Title of Invention

WIRELESS IC DEVICE

Abstract

A wireless IC device main seclion (6) is arranged on a surface opposite to a surface which receives signals from a reader/writer. The wireless IC device main seclion (6) is provided with a loop-like electrode (7) on an insulating substrate, and an electromagnetically coupled module (1) coupled with the electrode. An eddy current (J) is generated over the entire conductor main surface of a metal article (60) due to the signals (magnetic field (Ho)) transmitted from the reader/writer, and a magnetic field (Hi) is generated in a direction vertical to the conductor main surface by the eddy current (J). Then, the loop-like electrode (7) is coupled with the magnetic field (Hi). The device functions as an RF-ID also to a signal from the main surface opposite to the wireless IC device main section (6). Thus, manufacturing cost of the metal article is reduced, and the wireless IC device wherein the metal article is used as a radiator is configured.

Full Text

DESCRIPTION WIRELESS IC DEVICE Technical Field [0001] The present invention relates to a wireless IC device for a radio frequency identification (RFID) system which allows noncontact data communication via electromagnetic waves. Background Art [0002] In recent years, RFID systems have been used as article management systems. For information transmission, an RFID system allows noncontact communication between a reader/writer that generates an induction field and a wireless IC device that is attached to an article and stores predetermined information. [0003] Fig. 1 is an external perspective view illustrating an example of a metal article to which an IC tag label described in Patent Document 1 is attached. [0004] An IC tag label 102 has a rectangular thin film-like shape. The IC tag 102 has an IC chip 102a at the center thereof and a thin-film antenna 102b in an outer region thereof. To accommodate the IC tag 102 in a floating state in a recessed portion 105a formed in a head 101a of a metal article 101, the IC tag 102 is secured to the undersurface of a nonmetal plate 103. The nonmetal plate 103 is fit into the recessed portion 105a and secured. The head 101a has a notch 106. [0005] With the configuration described above, a magnetic field generated by the antenna 102b in the IC tag 102 can be formed into a loop that passes through the notch 106, the exterior of the metal article 101, and the nonmetal plate 103 and returns to the antenna 102b. [0006] A metal article with an IC tag is thus produced. Patent Document 1: Japanese Unexamined Patent Application Publication No. 2003-6599 Disclosure of Invention Problems to be Solved by the Invention [0007] However, the IC tag and the metal article provided with the IC tag described in Patent Document 1 have the following problems. [0008] (1) Forming a complex structure, including the recessed portion and the notch, involves a long process and use of additional components. This leads to an increase in cost of manufacturing the metal article. [0009] (2) Producing the nonmetal plate for covering the recessed portion involves preparation of material different from that of the metal article, a long process, and use of additional material. This leads to an increase in cost of manufacturing a metal structure. Additionally, application distortion occurs at a portion where the nonmetal plate is secured to the metal article, due to a difference in thermal expansion coefficient. This may cause cracks or fractures. [0010] (3) Forming an antenna pattern is necessary to allow the IC tag to operate. [0011] Accordingly, an object of the present invention is to solve the problems described above, reduce cost of manufacturing a metal article, and provide a wireless IC device using the metal article as a radiator. Means for Solving the Problems [0012] To solve the problems described above, a wireless IC device according to the present invention is configured as follows. (1) A wireless IC device includes a high-frequency device being an electromagnetically coupled module or a wireless IC chip, the electromagnetically coupled module including the wireless IC chip and a feed circuit board coupled to an external circuit and electrically connected or electromagnetically coupled to the wireless IC chip; a radiation electrode acting as a radiator; and a loop electrode coupled to the high-frequency device and the radiation electrode, and having a loop plane perpendicular or inclined to a plane of the radiation electrode. [0013] (2) The loop electrode may be electromagnetically coupled to the radiation electrode with an insulating laye interposed therebetween. [0014] (3) The loop electrode may be electrically directly connected to the radiation electrode, and a part of the radiation electrode may serve also as the loop electrode. [0015] (4) The wireless IC device may further include a matching circuit between a mounting area of the high- frequency device and the loop electrode, the matching circuit being configured to directly electrically connect the high-frequency device to the loop electrode. [0016] (5) The wireless IC device may further include a resonant circuit and/or a matching circuit in the feed circuit board, [0017] (6) A resonance frequency of the resonant circuit may- be substantially equal to a frequency of a signal transmitted and received by the radiation electrode. [0018] (7) The high-frequency device or the loop electrode may be covered with plastic. [0019] (8) The high-frequency device and the loop electrode may be molded of plastic on the radiation electrode. [0020] (9) The radiation electrode may be a cylindrical metal article having a conductive layer. [0021] (10) The radiation electrode may be an electrode pattern formed on a circuit board inside electronic equipment. [0022] (11) The radiation electrode may be a metal plate provided in a component inside electronic equipment. [0023] (12) The loop electrode may be disposed on a surface opposite an electromagnetic wave transmission/reception surface outside the radiation electrode. [0024] (13) The loop electrode may be covered with the radiation electrode or a conductive surface including the radiation electrode. Advantages [0025] (1) Processing steps and components involved in forming, in a metal article, a notch, a recessed portion, a plate, etc., such as those illustrated in Fig. 1, are not necessary. Thus, there is substantially no cost increase associated with addition of the wireless IC device to the article. [0026] Since all or part of the metal article can be used as a radiator, it is possible to improve radiation characteristics. [0027] Use of the electromagnetically coupled module allows design of impedance matching between the wireless IC chip and the radiation electrode within the feed circuit board. This increases the degree of design freedom. [0028] The amount of coupling between the radiation electrode and the loop electrode according to the present invention is largest when the loop electrode is perpendicular to the radiation electrode. However, even if the loop plane of the loop electrode is inclined to the plane of the radiation electrode, the radiation electrode and the loop electrode are coupled to each other while the amount of coupling therebetween is smaller. Thus, it is possible to provide a high degree of flexibility in arranging the loop electrode relative to the radiation electrode. (2) When the loop electrode is coupled to the high- frequency device and electromagnetically coupled to the radiation electrode with an insulating layer interposed therebetween, matching between the high-frequency device and the loop electrode is easily achieved. Additionally, since the loop electrode and the radiation electrode are galvanically isolated from each other, high resistance to static electricity is achieved. [0030] (3) When the loop electrode is coupled to the high- frequency device and electrically directly connected to the radiation electrode, and a part of the radiation electrode serves also as the loop electrode, matching between the high-frequency device and the loop electrode is easily achieved. Additionally, since the loop electrode is strongly coupled to the radiation electrode, it is possible to provide high gain. [0031] (4) When a matching circuit is provided between a mounting area for mounting the high-frequency device and the loop electrode, the matching circuit can be used as an inductor for impedance matching between the radiation electrode and the high-frequency device. Thus, flexible and easy design of impedance matching in the wireless IC device is achieved. [0032] (5) Providing a resonant circuit in the feed circuit board improves frequency selectivity and allows an. operating frequency of the wireless IC device to be substantially determined by the self-resonant frequency. Accordingly, transmission and reception of energy of signals having a frequency used in the RFID system can be performed with a high degree of efficiency. Thus, radiation characteristics of the wireless IC device can be improved. [0033] Also, by providing a matching circuit in the feed circuit board, transmission and reception of energy of signals having a frequency used in the RFID system can be performed with a high degree of efficiency. [0034] (6) When a resonance frequency of the resonant circuit is made substantially equal to a frequency of a signal transmitted and received by the radiation electrode, transmission and reception of energy of signals having a frequency used in the RFID system can be performed with a high degree of efficiency. It is only necessary that the radiation electrode be simply coupled to the feed circuit board and have a size appropriate for necessary gain. The shape and material of the radiation electrode are not limited by the frequency used, and the radiation electrode can be used for any types of articles. [0035] (7) When the high-frequency device or the loop electrode is covered with plastic, the electromagnetically coupled module can be directly attached to a metal article. Thus, the degree of design freedom can be increased. [0036] (8) When the high-frequency device and the loop electrode are molded of plastic on the radiation electrode, the processing steps of covering the electromagnetically coupled module and bonding the electromagnetically coupled module to a metal article can be performed simultaneously. This makes it possible to reduce the number of processing steps and manufacturing cost. [0037] (9) When a metal article formed into a cylindrical shape and having a conductive layer is used as the radiation electrode, the metal article can be used as it is and substantially the entire metal article acts as a radiator. Therefore, even if a plurality of articles are stacked on top of each other, an ID for each article can be read. [0038] (10) When an electrode pattern formed on a circuit board inside electronic equipment is used as the radiation electrode, the circuit board inside the electronic equipment can be used as it is, and mounting of the high-frequency device becomes easy. [0039] (11) When a metal plate provided in a component, such as a liquid crystal display panel, inside electronic equipment is used as the radiation electrode, the component inside the electronic equipment can be used as it is. Thus, it is possible to prevent an increase in size and cost. [0040] (12) When the loop electrode is disposed on the surface opposite the electromagnetic wave transmission/reception surface outside the radiation electrode, that is, on the side opposite the surface on which the high-frequency device is provided, the wireless IC device can be disposed inside an article. Thus, the wireless IC device is protected by the radiation electrode and increases its durability. [0041] (13) When the loop electrode is covered with the radiation electrode or a conductive surface including the radiation electrode, the durability and environmental resistance of the wireless IC device are improved. Brief Description of Drawings [0042] [Fig. 1] Fig. 1 illustrates a configuration of a wireless IC device described in Patent Document 1. [Fig. 2] Fig. 2 illustrates a configuration of a wireless IC device according to a first embodiment of the present invention and an article provided with the wireless IC device. [Fig. 3] Fig. 3 is an enlarged view of a main part of the wireless IC device illustrated in Fig. 2. [Fig. 4] Fig. 4 is a schematic view illustrating a distribution of electromagnetic fields near the wireless IC device on the surface of the metal article illustrated in Fig. 2. [Fig. 5] Fig. 5(A) and Fig. 5(B) each illustrate a configuration of a wireless IC device according to a second embodiment of the present invention. [Fig. 6] Fig. 6 illustrates a configuration of a wireless IC device according to a third embodiment of the present invention and an article provided with the wireless IC device. [Fig. 7] Fig. 7 is an enlarged view of a main part of the wireless IC device for the article illustrated in Fig. 6 [Fig. 8] Fig. 8 illustrates a configuration of a wireless IC device according to a fourth embodiment of the present invention and an article provided with the wireless IC device. [Fig. 9] Fig. 9 is an enlarged view of a main part of the wireless IC device illustrated in Fig. 8. [Fig. 10] Fig. 10 illustrates a configuration of a wireless IC device according to a fifth embodiment of the present invention and an article provided with the wireless IC device. [Fig. 11] Fig. 11 is an enlarged view of a main part of the wireless IC device illustrated in Fig. 10. [Fig. 12] Fig. 12 illustrates a configuration of a wireless IC device according to a sixth embodiment of the present invention and an article provided with the wireless IC device. [Fig. 13] Fig. 13 is an enlarged view of a main part of the wireless IC device for the article illustrated in Fig. 12. [Fig. 14] Fig. 14 is an external perspective view of an electromagnetically coupled module in a wireless IC device. [Fig. 15] Fig. 15 is an exploded view illustrating an internal configuration of a feed circuit board. [Fig. 16] Fig. 16 is an equivalent circuit diagram of the feed circuit board. [Fig. 17] Fig. 17 illustrates a configuration of an electromagnetically coupled module in a wireless IC device according to a seventh embodiment of the present invention. [Fig. 18] Fig. 18 is a cross-sectional view illustrating a main part of the electromagnetically coupled module illustrated in Fig. 17. [Fig. 19] Fig. 19 illustrates a configuration of an electromagnetically coupled module in a wireless IC device according to an eighth embodiment of the present invention. [Fig. 20] Fig. 20 is an exploded perspective view illustrating a feed circuit board in a wireless IC device according to a ninth embodiment of the present invention. [Fig. 21] Fig. 21 is an equivalent circuit diagram of a main part of the wireless IC device illustrated in Fig. 20. [Fig. 22] Fig. 22 illustrates a configuration of a wireless IC device according to a tenth embodiment of the present invention and an article provided with the wireless IC device. [Fig. 23] Fig. 23 is a cross-sectional view illustrating a main part of a circuit board in a notebook personal computer provided with the wireless IC device illustrated in Fig. 22. [Fig. 24] Fig. 24 is a cross-sectional view illustrating a main part of a wireless IC device according to an eleventh embodiment of the present invention. [Fig. 25] Fig. 25(A) to Fig. 25(C) are cross-sectional views each illustrating a main part of a wireless IC device according to a twelfth embodiment of the present invention. [Fig. 26] Fig. 26 is a cross-sectional view illustrating a main part of a wireless IC device according to a thirteenth embodiment of the present invention. [Fig. 27] Fig. 27 is a cross-sectional view illustrating a main part of a wireless IC device according to a fourteenth embodiment of the present invention. [Fig. 28] Fig. 28 is a cross-sectional view illustrating a main part of a wireless IC device according to a fifteenth embodiment of the present invention. [Fig. 29] Fig. 29 is a cross-sectional view illustrating a main part of a wireless IC device according to a sixteenth embodiment of the present invention. Reference Numerals [0043] 1: electromagnetically coupled module 4: feed circuit board 5: IC chip 6: wireless-IC-device main part 7: loop electrode 8: impedance matching unit 9, 9a, 9b: metal ribbon 10: base 11: matching circuit 15: circuit board 16: electrode pattern 17, 18: electronic component 20: inductor electrode 21: molded plastic 25: capacitor electrode 30: loop electrode 35a to 35d: wireless-IC-chip mounting land 40: feed circuit board 41A to 41H: dielectric layer 42a: via hole 45a, 45b: inductor electrode 46, 47: inductor electrode 51: capacitor electrode 53 to 57: capacitor electrode 60 to 64, 70: metal article 65: insulating sheet 66, 67, 68, 69: wireless-IC-device main part 71, 72, 73: loop electrode segment 81 to 86: metal case 87, 88: metal tray 91, 92: packing 93: hinge 94: protrusion 95: clearance 96: rim C1, C2: capacitor L1, L1a, L1b, L2: inductor E: electric field H: magnetic field Best Modes for Carrying Out the Invention [0044] First Embodiment Fig. 2 is an external perspective view illustrating a wireless IC device according to a first embodiment of the present invention and a metal article provided with the wireless IC device. A metal article 60 is an article at least whose surface or near-surface layer is made of metal. [0045] A wireless-IC-device main part 6 is provided on a predetermined surface of the metal article 60. The component indicated by reference numeral 6 is not referred to as wireless IC device. This is because the wireless IC device is constituted not only by the component indicated by reference numeral 6, but also by a part of the metal surface of the metal article 60. [0046] Fig. 3 is an enlarged view of the wireless-IC-device main part. The wireiess-IC-device main part 6 has an insulating substrate, which is provided with a loop electrode 7 and an electromagnetically coupled module 1 coupled to the loop electrode 7. The wireless-IC-device main part 6 is placed such that a loop plane of the loop electrode 7 is substantially perpendicular to the metal article 60. [0047] The wireless-IC-device main part 6 having the loop electrode 7 is bonded to the metal article 60 with an insulating adhesive or the like. [0048] Fig. 4 schematically illustrates an example of a distribution of electromagnetic fields generated on the metal article 60 when the loop electrode 7 acts as an auxiliary radiator for transmission. In the drawing, dashed lines indicate loops of magnetic fields H, while solid lines indicate loops of electric fields E. The loop electrode 7 acts as an auxiliary radiator for magnetic fields, causes the magnetic fields H to be generated parallel to the surface of the metal article 60, and induces the electric fields E in a direction substantially perpendicular to the surface of the metal article 60. Then, electric field loops induce magnetic field loops and thus, this chain of induction events expands the distribution of electromagnetic fields. [0049] In the example described above, the loop electrode 7 acts as an auxiliary radiator for transmission. A high gain is also obtained when the loop electrode 7 acts as an auxiliary radiator for reception. [0050] The electromagnetically coupled module 1 illustrated in Fig. 3 includes a wireless IC chip and a feed circuit board that are described below. The wireless IC chip and the feed circuit board may either be electrically connected to each other or electromagnetically coupled to each other. For electromagnetic coupling, a capacitance is formed of a dielectric thin film or the like between electrodes of the wireless IC chip and the feed circuit board. By allowing the wireless IC chip and the feed circuit board to be coupled through the capacitance, it is possible to protect the wireless IC chip from static damage. [0051] When the feed circuit board is used, the electrode of the feed circuit board is electromagnetically coupled to both ends of the loop electrode 7. Alternatively, the electromagnetically coupled module 1 may be replaced with a single wireless IC chip. In both cases, since the loop electrode 7 is galvanically isolated from the metal article 60, the wireless IC device is highly resistant to static electricity. [0052] The loop electrode 7 may be of any shape which allows coupling between input and output terminals of the electromagnetically coupled module 1. [0053] Electric fields on a surface of a metal article are perpendicular to the surface of the metal article. Therefore, if the loop plane of the loop electrode 7 is inclined from the position perpendicular to the surface of the metal article 60, the strength of electric fields induced by magnetic fields of the loop electrode 7 is reduced, and thus the antenna gain is reduced. The gain increases as the loop plane of the loop electrode 7 approaches the position perpendicular to the metal article 60. However, even if the loop plane of the loop electrode 7 is inclined relative to the surface of the metal article 60, the metal article 60 still acts as a radiator. Therefore, the loop plane of the loop electrode 7 may be inclined as necessary. [0054] To allow the loop electrode 7 to be positioned substantially perpendicularly to the metal article 60, a recessed portion for accommodating an end of the feed circuit board may be formed on the surface of the metal article 60. In this case, the recessed portion may be internally provided with an insulating material, such as an insulating adhesive. [0055] In the first embodiment, the loop electrode 7 is directly bonded to the surface of the metal article 60. Alternatively, for example, the loop electrode 7 may be bonded onto a metal foil sheet or metal plate, which may then be bonded to the metal article 60. [0056] Second Embodiment Fig. 5(A) and Fig. 5(B) illustrate configurations of two wireless IC devices according to a second embodiment of the present invention. In the second embodiment, a matching circuit is placed between a mounting area of a high- frequency device and a loop electrode. The matching circuit allows the high-frequency device and the loop electrode to be directly electrically connected to each other. [0057] Referring to Fig. 5(A), a metal article 70 is an article at least whose surface or near-surface layer is made of metal. A loop electrode 73 is positioned such that the loop plane thereof is substantially perpendicular to the metal article 70. This allows the metal article 70 to act as a radiator. [0058] A wireless-IC-device main part 69 is internally- provided with a matching circuit 11 including a meander electrode, and metal ribbons 9a and 9b serving as a mounting area for mounting a high-frequency device (electromagnetically coupled module or wireless IC chip). [0059] By thus providing the matching circuit 11, the wireless IC chip can be directly mounted on the metal ribbons 9a and 9b. If the wireless IC chip is directly mounted on the loop electrode, the operating frequency of the wireless IC device is substantially determined by the loop electrode including the matching circuit 11. [0060] Fig. 5(B) illustrates a state in which the electromagnetically coupled module 1 is mounted on the metal ribbons 9a and 9b in the wireless-IC-device main part 69 illustrated in Fig. 5(A) . The configuration of the matching circuit 11, metal ribbons 9a and 9b serving as a mounting area of the electromagnetically coupled module, and loop electrode 73 is the same as that illustrated in Fig. 5(A). [0061] With this configuration, the loop electrode 73 acts as an auxiliary radiator for magnetic fields and is coupled to the metal article 70. Thus, through action similar to that illustrated in Fig. 4, the metal article 70 acts as a radiator. [0062] The metal article 70 illustrated in Fig. 5(A) and Fig. 5(B) may be, for example, a solid electrode formed on a circuit board inside a mobile phone terminal. [0063] Third Embodiment Fig. 6 is an external perspective view illustrating a wireless IC device according to a third embodiment of the present invention and a metal article provided with the wireless IC device. A metal article 61 is an article at least whose surface or near-surface layer is made of metal. [0064] In the example illustrated in Fig. 3, the entire loop electrode is provided on the substrate of the wireless-IC- device main part 6. In the example illustrated in Fig. 6, loop electrode segments 71 that constitute part of the loop electrode are provided on a substrate of a wireless-IC- device main part 66. Then, a part of the metal article 61 serves also as a part of the loop electrode. [0065] Fig. 7 is an enlarged view of the wireless-IC-device main part 66 illustrated in Fig. 6. The wireless-IC-device main part 66 has the substrate provided with the loop electrode segments 71 and 71 and the electromagnetically coupled module 1 coupled to the loop electrode segments 71 and 71. The configuration of the electromagnetically coupled module 1 is the same as that illustrated in Fig. 3. The loop electrode segments 71 and 71 constitute part of the loop electrode. A part of the surface of the metal article 61 serves also as a part of the loop electrode. In other words, the loop electrode segments 71 and 71 and the surface of the metal article 61 constitute the loop electrode, as indicated by L in the drawing. [0066] With this configuration, the loop electrode constituted by the loop electrode segments 71 and 71 and the surface of the metal article 61 acts as an auxiliary radiator for magnetic fields and is coupled to the metal article 61. Thus, through action similar to that illustrated in Fig. 4, the surface of the metal article 61 acts as a radiator. [0067] Fourth Embodiment Fig. 8 is an external view of a metal article provided with a wireless IC device according to a fourth embodiment of the present invention. A metal article 62 is, for example, a cylindrical metal can. Unlike the polyhedral metal articles illustrated as examples in Fig. 2 and Fig. 6, tuc metal article 62 illustrated as an example in Fig. 8 has a cylindrical shape. A wireless-IC-device main part 67 is attached to the periphery of the metal article 62. [0068] Fig. 9 is an enlarged view of a mounting area of the wireless-IC-device main part 67 illustrated in Fig. 8. The wireless-IC-device main part 67 includes loop electrode segments 72 and 72 and the electromagnetically coupled module 1 coupled to the loop electrode segments 72 and 72. Unlike the loop electrode segments 71 and 71 formed on the substrate as illustrated in Fig. 7, the loop electrode segments 72 and 72 illustrated in Fig. 9 are made of metal plates. The configuration of the electromagnetically coupled module 1 is the same as that illustrated in Fig. 3 and Fig. 7. [0069] With this configuration, the loop electrode constituted by the loop electrode segments 72 and 72 and the surface of the metal article 62 acts as an auxiliary radiator for magnetic fields and is coupled to the metal article 62. Thus, through action similar to that illustrated in Fig. 4, the surface of the metal article 62 acts as a radiator. [0070] When many articles are stacked, the above-described chain of induction events that occurs between electric and magnetic fields also occur among the articles, as long as a conductive part of each of the article acts as a radiator. Therefore, even if (or rather, particularly if) many articles are stacked, the wireless IC device acts as a high- gain wireless IC device. For example, in a state where an antenna of a reader/writer is placed close to a stack of soft drink cans to which the present invention is applied, IDs for all the soft drink cans in the stack can be read. [0071] Even in the case of a paper container, if it includes a conductive layer of aluminum or the like, the conductive layer acts as a radiator. [0072] Fifth Embodiment Fig. 10 is an external view of a metal article provided with a wireless IC device according to a fifth embodiment of the present invention. A metal article 63 is, for example, a cylindrical metal can. In the example illustrated in Fig. 8, the electromagnetically coupled module 1 is positioned on the periphery of the metal article 62. In the example illustrated in Fig. 10, metal ribbons 9 and 9 are provided in a part of the metal article 63, and the electromagnetically coupled module 1 is positioned on the metal ribbons 9 and 9. The electromagnetically coupled module 1 and the metal ribbons 9 and 9 may be covered with insulating material, such as plastic, or such material may be molded around the electromagnetically coupled module 1 and the metal ribbons 9 and 9. [0073] Fig. 11 is an enlarged view of a mounting area of the electromagnetically coupled module 1 illustrated in Fig. 10. As indicated by L in the drawing, a part of the metal article 63 and the metal ribbons 9 and 9 provided in a part of the metal article 63 act as a loop electrode. [0074] With this configuration, the metal ribbons 9 and 9 and a part of the metal article 63 act as an auxiliary radiator for magnetic fields and are coupled to the metal article 63. Thus, through action similar to that illustrated in Fig. 4, the metal article 63 acts as a radiator. [0075] Sixth Embodiment Fig. 12 is an external view of a metal article provided with a wireless IC device according to a sixth embodiment of the present invention. A metal article 64 is provided with a wireless-IC-device main part 68 on its surface. [0076] Fig. 13 is an enlarged view of the wireless-IC-device main part 68. The overall shape of the wireless-IC-device main part 68 is a so-called "tack index label" shape. An insulating sheet 65 internally has adhesive layers, between which the loop electrode 7 and the electromagnetically coupled module 1 are interposed. The configuration of the loop electrode 7 and electromagnetically coupled module 1 is the same as that illustrated in Fig. 3. [0077] In a manner as if a tack index label is affixed, the wireless-IC-device main part 68 is mounted on the metal article 64 such that the loop electrode 7 is perpendicular to the surface of the metal article 64 illustrated in Fig. 12. [0078] With the configuration described above, the loop electrode 7 acts as an auxiliary radiator for magnetic fields and is coupled to the metal article 64. Thus, through action similar to that illustrated in Fig. 4, the surface of the metal article 64 acts as a radiator. [0079] Here, a loop along the metal article acts as the loop electrode 7. Alternatively, as described in the foregoing embodiments, the metal article 64 may be configured to act both as a part of the loop electrode and a radiator. [0080] Seventh Embodiment Fig. 14 is an external perspective view of the electromagnetically coupled module 1 for a wireless IC device according to a seventh embodiment of the present invention. The electromagnetically coupled module 1 is applicable to the wireless IC device of any of the other embodiments. The electromagnetically coupled module 1 includes a wireless IC chip 5 and a feed circuit board 4. The feed circuit board 4 not only provides an impedance match between the wireless IC chip 5 and a metal article acting as a radiator, but also acts as a resonant circuit. [0081] Fig. 15 is an exploded view illustrating an internal configuration of the feed circuit board 4. The feed circuit board 4 is a multilayer substrate formed by stacking a plurality of dielectric layers each having an electrode pattern. A dielectric layer 41A at the top has wireless-IC- chip mounting lands 35a to 35d. A dielectric layer 41B has a capacitor electrode 51 electrically connected to the wireless-IC-chip mounting land 35b. A dielectric layer 41C has a capacitor electrode 53. A capacitor CI is formed between the capacitor electrode 51 and the capacitor electrode 53. Dielectric layers 4ID to 41H each have inductor electrodes 45a and 45b. The inductor electrodes 45a and 45b on a plurality of different layers form inductors LI and L2 that are double-spiral in overall shape and are strongly dielectrically coupled to each other. The dielectric layer 4IF has a capacitor electrode 54 electrically connected to the inductor LI. The capacitor electrode 54 is interposed between the capacitor electrode 53 and a capacitor electrode 55, and forms the capacitor electrode 55. Electrodes of adjacent dielectric layers are electrically connected to each other through corresponding via holes 42a to 42i. [0082] Fig. 16 is an equivalent circuit diagram illustrating the feed circuit board 4 of Fig. 15 and the loop electrode. Referring to Fig. 16, the capacitor CI corresponds to a capacitance formed between the capacitor electrodes 51 and 53 illustrated in Fig. 15; the capacitor C2 corresponds to a capacitance formed between the capacitor electrodes 54 and 53 and the capacitor electrode 55 illustrated in Fig. 15; and the inductors LI and L2 correspond to the inductor electrodes 45a and 45b illustrated in Fig. 15. [0083] The capacitor electrode 55 is parallel to and opposite an end of the loop electrode (i.e., the loop electrode 7 in the example of Fig. 3) . The capacitor electrode 55 forms a capacitance between itself and this end of the loop electrode 7. The inductor electrodes LI and L2 are electromagnetically coupled to the other end of the loop electrode 7. [0084] In the feed circuit board 4, a resonance frequency is determined by a resonant circuit formed by the inductance elements LI and L2 and their stray capacitance. The frequency of a signal emitted from a radiation electrode is substantially determined by the self-resonant frequency of the resonant circuit. [0085] The electromagnetically coupled module 1 formed by mounting the wireless IC chip 5 on the feed circuit board 4 receives, through the radiation electrode, high-frequency signals (e.g., in the UHF frequency band) emitted from a reader/writer (not shown), causes the resonant circuit in the feed circuit board 4 to resonate, and supplies received signals only in a predetermined frequency band to the wireless IC chip 5. At the same time, the electromagnetically coupled module 1 extracts predetermined energy from the received signals, uses the extracted energy as a drive source to match information stored in the wireless IC chip 5 to a predetermined frequency in the resonant circuit, and transmits the information to the radiation electrode, from which the information is transmitted (transferred) to the reader/writer. [0086] Thus, providing a resonant circuit in the feed circuit board improves frequency selectivity and allows an operating frequency of the wireless IC device to be substantially determined by the self-resonant frequency. Accordingly, transmission and reception of energy of signals having a frequency used in the RFID system can be performed with a high degree of efficiency. At the same time, it is possible to set an optimum resonance frequency for the shape and size of the radiator, and thus to improve the radiation characteristics of the wireless IC device. [0087] Eighth Embodiment Fig. 17 illustrates a configuration of an electromagnetically coupled module for a wireless IC device according to an eighth embodiment of the present invention. Referring to Fig. 17, a loop electrode 3 0 is formed on an inner layer of a base 10. An insulating layer is disposed over two open ends 30a and 3 0b of the loop electrode 30, and an inductor electrode 20 and a capacitor electrode 25 are disposed over the insulating layer. The inductor electrode 2 0 has a spiral shape and its inner end is connected to the capacitor electrode 2 5 as described below. [0088] As illustrated in an enlarged view in Fig. 17, the wireless IC chip 5 is mounted on the ends of the inductor electrode 20 and capacitor electrode 25. Specifically, the wireless-IC-chip mounting land 35a is formed at the end of the inductor electrode 20, the wireless-IC-chip mounting land 3 5b is formed at the end of the capacitor electrode 25, and the wireless-IC-chip mounting lands 3 5c and 3 5d are formed additionally. Then, the wireless IC chip 5 is mounted on the wireless-IC-chip mounting lands 35a to 35d. [0089] Fig. 18 is a cross-sectional view taken along line II- II of Fig. 17. Referring to Fig. 18, a wire 21 connects the inductor electrode 20 and the capacitor electrode 25. [0090] As illustrated in Fig. 19, as a modification of the eighth embodiment, the wireless IC chip 5 and the loop electrode 3 0 may be electrically connected through impedance matching units 8 and 8. [0091] The impedance matching units 8 and 8 may be separately produced using a ceramic multilayer substrate, a glass epoxy substrate, or the like and attached to the loop electrode 3 0 by a conductive adhesive. Thus, the impedance matching units 8 and 8 allow electrical connection between the wireless IC chip 5 and the loop electrode 30. [0092] Ninth Embodiment Fig. 20 is an exploded perspective view illustrating a feed circuit board 4 0 in a wireless IC device according to a ninth embodiment of the present invention. Fig. 21 is an equivalent circuit diagram of Fig. 20. [0093] The feed circuit board 4 0 is a multilayer substrate formed by stacking a plurality of dielectric layers each having an electrode pattern. The dielectric layer 41A at the top has the wireless-IC-chip mounting lands 35a to 35d. The dielectric layer 41B has the capacitor electrode 51 electrically connected to the wireless-IC-chip mounting land 35b. The dielectric layer 41C has the capacitor electrode 53. The capacitor CI is formed between the capacitor electrode 51 and the capacitor electrode 53. The dielectric layers 4ID to 41H each have the inductor electrodes 4 5a and 45b. The inductor electrodes 45a and 45b form the inductor LI that is double-spiral in overall shape. [0094] The dielectric layer 41F has the capacitor electrode 54 electrically connected to the inductor LI. The capacitor electrode 54 is interposed between the capacitor electrodes 53 and 55 (56) , and forms a capacitor. The dielectric layer 41H has the capacitor electrode 55 electrically connected to the capacitor electrode 53. [0095] Dielectric layers 41J to 41N each have inductor electrodes 46 and 47. The inductor electrodes 46 and 47 form the loop electrode L2 winding multiple times. Electrodes of adjacent dielectric layers are electrically connected to each other through corresponding via holes 4 2a to 42m. [0096] That is, the feed circuit board 40 is obtained by adding a loop electrode to the feed circuit board 4 illustrated in Fig. 15. [0097] Referring to Fig. 21, the capacitor C1 corresponds to a capacitance formed between the capacitor electrodes 51 and 53 illustrated in Fig. 2 0; the capacitor C2 corresponds to a capacitance formed between the capacitor electrodes 54 and 53 and the capacitor electrode 55 illustrated in Fig. 20; inductors Lla and Lib correspond to the inductor electrodes 45a and 45b illustrated in Fig. 20; and the inductor L2 corresponds to the inductor electrodes 46 and 47 illustrated in Fig. 20. [0098] Tenth Embodiment Fig. 22 is an external perspective view of a notebook personal computer provided with a wireless IC device. Fig. 23 is a cross-sectional view illustrating a main part of a circuit board inside the notebook personal computer. Electronic components 17 and 18 and the wireless-IC-device main part 6 are mounted on a circuit board 15 inside the notebook personal computer in a direction substantially- perpendicular to the circuit board 15. An electrode pattern 16 is formed on an upper surface of the circuit board 15. The electrode pattern 16 is coupled to the wireless-IC- device main part 6 and acts as a radiator. [0099] As another example, a wireless IC device may be formed on a metal panel on the back of a component (e.g., liquid crystal panel) inside the notebook personal computer illustrated in Fig. 22. That is, the wireless IC device according to any of the first to tenth embodiments may be applied to cause the metal panel to act as a radiator. [0100] The same is applicable to any metal articles (e.g., a safe and a container) in addition to those described in the foregoing embodiments. [0101] Eleventh Embodiment Fig. 24 is a cross-sectional view illustrating a main part of a wireless IC device according to an eleventh embodiment of the present invention. In the example described in the first embodiment with reference to Fig. 2, the wireless-IC-device main part 6 is mounted, on the surface (i.e. , electromagnetic wave transmission/reception surface outside the metal article 60) for receiving signals from the reader/writer. In the eleventh embodiment, the wireless-IC-device main part 6 is mounted on a surface opposite the surface for receiving signals from the reader/writer. [0102] As in the case of the first embodiment, the wireless- IC-device main part 6 has an insulating substrate, which is provided with the loop electrode 7 and the electromagnetically coupled module 1 coupled to the loop electrode 7. [0103] With this configuration, a signal (magnetic field Ho) from the reader/writer causes an eddy current J to flow across the conductor principal plane of the metal article 60. The eddy current J causes a magnetic field Hi to be generated in a direction perpendicular to the conductor principal plane of the metal article 60. Then, the loop electrode 7 is coupled to the magnetic field Hi. Thus, the wireless-IC-device main part 6 functions as an RFID tag even for signals from the principal plane opposite the wireless- IC-device main part 6. [0104] An article on which the wireless-IC-device main part 6 is mounted is not limited to a metal article, but may be a.ny article having a surface made of conductive material, such as carbon. The loop electrode 7 may either be in contact with or separated from the conductive surface of the article. [0105] Twelfth Embodiment Fig. 25(A) to Fig. 25(C) are cross-sectional views illustrating a main part of a wireless IC device according to a twelfth embodiment of the present invention. In the example described in the first embodiment with reference to Fig. 2, the wireless-IC-device main part 6 is mounted on the surface (i.e., outer surface) of the metal article 60. However, in the twelfth embodiment, the wireless-IC-device main part 6 is mounted inside (i.e., on the inner surface) of the metal article 60. [0106] Fig. 25(A) illustrates metal cases (half cases) 81 and 82 having joining parts protruding inside the cases. Fig. 25(B) illustrates the metal cases (half cases) 81 and 82 having joining parts protruding outside the cases. Fig. 25(C) illustrates the metal cases (half cases) 81 and 82 having a hinge mechanism for maintaining conductivity at one end. In every case, corresponding joining parts are joined to each other with an electrical insulator (e.g., rubber packing) or an electrical resistor interposed therebetween. [0107] As in the case of the first embodiment, the wireless- IC-device main part 6 has an insulating substrate, which is provided with the loop electrode 7 and the electromagnetically coupled module 1 coupled to the loop electrode 7. [0108] With this configuration, as in the case of the eleventh embodiment, a signal (magnetic field) from the reader/writer causes an eddy current to flow across the conductor principal plane of the metal cases 81 and 82. The eddy current causes a magnetic field to be generated in a direction perpendicular to the conductor principal plane of the metal cases 81 and 82. Then, the magnetic field is coupled to the loop electrode 7. This allows the metal cases 81 and 82 to be used as metal articles having an internal RFID tag. [0109] In the examples illustrated in Fig. 25(A) and Fig. 25 (B) , the upper metal, case 82 is galvanically isolated from the metal case 81 in which the wireless-IC-device main part 6 is provided. However, since a chain of electric field loops and magnetic field loops spreads along the conductor plane of the metal cases, the upper metal case 82 also acts as a radiator. [0110] Thus, by providing the wireless IC device 6 inside a case, the durability and environmental resistance of the wireless IC device are improved. [0111] The same applies to the situation where the wireless- IC-device main part 6 illustrated in Fig. 25(A) to Fig. 25(C) is, for example, an RFID tag for a food product and the metal cases 81 and 82 correspond to a housing of a refrigerator or freezer. Here, it is possible to externally read information about each food product without opening the door of the refrigerator or freezer. [0112] The same also applies to the situation where the wireless-IC-device main part 6 illustrated in Fig. 25(A) to Fig. 25(C) is, for example, an RFID tag for an electronic component or circuit board and the metal cases 81 and 82 correspond to a housing of a personal computer or mobile phone terminal. Here, it is possible to externally read information about each electronic component or circuit board without opening the housing of the personal computer or mobile phone terminal. [0113] Although Fig. 25(A) to Fig. 25(C) illustrate can-shaped metal cases as examples, the same also applies to tubular or cup-shaped conductive cases. For example, by providing the wireless-IC-device main part 6 inside a carbon shaft of a golf club, the golf club can be used as a golf club having an internal RFID tag that is externally readable and writable. [0114] Thirteenth Embodiment Fig. 26 is a cross-sectional view illustrating a main part of a wireless IC device according to a thirteenth embodiment of the present invention. In the example of Fig. 26, metal cases 83 and 84 that are surface-coated with electrical insulating material or electrical resistive material are used. The other configuration is the same as that illustrated in Fig. 25(A) to Fig. 25(C). [0115] Thus, an interface between the upper and lower cases may be insulated or substantially insulated by the coating over the case surface. [0116] Fourteenth Embodiment Fig. 27 is a cross-sectional view illustrating a main part of a wireless IC device according to a fourteenth embodiment of the present invention. In the exa.mple of Fig = 27, protrusions 94 at joining parts between a lower metal case 8 5 and an upper metal case 86 create a clearance 95. The other configuration is the same as that illustrated in Fig. 25(A) to Fig. 25(C). [0117] Thus, even if there is a clearance in metal cases, the metal article can be used as an article having an internal RFID tag, through action similar to that described above. [0118] Fifteenth Embodiment Fig. 28 is a cross-sectional view illustrating a main part of a wireless IC device according to a fifteenth embodiment of the present invention. In the example of Fig. 28, the wireless-IC-device main part 6 is mounted inside a metal tray 87 to form a metal tray having an RFID tag. The metal tray 87 is surface- coated with electrical insulating material or electrical resistive material. In the example of Fig. 28, a plurality of metal trays are stacked on top of each other. [0119] By stacking the metal trays as described above, the metal trays are galvanically isolated from each other by the coating of the electrical insulating material or electrical resistive material, and each wireless-IC-device main part 6 is surrounded by metal material. However, as in the cases of the twelfth to fourteenth embodiments described above, the reader/writer can communicate with an RFID tag in each metal tray. [0120] Sixteenth Embodiment Fig. 29 is a cross-sectional view illustrating a main part of a wireless IC device accordincr to a sixteenth embodiment of the present invention. In the example of Fig. 29, the wireless-IC-device main part 6 is mounted inside a metal tray 88 to form a metal tray having an RFID tag. The metal tray 8 8 has a rim 96 of electrical insulating material or electrical resistive material at its edge. In the example of Fig. 29, a plurality of metal trays are stacked on top of each other. [0121] By stacking the metal trays as described above, the metal trays are galvanically isolated from each other by the electrical insulating material or electrical resistive material, and each wireless-IC-device main part 6 is surrounded by metal material. However, as in the cases of the twelfth to fourteenth embodiments described above, the reader/writer can individually communicate with an RFID tag in each metal tray. [0122] In the examples described with reference to Fig. 2 5 to Fig. 29, there are portions galvanically isolated by the electrical insulating or resistive material. However, the wireless-IC-device main part 6 provided inside a case or housing tightly surrounded by conductive material can still be used as an RFID tag while the antenna gain may be slightly reduced. [0123] A loop electrode of rectangular shape is used in the embodiments described above. However, the loop electrode may be of any shape, such as circular, elliptical, or polygonal shape, depending on the article in which the electrode is contained. Additionally, the loop electrode may extend from the bottom to the side of a case. Even when the shape of the signal transmission/reception surface is thus modified, the wireless-IC-device main part 6 still functions as an RFID tag. [0124] Also, in the embodiments described above, a loop electrode is formed of a single-layer conductive pattern. However, the loop electrode may have a multilayer coil structure, instead of a single-layer loop structure. [0125] A loop electrode forms an open loop in the embodiments described above. However, the loop electrode may form a closed loop, as long as the loop electrode is configured to be magnetically coupled to an inductor in a feed circuit board. That is, an inductor pattern parallel to the loop plane of the loop electrode may be formed on the feed circuit board such that the inductor pattern is magnetically coupled to the loop electrode forming a closed loop. [0126] Also, in the embodiments described above, a wireless- IC-device main part having a loop electrode is in contact with a predetermined surface of a case. However, the wireless-IC-device main part may be spaced from the predetermined surface, or may be hung from the inner surface of the case (i.e., suspended in the air inside the case). [0127] Also, in the embodiments described above, a wireless- IC-device main part having a loop electrode is mounted on a principal surface of a case, the principal surface having a large area. However, the wireless-IC-device main part may be mounted on a side of the case. CLAIMS 1. A wireless IC device comprising: a high-frequency device being an electromagnetically coupled module or a wireless IC chip, the electromagnetically coupled module including the wireless IC chip and a feed circuit board coupled to an external circuit and electrically connected to or electromagnetically coupled to the wireless IC chip; a radiation electrode acting as a radiator; and a loop electrode coupled to the high-frequency device and the radiation electrode, and having a loop plane perpendicular or inclined to a plane of the radiation electrode. 2. The wireless IC device according to claim 1, wherein the loop electrode is electromagnetically coupled to the radiation electrode with an insulating layer interposed therebetween. 3. The wireless IC device according to claim 1, wherein the loop electrode is electrically directly connected to the radiation electrode, and a part of the radiation electrode serves also as the loop electrode. 4. The wireless IC device according to any one of claims 1 to 3, further comprising a matching circuit between a mounting area of the high-frequency device and the loop electrode, the matching circuit being configured to directly electrically connect the high-frequency device to the loop electrode. 5. The wireless IC device according to any one of claims 1 to 4, further comprising a resonant circuit and/or a matching circuit in the feed circuit board. 6. The wireless IC device according to claim 5, wherein a resonance frequency of the resonant circuit is substantially equal to a frequency of a signal transmitted and received by the radiation electrode. 7. The wireless IC device according to any one of claims 1 to 6, wherein the high-frequency device or the loop electrode is covered with plastic. 8. The wireless IC device according to any one of claims 1 to 6, wherein the high-frequency device and the loop electrode are molded of plastic on the radiation electrode. 9. The wireless IC device according to any one of claims 1 to 8, wherein the radiation electrode is a cylindrical metal article having a conductive layer. 10. The wireless IC device according to any one of claims 1 to 8, wherein the radiation electrode is an electrode pattern formed on a circuit board inside electronic equipment. 11. The wireless IC device according to any one of claims 1 to 8, wherein the radiation electrode is a metal plate provided in a component inside electronic equipment. 12. The wireless IC device according to any one of claims 1 to 11, wherein the loop electrode is disposed on a surface opposite an electromagnetic wave transmission/reception surface outside the radiation electrode. 13. The wireless IC device according to claim 12, wherein the loop electrode is covered with the radiation electrode or a conductive surface including the radiation electrode. A wireless IC device main seclion (6) is arranged on a surface opposite to a surface which receives signals from a reader/writer. The wireless IC device main seclion (6) is provided with a loop-like electrode (7) on an insulating substrate, and an electromagnetically coupled module (1) coupled with the electrode. An eddy current (J) is generated over the entire conductor main surface of a metal article (60) due to the signals (magnetic field (Ho)) transmitted from the reader/writer, and a magnetic field (Hi) is generated in a direction vertical to the conductor main surface by the eddy current (J). Then, the loop-like electrode (7) is coupled with the magnetic field (Hi). The device functions as an RF-ID also to a signal from the main surface opposite to the wireless IC device main section (6). Thus, manufacturing cost of the metal article is reduced, and the wireless IC device wherein the metal article is used as a radiator is configured.

Documents:

799-KOLNP-2009-(17-09-2014)-ABSTRACT.pdf

799-KOLNP-2009-(17-09-2014)-ANNEXURE TO FORM 3.pdf

799-KOLNP-2009-(17-09-2014)-CLAIMS.pdf

799-KOLNP-2009-(17-09-2014)-CORRESPONDENCE.pdf

799-KOLNP-2009-(17-09-2014)-DRAWINGS.pdf

799-KOLNP-2009-(17-09-2014)-FORM-1.pdf

799-KOLNP-2009-(17-09-2014)-FORM-13.pdf

799-KOLNP-2009-(17-09-2014)-FORM-2.pdf

799-KOLNP-2009-(17-09-2014)-FORM-3.pdf

799-KOLNP-2009-(17-09-2014)-FORM-5.pdf

799-KOLNP-2009-(17-09-2014)-PA.pdf

799-KOLNP-2009-(17-09-2014)-PETITION UNDER RULE 137.pdf

799-KOLNP-2009-(17-12-2014)-CORRESPONDENCE.pdf

799-KOLNP-2009-(17-12-2014)-ENGLISH TRANSLATION.pdf

799-kolnp-2009-abstract.pdf

799-KOLNP-2009-ASSIGNMENT.pdf

799-kolnp-2009-claims.pdf

799-KOLNP-2009-CORRESPONDENCE 1.1.pdf

799-kolnp-2009-correspondence.pdf

799-kolnp-2009-description (complete).pdf

799-kolnp-2009-drawings.pdf

799-kolnp-2009-form 1.pdf

799-kolnp-2009-form 18.pdf

799-KOLNP-2009-FORM 3 1.1.pdf

799-kolnp-2009-form 3.pdf

799-kolnp-2009-form 5.pdf

799-kolnp-2009-gpa.pdf

799-kolnp-2009-international publication.pdf

799-kolnp-2009-international search report.pdf

799-kolnp-2009-others pct form.pdf

799-kolnp-2009-pct priority document notification.pdf

799-kolnp-2009-specification.pdf

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