and 2 of the coil core 1 and coil winding 3 is placed in an injection die, together with a plurality of other similar units. In this injection die, a holding element 8 is injection-molded onto the point 7 of the gap between two adjacent windings 4 of the coil winding 3. The top side 9 of the holding element 8 as visible in Figure 3 is formed plane. In longitudinal direction, the holding element 8 extends over the gap between adjacent windings and at least over the two adjacent windings themselves, preferably still up into the depression between the next windings. The holding element 8 is made of injected plastic and is connected with the core 1 and the coil windings. Through this the coil winding 3 is also connected with the core 1. As for the embodiment of Figure 3 the holding element 8 extends in the circumferential direction only via a part of the coil. P 45285 WO - 6 - Figure 4 depicts an embodiment in which the holding element 18 is injection molded around the entire circumference of the coil. Again, the side of the holding element 18 is turned away from the assembly side, at the bottom in Figure 4, where it is provided with a plane surface 9 on which a gripper can act. In the case of both embodiments the holding element 8, 18 only extends over a part of the length of the coil so that the rest of the coil windings 3 remain free and can dissipate their heat content. The attachment of a holding element 8, 18 on an electronic component was described using a coil as an example. The attachment of such a holding element can also occur for other electronic components. The holding element 18 depicted in Figure 4 can be injection-molded from a plastic that develops an adhesive effect at a temperature corresponding to the soldering temperature. When the coil is placed on the printed circuit board and then finally soldered, with the help of the holding element 18 it will be bonded together with the surface of the printed circuit board. This leads to a particularly good mechanical safety of the coil on the printed circuit board. This type of connection by means of a holding element made of a plastic that generates an adhesive effect at a higher temperature can also find application for other electronic components, but not for coils with a coil core. What was depicted in Figures 1 to 4 for a horizontal configuration of coils is obviously also possible for the upright configuration of coils. In the case of horizontal configuration the axis of the coil core and the coil winding is aligned parallel to the surface on which the coil is mounted. In the case of upright configuration the axis is aligned perpendicularly to the surface. Even with the upright configuration it is possible to align the holding P 45285 WO - 7 - element as it is depicted in Figures 1 to 3. Even then can a grasper hold the contact surface 9 of the holding element and place the coil at the right place. It is, however, likewise possible to attach the holding element at a different point. This should be depicted with reference to Figure 5 and Figure 6. Figure 5 shows a face view of a coil in which the face surface 2 of coil core 1 is visible. The two ends 5, 16 of the coil winding are arranged differently here contrary to how this was depicted in the preceding embodiments. While connection end 5 still runs tangentially to the coil core 1, the connection end 16 is aligned radially outwards and from there it is bent downwards; see the side view of Figure 6. Whilst Figure 5 still shows the coil with coil core prior to the injection molding of the holding element, Figure 6 shows a side view with a holding element 28 injection-molded on it, which is depicted here in a sectional view. As one can still derive from Figure 5, here the winding 4 sections of the coil winding are arranged such that the core 1 between them is free. One can injection mould a holding element 28 at this point which then extends laterally so far that it then overlaps the top-most coil winding 4. This also leads to having the coil winding 3 fixed against displacement on the core 1. The holding element 28 can enclose the face end of the coil, for instance, when turned away from the mounting surface around the entire circumference so that it forms a kind of cover. However, it can also be sufficient that this holding element 28 only extends in the section of a diameter above the face end, so that free parts remain on the right and left side. Also in the type of configuration of Figure 6, the holding element, in the embodiment according to Figure 4, can similarly reach up to a point on the P 45285 WO - 8 - lower face surface 2 in Figure 6 if one intends to attain the same fixing type as in the case of the embodiment according to Figure 4. What was depicted with reference to Figures 4 to 6 as an example for one coil can also be applied to another electronic component, for instance, to capacitors that likewise feature connection ends, and in which the components can be mounted with both the help of a grasper as well as adhesion during soldering. P 45285 WO - 9 - Patent Claims 1. An electronic component which 1.1 is formed for automatic mounting and 1.2 features a holding element (8, 18, 28) which 1.3 is made of plastic and 1.4 is injection molded on the electronic component and 1.5 is formed as a holding point for a grasper. 2. A component according to Claim 1, formed as coil with a coil core (1) and the coil winding (3) surrounds the coil core (1) with at least two connection ends (5, 6). 3. A component according to Claim 2, wherein the holding element (8, 18, 28) grips both the coil core (1) as well as at least a point of a winding (4) of the coil winding (3). 4. A component according to Claim 2 or 3, wherein at least at one point (7) a gap is provided between two adjacent windings (4) of the coil winding (3) in the longitudinal direction of the coil, whereby the holding element (8,18) is injection molded on the coil core (1) at the point (7) of the gap between the windings (4) and at least two of these points (7) overlap with adjacent windings (4) of the coil winding (3) in the longitudinal direction. 5. A component according to one of the preceding claims, wherein the holding element (8, 18) is located on the side of the coil turned away from the assembly side of the coil. 6. A component according to one of the preceding claims, wherein the holding element (8, 18) extends over at least one part of the P 45285 WO -10- circumference of the component. 7. A component according to one of the preceding claims, wherein the holding element (8, 18) extends over at least one part of the circumference of the component. 8. A component according to one of the preceding Claims 1-6, wherein the holding element (18) extends over the entire circumference of the component. 9. A component according to one of the preceding claims, wherein the holding element (8, 18) features a plane surface (9) on the side of the component turned away from the assembly side. 10. A component according to one of the preceding claims, wherein the holding element (8, 18) is injection molded from plastic that develops an adhesive effect at soldering temperatures. 11. A method for mounting an electronic component, wherein 11.1 on the electronic component a holding element (8, 18, and 28) is injection molded, 11.2 on the holding element a contact surface for a grasper is formed and 11.3 that a component with the help of a grasper acting on the contact surface moves said component to its assembly point. 12. A method according to Claim 11, wherein for mounting of a component formed as a coil with a coil core (1), the windings (4) of the coil winding at least at one point (7) are provided with a gap in which the coil winding (3) of the coil core (1) is inserted, the coil core P 45285 WO -11- (1) and coil winding (3) are introduced in an injection die, and on the point (7) of the gap between the two windings (4) and the two windings (4) the holding element (8, 18) itself is injection molded. 13. A method according to Claim 11 or 12, wherein the holding element (8, 18) is injection molded on the side of the component turned away from the assembly side of the component. 14. A method according to one of Claims 11 to 13, wherein the holding element (8, 18) is injection molded over at least one part of the circumference of the component. 15. A method according to one of Claims 11 to 14, wherein the holding element (8, 18) is injection molded over only one part of the length of the component. 16. A method according to one of Claims 11 to 15, wherein the holding element (18) is injection molded around the entire circumference of the component. 17. A method according to one of Claims 11 to 16, wherein the holding element (8, 18) is provided with a plane surface (9) on the side turned away from the assembly side of the component. 18. A method according to one of Claims 11 to 17, wherein the holding element is injection molded from plastic that develops an adhesive effect at a temperature corresponding to the soldering temperature. Disclosed is an electronic component, especially a coil with a coil core, in which the turns of the coil winding are spaced apart from each other at least at one point in the longitudinal direction of the coil. A plastic retaining element which overlaps both the coil core and at least the two adjacent turns of the coil winding in a longitudinal direction is sprayed on in the area of said point, whereby a connection between the coil core and the coil winding is created at the same time. The retaining element can be sprayed around a closed circumference of the coil while covering only a portion of the coil in the longitudinal direction thereof. Preferably, the retaining element is placed approximately in the center relative to the longitudinal extension of the coil.

Full Text

P 45285 WO - 1 -
Description
Electronic component and method for fixing the same
The invention relates to an electronic component, especially a coil and a
method for its manufacture.
Coils with coil cores are often required in electronics. They are
implemented and fixed in components, printed circuit boards or in other
arrangements. Placement and fixing often takes place with the help of
devices that grasp the coils and place them at the required place. After
placing, they can, for instance, automatically be soldered to establish the
electrical connection.
When moving the coil with the help of automatic appliances very high
speeds can occur and especially also jerky accelerations. Upon the
occurrence of jerky accelerations the danger exists that the coil cores may
be thrown out of the coil winding. Commonly, the coil cores are a bit
longer than the coil winding, but grasping with automatic appliances
generally occurs in the middle of the longitudinal extension of the coil -
thus on the coil winding.
To enable grasping on the coil winding, it is already known to attach a
small plate made of plastic, with the help of an adhesive, which can involve
an encapsulating material to be applied on the top side of the coil winding
(DE 9410532).
The task of the invention is to form an electronic component in such a
manner that it is particularly suitable for automatic assembly.

P 45285 WO - 2 -
To solve this task, the invention proposes a component with the features
mentioned in Claim 1 and/or a method with the features of Claim 11.
Further developments of the invention are object of dependent claims.
The component can by grasped by using a grasper on the holding element,
and moved to the assembly point.
The electronic component can be a capacitor, for example. Particularly, the
invention is suitable for fastening coils.
In the normal case the windings of the coil lie adjacent to one another in
order to occupy little space as possible. Now, it is provided according to the
invention that, at a point between two sections of winding or also between
two adjacent windings, a gap is provided for instance in longitudinal
direction of the coil. Through this gap the coil core is open outwards so that
the holding element can be connected both with the coil core as well as
with the two adjacent coil windings. The holding element made of plastic is
injection-molded at this point. It connects itself with the coil core and with
the neighboring windings. Through this, a permanent connection between
the coil core and the coil winding established so that the initially mentioned
difficulties can no longer occur.
For an automatic assembly, the coils are generally formed such that they
allow one to see which side of the coil is meant to be the assembly side on
the printed circuit board. This can be identified, for instance, in that the two
connection ends of the coil winding run tangentially to the coil core and lie
in one plane. The invention now proposes that the holding element is
injection-molded on the side turned away from the assembly side of the
coil.

P 45285 WO - 3 -
Thus, expressed otherwise, this allows that the holding element is injection
molded from this side. This results in that the holding element can also be
used to form an action point for a gripping device, for instance for a suction
pipette .
According to the invention it can be provided in a further development that
the holding element extends at least over a part of the circumference of the
coil.
In yet another further development of the invention it can be provided that
the holding element only extends over a part of the length of the coil. Thus,
the rest of the coil, particularly of the coil winding, remains free of the
material of the holding element so that no restrictions occur with regard to
the heat dissipation capability.
It can, however, also be provided that the holding element extends over an
entire circumference of the coil so that it is therefore injection-molded
around the coil.
In yet another further development of the invention, it can be provided that
the holding element features a plane surface on the side turned away from
the assembly side of the coil. This plane surface is meant and is suitable for
being held by means of a grasper.
According to the invention it can likewise be provided that the holding
element is injection-molded from a plastic that develops an adhesive effect
at higher temperatures, for instance at a temperature that corresponds to
the soldering temperature. This leads to the effect that, during its electrical
connection via the soldering process, the coil is concurrently additionally
connected mechanically with the printed circuit board at a further point.

P 45285 WO - 4 -
For the manufacture of the coil, the invention proposes that first from the
wire the coil winding is made in such a manner that said coil features a gap
at least at one point between two adjacent windings in the longitudinal
direction. Thereafter, in this coil winding, a coil core is inserted and the unit
comprising the coil winding and the core is introduced into an injection die.
In this injection die, many similar units of coil winding and coil core can be
introduced. Finally, at the said point of the gap between the two windings
and the two adjacent windings, the holding element itself is injection-
molded.
Further features, details, and preferences of the invention are derived from
the claims and the abstract, whose wording refers to the content of the
description, and to the following description of a preferred embodiment as
well as to the drawing. The following figures show:
Figure 1: a view of a coil winding with a coil core from the direction turned
away from the assembly side of the coil;
Figure 2: the view of the coil of Figure 1 from the bottom in Figure 1;
Figure 3: the view of the coil corresponding to Figure 2 with an attached
holding element;
Figure 4: an illustration corresponding to Figure 3 for the second
embodiment.
Figure 5: a plan view of a coil to be vertically mounted.
Figure 6: a side view of the coil according to Figure 5 with a partially
sectioned illustration of the holding element.

P 45285 WO - 5 -
Figure 1 shows a coil with a coil core 1, for instance made of ferrite. The
coil core 1 is formed as a circular cylindrical rod. It contains two plane end
faces 2. The coil core 1 is surrounded by a coil winding 3, which features
numerous adjacent coil windings 4. The two ends 5, 6 of the coil winding 3
are tangentially led away from the coil core 1. The two ends 5, 6 can also
be longer, the illustration is only schematically considered. They lie in one
plane. This plane depicts the assembly side of the coil.
The windings 4 of the coil winding 3 are wound at a point 7 such that they
feature a gap in the longitudinal direction of the coil. This forms a gap
through which a part of the surface of the coil core 1 is visible.
Figure 2 shows the view of the coil of Figure 1 from below in Figure 1, thus
from a direction offset by 90°. Here, one sees how the gap between two
adjacent windings 4 occurs. The pitch of the windings is enlarged at this
point and finally led back to the normal value.
The unit depicted in Figures 1 and 2 of the coil core 1 and coil winding 3 is
placed in an injection die, together with a plurality of other similar units. In
this injection die, a holding element 8 is injection-molded onto the point 7 of
the gap between two adjacent windings 4 of the coil winding 3. The top side
9 of the holding element 8 as visible in Figure 3 is formed plane. In
longitudinal direction, the holding element 8 extends over the gap between
adjacent windings and at least over the two adjacent windings themselves,
preferably still up into the depression between the next windings. The
holding element 8 is made of injected plastic and is connected with the
core 1 and the coil windings. Through this the coil winding 3 is also
connected with the core 1. As for the embodiment of Figure 3 the holding
element 8 extends in the circumferential direction only via a part of the
coil.

P 45285 WO - 6 -
Figure 4 depicts an embodiment in which the holding element 18 is
injection molded around the entire circumference of the coil. Again, the
side of the holding element 18 is turned away from the assembly side, at
the bottom in Figure 4, where it is provided with a plane surface 9 on
which a gripper can act.
In the case of both embodiments the holding element 8, 18 only extends
over a part of the length of the coil so that the rest of the coil windings 3
remain free and can dissipate their heat content.
The attachment of a holding element 8, 18 on an electronic component
was described using a coil as an example. The attachment of such a
holding element can also occur for other electronic components.
The holding element 18 depicted in Figure 4 can be injection-molded from
a plastic that develops an adhesive effect at a temperature corresponding
to the soldering temperature. When the coil is placed on the printed circuit
board and then finally soldered, with the help of the holding element 18 it
will be bonded together with the surface of the printed circuit board. This
leads to a particularly good mechanical safety of the coil on the printed
circuit board. This type of connection by means of a holding element
made of a plastic that generates an adhesive effect at a higher
temperature can also find application for other electronic components, but
not for coils with a coil core.
What was depicted in Figures 1 to 4 for a horizontal configuration of coils is
obviously also possible for the upright configuration of coils. In the case of
horizontal configuration the axis of the coil core and the coil winding is
aligned parallel to the surface on which the coil is mounted. In the case of
upright configuration the axis is aligned perpendicularly to the surface.
Even with the upright configuration it is possible to align the holding

P 45285 WO - 7 -
element as it is depicted in Figures 1 to 3. Even then can a grasper hold the
contact surface 9 of the holding element and place the coil at the right
place.
It is, however, likewise possible to attach the holding element at a different
point. This should be depicted with reference to Figure 5 and Figure 6.
Figure 5 shows a face view of a coil in which the face surface 2 of coil core
1 is visible. The two ends 5, 16 of the coil winding are arranged differently
here contrary to how this was depicted in the preceding embodiments.
While connection end 5 still runs tangentially to the coil core 1, the
connection end 16 is aligned radially outwards and from there it is bent
downwards; see the side view of Figure 6. Whilst Figure 5 still shows the
coil with coil core prior to the injection molding of the holding element,
Figure 6 shows a side view with a holding element 28 injection-molded on
it, which is depicted here in a sectional view. As one can still derive from
Figure 5, here the winding 4 sections of the coil winding are arranged such
that the core 1 between them is free. One can injection mould a holding
element 28 at this point which then extends laterally so far that it then
overlaps the top-most coil winding 4. This also leads to having the coil
winding 3 fixed against displacement on the core 1.
The holding element 28 can enclose the face end of the coil, for instance,
when turned away from the mounting surface around the entire
circumference so that it forms a kind of cover. However, it can also be
sufficient that this holding element 28 only extends in the section of a
diameter above the face end, so that free parts remain on the right and
left side.
Also in the type of configuration of Figure 6, the holding element, in the
embodiment according to Figure 4, can similarly reach up to a point on the

P 45285 WO - 8 -
lower face surface 2 in Figure 6 if one intends to attain the same fixing
type as in the case of the embodiment according to Figure 4.
What was depicted with reference to Figures 4 to 6 as an example for one
coil can also be applied to another electronic component, for instance, to
capacitors that likewise feature connection ends, and in which the
components can be mounted with both the help of a grasper as well as
adhesion during soldering.

P 45285 WO - 9 -
Patent Claims
1. An electronic component which
1.1 is formed for automatic mounting and
1.2 features a holding element (8, 18, 28) which
1.3 is made of plastic and
1.4 is injection molded on the electronic component and
1.5 is formed as a holding point for a grasper.

2. A component according to Claim 1, formed as coil with a coil core (1)
and the coil winding (3) surrounds the coil core (1) with at least two
connection ends (5, 6).
3. A component according to Claim 2, wherein the holding element (8,
18, 28) grips both the coil core (1) as well as at least a point of a
winding (4) of the coil winding (3).
4. A component according to Claim 2 or 3, wherein at least at one point
(7) a gap is provided between two adjacent windings (4) of the coil
winding (3) in the longitudinal direction of the coil, whereby the
holding element (8,18) is injection molded on the coil core (1) at the
point (7) of the gap between the windings (4) and at least two of
these points (7) overlap with adjacent windings (4) of the coil winding
(3) in the longitudinal direction.
5. A component according to one of the preceding claims, wherein the
holding element (8, 18) is located on the side of the coil turned away
from the assembly side of the coil.
6. A component according to one of the preceding claims, wherein the
holding element (8, 18) extends over at least one part of the

P 45285 WO -10-
circumference of the component.
7. A component according to one of the preceding claims, wherein the
holding element (8, 18) extends over at least one part of the
circumference of the component.
8. A component according to one of the preceding Claims 1-6, wherein
the holding element (18) extends over the entire circumference of the
component.
9. A component according to one of the preceding claims, wherein the
holding element (8, 18) features a plane surface (9) on the side of the
component turned away from the assembly side.
10. A component according to one of the preceding claims, wherein the
holding element (8, 18) is injection molded from plastic that develops
an adhesive effect at soldering temperatures.
11. A method for mounting an electronic component, wherein

11.1 on the electronic component a holding element (8, 18, and 28)
is injection molded,
11.2 on the holding element a contact surface for a grasper is
formed and
11.3 that a component with the help of a grasper acting on the
contact surface moves said component to its assembly point.
12. A method according to Claim 11, wherein for mounting of a
component formed as a coil with a coil core (1), the windings (4) of
the coil winding at least at one point (7) are provided with a gap in
which the coil winding (3) of the coil core (1) is inserted, the coil core

P 45285 WO -11-
(1) and coil winding (3) are introduced in an injection die, and on the
point (7) of the gap between the two windings (4) and the two
windings (4) the holding element (8, 18) itself is injection molded.
13. A method according to Claim 11 or 12, wherein the holding element
(8, 18) is injection molded on the side of the component turned away
from the assembly side of the component.
14. A method according to one of Claims 11 to 13, wherein the holding
element (8, 18) is injection molded over at least one part of the
circumference of the component.
15. A method according to one of Claims 11 to 14, wherein the holding
element (8, 18) is injection molded over only one part of the length of
the component.
16. A method according to one of Claims 11 to 15, wherein the holding
element (18) is injection molded around the entire circumference of
the component.
17. A method according to one of Claims 11 to 16, wherein the holding
element (8, 18) is provided with a plane surface (9) on the side turned
away from the assembly side of the component.
18. A method according to one of Claims 11 to 17, wherein the holding
element is injection molded from plastic that develops an adhesive
effect at a temperature corresponding to the soldering temperature.

Disclosed is an electronic component, especially a coil with a coil core, in which the turns of the coil winding are spaced apart from each other at least at one point in the longitudinal direction of the coil. A plastic retaining
element which overlaps both the coil core and at least the two adjacent turns of the coil winding in a longitudinal direction is sprayed on in the area of said point, whereby a connection between the coil core and the coil winding is created at the same time. The retaining element can be sprayed around a closed circumference of the coil while covering only a portion of the coil in the longitudinal direction thereof. Preferably, the retaining element is placed approximately in the center relative to the longitudinal extension of the coil.

Documents:

04332-kolnp-2007-abstract.pdf

04332-kolnp-2007-claims.pdf

04332-kolnp-2007-correspondence others.pdf

04332-kolnp-2007-description complete.pdf

04332-kolnp-2007-drawings.pdf

04332-kolnp-2007-form 1.pdf

04332-kolnp-2007-form 2.pdf

04332-kolnp-2007-form 3.pdf

04332-kolnp-2007-form 5.pdf

04332-kolnp-2007-international publication.pdf

04332-kolnp-2007-international search report.pdf

04332-kolnp-2007-pct priority document notification.pdf

04332-kolnp-2007-pct request form.pdf

04332-kolnp-2007-translated copy of priority document.pdf

4332-KOLNP-2007-(04-03-2014)-ABSTRACT.pdf

4332-KOLNP-2007-(04-03-2014)-CLAIMS.pdf

4332-KOLNP-2007-(04-03-2014)-CORRESPONDENCE.pdf

4332-KOLNP-2007-(04-03-2014)-DESCRIPTION (COMPLETE).pdf

4332-KOLNP-2007-(04-03-2014)-DRAWINGS.pdf

4332-KOLNP-2007-(04-03-2014)-FORM-1.pdf

4332-KOLNP-2007-(04-03-2014)-FORM-2.pdf

4332-KOLNP-2007-(04-03-2014)-FORM-3.pdf

4332-KOLNP-2007-(04-03-2014)-FORM-5.pdf

4332-KOLNP-2007-(04-03-2014)-OTHERS.pdf

4332-KOLNP-2007-(04-03-2014)-PA.pdf

4332-KOLNP-2007-(04-03-2014)-PETITION UNDER RULE 137.pdf

4332-KOLNP-2007-(11-07-2013)-CORRESPONDENCE.pdf

4332-KOLNP-2007-CORRESPONDENCE OTHERS 1.1.pdf

4332-KOLNP-2007-CORRESPONDENCE OTHERS 1.2.pdf

4332-KOLNP-2007-CORRESPONDENCE OTHERS 1.3.pdf

4332-KOLNP-2007-CORRESPONDENCE OTHERS 1.4.pdf

4332-KOLNP-2007-FORM 26.pdf

4332-KOLNP-2007-INTERNATIONAL EXM REPORT.pdf

4332-KOLNP-2007-OTHER.pdf

4332-KOLNP-2007-PRIORITY DOCUMENT.pdf

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Patent Number

264022

Indian Patent Application Number

4332/KOLNP/2007

PG Journal Number

49/2014

Publication Date

05-Dec-2014

Grant Date

28-Nov-2014

Date of Filing

13-Nov-2007

Name of Patentee

WURTH ELEKTRONIK IBE GMBH

Applicant Address

GEWERBEPARK 8, 94136 THYRNUN

Inventors:

#	Inventor's Name	Inventor's Address
1	AUMULLER, RUPERT	MIMMINGER STRASSE 11 94491 HENGERSBERG

PCT International Classification Number

H01F 27/00

PCT International Application Number

PCT/EP2006/004206

PCT International Filing date

2006-05-05

PCT Conventions:

#	PCT Application Number	Date of Convention	Priority Country
1	10 2005 022927.1	2005-05-13	Germany