Title of Invention

ELASTIC BOUNDARY-WAVE DEVICE

Abstract

Provided is an elastic boundary-wave device, which utilizes elastic boundary-waves to propagate through a boundary between LiNbO3 or LiTaO3 and a dielectric layer so that the loss is reduced by making use of SH-type elastic boundary-waves although the electrode film is made thin. In the elastic boundary-wave device, a plurality of grooves (1b) are formed in the upper face of a LiNbO3 substrate (1) and are filled with a metallic material to form an electrode film (3) including IDT electrodes. A dielectric layer (4) such as a SiO2 film is formed to cover the upper face (1a) of the piezoelectric substrate (1) and the electrode film (3), and is flattened on its surface. The thickness of the electrode film (3), the Euler's angle (θ) (0 degrees, θ, -45 degrees - +45 degrees) of the LiNbO3 substrate and the thickness of the dielectric layer (4) are defined within any of the ranges tabulated in the following Table 1.

Full Text

DESCRIPTION ELASTIC BOUNDARY-WAVE DEVICE Technical Field [0001] The present invention relates to boundary acoustic wave devices used as, for example, resonators or band-pass filters. The present invention particularly relates to a boundary acoustic wave device including a piezoelectric body, an electrode formed by embedding a metal in the upper surface of the piezoelectric body, and a dielectric body extending over the piezoelectric body and the electrode. Background Art [0002] Duplexers (DPXs) and RF filters used in mobile communication systems need to have both broad band-pass properties and good temperature properties. Conventional boundary acoustic wave devices used for such DPXs or RF filters each include a piezoelectric substrate made of 36- 50 degrees rotated Y-plate X-propagation LiTaO3. The piezoelectric substrate has a temperature coefficient of frequency of -45 to -35 ppm/°C. A known technique for improving temperature properties is to form a SiO2 layer having a positive temperature coefficient of frequency over IDT electrodes arranged on the piezoelectric substrate. [0003] In such a structure that the SiO2 layer extends over the IDT electrodes, unevenness occurs between fingers of the IDT electrodes and spaces between the electrode fingers. That is, a surface of the SiO2 layer cannot avoid having differences in height between the IDT electrodes and spaces therebetween. Therefore, there is a problem in that surface irregularities of the SiO2 layer cause the deterioration of insertion loss. [0004] An increase in the thickness of the IDT electrodes necessarily increases the height of the irregularities. Therefore, the IDT electrodes cannot be increased in thickness. [0005] In recent years, boundary acoustic wave devices have been replacing surface acoustic wave devices and have been attracting much attention because the boundary acoustic wave devices are useful in manufacturing small-size packages. Non-patent Document 1 below discloses a boundary acoustic wave device including a LiNbO3 substrate, IDT electrodes, and a SiO2 layer defining a dielectric body laminated in that order. The IDT electrodes have a large thickness such that the acoustic velocity of an SH-type boundary acoustic wave propagating between the LiNbO3 substrate and the SiO2 layer is less than that of a slow transverse wave propagating in the SiO2 layer; hence, the SH-type boundary acoustic wave is nonleaky. Fig. 3 of Non-patent Document 1 shows that the thickness of an IDT electrode that is sufficient for an SH-type boundary acoustic wave to be nonleaky is 0.15λ or more when the IDT electrode is made of Al, or 0.04λ or more when the IDT electrode is made of one of Cu, Ag, and Au, wherein λ represents the wavelength of the SH-type boundary acoustic wave. Non-patent Document 1: "RF Filter using Boundary Acoustic Wave" (Proc. Symp. Ultrason. Electron., Vol. 26, pp. 25-26 (2005/11)) Disclosure of Invention [0006] When boundary acoustic wave devices, as well as the boundary acoustic wave device disclosed in Non-patent Document 1, include IDT electrodes which are made of Au and which have a thickness of 0.04λ or more, frequency properties of the boundary acoustic wave devices vary significantly due to differences in thickness between the electrodes. Therefore, it has been difficult to manufacture boundary acoustic wave devices having good frequency properties with high reproducibility. [0007] In view of the foregoing circumstances, it is an object of the present invention to provide a boundary acoustic wave device which includes electrodes having reduced thickness, which can confine an SH-type boundary acoustic wave between a piezoelectric body and a dielectric body, and which has low loss. [0008] A first aspect of the present invention provides a boundary acoustic wave device that includes a LiNbO3 substrate which has a plurality of grooves formed in the upper surface thereof and which has Euler angles (0°, θ, - 45° to +45°), electrodes formed by filling the grooves with a metal material, and a dielectric layer formed over the LiNbO3 substrate and the electrodes. The upper surface of the dielectric layer is flat. The metal material used to form the electrodes is at least one selected from the group consisting of Al, Ti, Ni, Cr, Cu, W, Ta, Pt, Ag, and Au. Al and Ti are grouped into a first group. Ni and Cr are grouped into a second group. Cu, W, Ta, Pt, Ag, and Au are grouped into a third group. The thickness of the electrodes made of the metal materials assigned to each group, θ of the Euler angles of the LiNbO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 1 below. [0009] [Table 1] [0010] In the boundary acoustic wave device of the first aspect, the thickness of the electrodes, θ of the Euler angles of the LiNbO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 2 below. [0011] [0012] A second aspect of the present invention provides a boundary acoustic wave device that includes a LiTaO3 substrate which has a plurality of grooves formed in the upper surface thereof and which has Euler angles (0°, θ, - 45° to +45°); electrodes formed by filling the grooves with a metal material; and a dielectric layer formed over the LiTaO3 substrate and the electrodes. The upper surface of the dielectric layer is flat. The metal material used to form the electrodes is at least one selected from the group consisting of Al, Cu, Au, Ta, and Pt. The thickness of the electrodes, θ of the Euler angles of the LiTaO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 3 below. [0013] [0014] In the boundary acoustic wave device according to the second aspect, the thickness of the electrodes, θ of the Euler angles of the LiTaO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 4 below. [0015] [0016] In the boundary acoustic wave device according to each aspect, the dielectric layer is made of silicon dioxide. Since silicon dioxide has a positive temperature coefficient of frequency TCF and LiNbO3 and LiTaO3 have a negative temperature coefficient of frequency TCF, a boundary acoustic wave device having a temperature coefficient of frequency with a small absolute value and good temperature properties can be provided. (Advantages) [0017] In the boundary acoustic wave device according to the first aspect, the electrodes are formed by filling the grooves, which are formed in the upper surface of the LiNbO3 substrate, with the metal material and the dielectric layer is formed over the LiNbO3 substrate and the electrodes, the thickness of the electrodes can be adjusted by varying the depth of the grooves. Therefore, there are substantially no unevenness between electrode-bearing portions and electrode- free portions; hence, the upper surface of the dielectric layer can be readily planarized and the insertion loss can be reduced. [0018] In addition, the metal material used to form the electrodes is at least one of the metal materials of the first group, those of the second group, and those of the third group and θ of the Euler angles of the LiNbO3 substrate, the thickness of the dielectric layer, and the thickness of the electrodes are within any of ranges shown in Table 1. Therefore, as is clear from experiments below, an SH-type boundary acoustic wave can be nonleaky even if the electrodes have a reduced thickness. Hence, a boundary acoustic wave device which uses such a SH-type boundary acoustic wave and which has low loss can be provided. [0019] When the thickness of the electrodes, 0 of the Euler angles, and the thickness of the dielectric layer are any of those shown in Table 2, the loss of the boundary acoustic wave device can be further reduced. [0020] According to the second aspect, the electrodes are formed by filling the grooves, which are formed in the upper surface of the LiTaO3 substrate, with the metal material and the dielectric layer is formed over the LiNbO3 substrate and the electrodes, there are substantially no unevenness between electrode-bearing portions and electrode-free portions; hence, the upper surface of the dielectric layer is flat and therefore the insertion loss can be reduced. In addition, the material used to form the electrodes is at least one of metal materials such as Al, Cu, Au, Ta, and Pt and the thickness of the electrodes, θ of the Euler angles of the LiTaO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 2. Therefore, an SH-type boundary acoustic wave can be nonleaky even if the electrodes have a reduced thickness. Hence, a boundary acoustic wave device which uses such a SH-type boundary acoustic wave and which has low loss can be provided. [0021] In particular, when the thickness of the electrodes, θ of the Euler angles, and the thickness of the dielectric layer are within any of the ranges shown in Table 4, the loss of the boundary acoustic wave device can be further reduced. Brief Description of Drawings [0022] [Fig. 1] Figs. 1(a) to 1(f) are front sectional views illustrating a method for manufacturing a boundary acoustic wave device according to an embodiment the present invention and the structure of the boundary acoustic wave device. [Fig. 2] Fig. 2 is a schematic plan view of an electrode structure of the boundary acoustic wave device shown in Fig. 1. [Fig. 3] Fig. 3 is a graph showing the relationship between the normalized thickness H/λ of electrode layers formed by filling grooves, disposed in LiNbO3 substrates which are included in boundary acoustic wave devices according to this embodiment and which have Euler angles (0°, 103°, 0°), with Al or Ti and the attenuation constant a of the boundary acoustic wave devices. [Fig. 4] Fig. 4 is a graph showing the relationship between the normalized thickness H/λ, of electrode layers formed by filling grooves, disposed in LiNbO3 substrates which are included in boundary acoustic wave devices according to this embodiment and which have Euler angles (0°, 103°, 0°), with Ni or Cr and the attenuation constant a of the boundary acoustic wave devices. [Fig. 5] Fig. 5 is a graph showing the relationship between the normalized thickness H/λ, of electrode layers formed by filling grooves, disposed in LiNbO3 substrates which are included in boundary acoustic wave devices according to this embodiment and which have Euler angles (0°, 103°, 0°), with each metal material of a third group and the attenuation constant α of the boundary acoustic wave devices. [Fig. 6] Fig. 6 is a graph showing the relationship between θ of the Euler angles of LiNbO3 substrates and the attenuation constant a of electrodes which are made of Al and which are varied in normalized thickness. [Fig. 7] Fig. 7 is a graph showing the relationship between 9 of the Euler angles of LiNbO3 substrates and the attenuation constant a of electrodes which are made of Ni and which are varied in normalized thickness. [Fig. 8] Fig. 8 is a graph showing the relationship between 0 of the Euler angles of LiNbO3 substrates and the attenuation constant a of electrodes which are made of Cu and which are varied in normalized thickness. [Fig. 9] Fig. 9 is a graph showing the variation in electromechanical coefficient k2 with the thickness of electrodes made of Al and the thickness of SiO2 layers, the electrodes being IDT electrodes formed in grooves disposed in LiNbO3 substrates with Euler angles (0°, 103°, 0°) using Al, the SiO2 layers being deposited on the electrodes. [Fig. 10] Fig. 10 is a graph showing the variation in electromechanical coefficient k2 with the thickness of electrodes made of Ni and the thickness of SiO2 layers, the electrodes being IDT electrodes formed in grooves disposed in LiNbO3 substrates with Euler angles (0°, 103°, 0°) using Ni, the SiO2 layers being deposited on the electrodes. [Fig. 11] Fig. 11 is a graph showing the variation in electromechanical coefficient k2 with the thickness of electrodes made of Cu and the thickness of SiO2 layers, the electrodes being IDT electrodes formed in grooves disposed in LiNbO3 substrates with Euler angles (0°, 103°, 0°) using Cu, the SiO2 layers being deposited on the electrodes. [Fig. 12] Fig. 12 is a schematic view illustrating the energy distribution of an acoustic wave propagating in a SiO2/embedded IDT electrode/LiNbO3 multilayer structure including a SiO2 layer with a normalized thickness H/λ, of less than 0.8. [Fig. 13] Fig. 13 is a schematic view illustrating the energy distribution of an acoustic wave propagating in a SiO2/embedded IDT electrode/LiNbO3 multilayer structure including a SiO2 layer with a normalized thickness H/λ of 0.8 or more. [Fig. 14] Fig. 14 is a graph showing the temperature coefficient of frequency TCF of a boundary acoustic wave device according to a first embodiment and the temperature coefficient of frequency TCF of a boundary acoustic wave device of a comparative example that includes IDT electrodes which are not of an embedded type, the boundary acoustic wave device according to the first embodiment and the boundary acoustic wave device of the comparative example including SiO2 layers with a thickness of 1λ, or 2λ. [Fig. 15] Fig. 15 is a graph illustrating the relationship between 0 of the Euler angles (0°, 0, 0°) of LiTaO3 substrates, the thickness of IDT electrodes made of Al, and the attenuation constant a of boundary acoustic wave devices. [Fig. 16] Fig. 16 is a graph illustrating the relationship between θ of the Euler angles (0°, θ, 0°) of LiTaO3 substrates, the thickness of IDT electrodes made of Cu, and the attenuation constant a of boundary acoustic wave devices. [Fig. 17] Fig. 17 is a graph illustrating the relationship between 0 of the Euler angles (0°, θ, 0°) of LiTaO3 substrates, the thickness of IDT electrodes made of Au, and the attenuation constant α of boundary acoustic wave devices. [Fig. 18] Fig. 18 is a graph illustrating the relationship between θ of the Euler angles (0°, θ, 0°) of LiTaO3 substrates, the thickness of IDT electrodes made of Ta, and the attenuation constant a of boundary acoustic wave devices. [Fig. 19] Fig. 19 is a graph illustrating the relationship between θ of the Euler angles (0°, θ, 0°) of LiTaO3 substrates, the thickness of IDT electrodes made of Pt, and the attenuation constant a of boundary acoustic wave devices. [Fig. 20] Fig. 20 is a graph showing the relationship between the normalized thickness H/λ, of SiO2 layers, the normalized thickness of Al layers, and the electromechanical coefficient k2 of structures in which embedded electrodes made of Al are formed in LiTa03 with Euler angles (0°, 126°, 0°) and SiO2 is deposited on the electrodes. [Fig. 21] Fig. 21 is a graph showing the relationship between the normalized thickness H/λ of SiO2 layers, the normalized thickness of Au layers, and the electromechanical coefficient k2 of structures in which embedded electrodes made of Au are formed in LiTaO3 with Euler angles (0°, 126°, 0°) and SiO2 is deposited on the electrodes. [Fig. 22] Fig. 22 is a graph showing the relationship between the normalized thickness H/λ of SiO2 layers, the normalized thickness of Cu layers, and the electromechanical coefficient k2 of structures in which embedded electrodes made of Cu are formed in LiTaO3 with Euler angles (0°, 126°, 0°) and SiO2 is deposited on the electrodes. [Fig. 23] Fig. 23 is a graph showing the relationship between the normalized thickness H/λ of SiO2 layers, the normalized thickness of Ta layers, and the electromechanical coefficient k2 of structures in which embedded electrodes made of Ta are formed in LiTaO3 with Euler angles (0°, 126°, 0°) and SiO2 is deposited on the electrodes. [Fig. 24] Fig. 24 is a graph showing the relationship between the normalized thickness H/λ of SiO2 layers, the normalized thickness of Pt layers, and the electromechanical coefficient k2 of structures in which embedded electrodes made of Pt are formed in LiTaO3 with Euler angles (0°, 126°, 0°) and SiO2 is deposited on the electrodes. Reference Numerals [0023] 12 and 13 reflectors Best Modes for Carrying Out the Invention [0024] Embodiments of the present invention will now be described with reference to the accompanying drawings in detail. The present invention will become apparent from the description. [0025] (First experiment) A method for manufacturing a boundary acoustic wave device according to an embodiment of the present invention is described below with reference to Figs. 1(a) to 1(f) such that the structure of the boundary acoustic wave device becomes apparent. [0026] As shown in Figs. 1(a) and 1(b), a LiNbO3 substrate defining a piezoelectric substrate is prepared. [0027] A photoresist layer 2 is formed over the upper surface la of the LiNbO3 substrate 1. The photoresist layer 2 can be formed from any photoresist material resistant to reactive ion etching (RIE) performed later. In this example, a positive resist, AZ-1500™, available from Clariant (Japan) K.K. is used. In this example, the thickness of the photoresist layer 2 is 2 µm. [0028] The photoresist layer 2 is patterned in such a manner that the photoresist layer is exposed to light and then developed, whereby a photoresist pattern 2A is formed as shown in Fig. 1(b). In the photoresist pattern 2A, portions for forming IDT electrodes are removed from the photoresist layer. [0029] As shown in Fig. 1(c), a plurality of grooves 1b with a desired depth are formed in the upper surface 1a of the LiNbO3 substrate 1 by reactive ion etching. The desired depth thereof is equal to the thickness of the IDT electrodes formed later. However, the etching depth may be slightly greater or less than the thickness of the IDT electrodes. [0030] A1 layers are formed by vapor deposition or sputtering. This allows the A1 layers, that is, electrode layers 3 to be placed in the grooves 1b as shown in Fig. 1(d) . An A1 layer is placed on the photoresist pattern 2A. [0031] The LiNbO3 substrate is immersed in a stripping solution containing acetone or the like, whereby the photoresist pattern 2A and the A1 layer placed on the photoresist pattern 2A are removed. This allows the grooves 1b to be filled with the electrode layers 3 and allows the LiNbO3 substrate 1 to have a substantially flat upper surface as shown in Fig. 1(e). [0032] As shown in Fig. 1(f), a SiO2 layer 4 defining a dielectric layer is formed on the upper surface, whereby the boundary acoustic wave device 5 is obtained. The SiO2 layer 4 has a flat surface. This is because the upper surface 1a of the LiNbO3 substrate 1 and the upper surface of each electrode layer 3 are substantially flush with each other and are substantially flat. Therefore, the surface of the SiO2 layer 4 can be securely planarized when the SiO2 layer 4 is formed by a common process. [0033] A process for forming the SiO2 layer 4 is not particularly limited. The SiO2 layer 4 may be formed by an appropriate process such as a printing process, a vapor deposition process, or a sputtering process. [0034] The method for manufacturing the boundary acoustic wave device 5 of this embodiment is as described above with reference to Figs. 1(a) to 1(f), which principally illustrate electrode portions. In particular, the electrode layers 3 form an electrode structure including IDT electrodes. The electrode structure is not particularly limited and may be a one port-type boundary acoustic wave resonator 11 shown in Fig. 2 in plan view. In this case, the electrode layers form reflectors 12 and 13 arranged on both sides of the electrode layers 3 which form the IDT electrodes in the direction of a boundary acoustic wave propagation. [0035] In this example, there are substantially no unevenness between electrode-bearing portions and electrode-free portions; hence, the upper surface of the SiO2 layer 4, which defines a dielectric layer, can be readily planarized and the insertion loss can be reduced. [0036] The boundary acoustic wave device, which has low loss, can be provided without increasing the thickness of the electrode layers 3. The electrode layers 3 are made of a metal material that is at least one selected from the group consisting of Al, Ti, Ni, Cr, Cu, W, Ta, Pt, Ag, and Au. Al and Ti are grouped into a first group; Ni and Cr are grouped into a second group; Cu, W, Ta, Pt, Ag, and Au are grouped into a third group; the thickness of the electrode layers made of the metal materials assigned to each group, 9 of the Euler angles of the LiNbO3 substrate 1, and the thickness of a dielectric layer are within any of ranges shown in Table 5 below. Therefore, although the electrode layers have a small thickness, the boundary acoustic wave device, which has low loss, can be provided. This is described below in detail using examples. [0037] [0038] Non-patent Document 1 cited above describes that the SH-type boundary acoustic wave is nonleaky in a SiO2/electrodes/y-cut X-propagation LiNbO3 multilayer structure when the electrodes are made of Al and have a thickness of 0.16A, or more or when the electrodes are made of Au, Cu, or Ag and have a thickness of 0.04λ or more. [0039] However, experiments conducted by the inventors have shown that an SH-type boundary acoustic wave can be nonleaky in the boundary acoustic wave device 5 of this embodiment although the electrode layers 3, which are formed by filling the grooves lb with the metal material, have a small thickness. This is described below with reference to Figs. 3 to 5. [0040] Fig. 3 is a graph showing the relationship between the thickness of electrode layers 3 made of the metal materials of the first group and the attenuation constant a of boundary acoustic wave devices 5 including LiNbO3 substrates with Euler angles (0°, 103°, 0°). Fig. 4 is a graph showing the relationship between the thickness of electrode layers 3 made of the metal materials of the second group and the attenuation constant a of boundary acoustic wave devices 5. Fig. 5 is a graph showing the relationship between the thickness of electrode layers 3 made of the metal materials of the third group and the attenuation constant a of boundary acoustic wave devices 5. The electrode layers 3 have an electrode structure for forming the one port-type boundary acoustic wave resonator shown in Fig. 3. [0041] Figs. 3 to 5 illustrate that the following combination is within ranges specified in Tables 6 to 11: a combination of the thickness of the electrode layers that are made of the corresponding metal materials of the first to third groups such that the propagation loss a is 0.1 dB/λ or less or substantially zero, θ of Euler angles, and a SiO2 layer. [0042] [0045] [Table 9] α≈0 [0048] As is clear from Figs. 3 to 5, since the electrode layers 3 are formed by filling the grooves lb with the metal materials, the attenuation constant a of an SH-type boundary acoustic wave is 0.1 dB/λ or less and therefore the SH-type boundary acoustic wave is nonleaky when the electrode layers 3 are made of Al or Ti and have a thickness of 0.03λ, or more; when the IDT electrodes are made of one of the metal materials of the second group, that is, Ni or Cr and have a thickness of 0.01λ or more; or when the IDT electrodes are made of one of the metal materials of the third group, that is, Cu, W, Ta, Pt, Ag, or Au and have a thickness of 0.005λ, or more. [0049] In the boundary acoustic wave devices 5, θ of the Euler angles (0°, θ, 0°) of each LiNbO3 substrate is varied and IDT electrodes are made of the corresponding metal materials of the first to third groups. Figs. 6 to 8 each show the relationship between θ of the Euler angles and the attenuation constant α. [0050] As is clear from Figs. 6 to 8, the attenuation constant a is very small and therefore a boundary acoustic wave is nonleaky in a specific range when the IDT electrodes are made of the corresponding metal materials of the first to third groups and 6 of the Euler angles and the thickness of the electrodes are varied. [0051] In the boundary acoustic wave devices 5, dielectric layers were formed from SiO2 layers 4. The following relationship was determined using LiNbO3 substrates with Euler angles (0°, 103°, 0°): the relationship between the normalized thickness H/λ, of the dielectric layers formed from the SiO2 layers 4 and the electromechanical coefficient k2 of SH-type normalization. The results are shown in Figs. 9 to 11. As is clear from Figs. 9 to 11, an increase in the thickness of the SiO2 layer 4 tends to reduces the electromechanical coefficient k2 of an SH-type boundary acoustic wave. Since the magnitude of the electromechanical coefficient k2 may be selected depending on applications, the thickness of the dielectric layers formed from the SiO2 layers 4 may be selected within ranges shown in Figs. 9 to 11 depending on a range required for the electromechanical coefficient k2 of the SH-type boundary acoustic wave. [0052] The results of electrode layers 3 made of Al, Ni, and Cu are shown in Figs. 9 to 11. It has been confirmed that Ti shows substantially the same value as that of Al; Cr shows substantially the same value as that of Ni; and Cu, W, Ta, Pt, or Ag shows a value close to that of Au. [0053] Figs. 12 and 13 are schematic views each illustrating the energy distribution of an acoustic wave propagating in a structure including an IDT electrode placed in a groove lb formed in a LiNbO3 substrate 1 and a SiO2 layer 4 deposited over the IDT electrode, the SiO2 layer 4 defining a dielectric layer of which normalized thicknesses H/λ are less than 0.8 and 0.8 or more, respectively. [0054] As is clear from Fig. 12, the energy of the acoustic wave is distributed over the upper surface of the dielectric layer made from the SiO2 layer 4, which has a normalized thickness H/λ of less than 0.8; hence, the structure cannot be used as any boundary acoustic wave device. In contrast, the SiO2 layer 4 shown in Fig. 13 has a normalized thickness H/λ of 0.8 or more and therefore the energy of the acoustic wave is confined in this structure; hence, this structure can be used as a boundary acoustic wave device. [0055] The results shown in Figs. 3 to 5, 6 to 8, 9 to 11, 12, and 13 show that the following relationship may be within any of ranges shown in Table 5: the relationship between the type of a material most suitable for electrodes used for boundary acoustic waves, the normalized thickness H/λ of each electrode, the normalized thickness of a dielectric layer made of SiO2, and θ of the Euler angles. In Table 5, Euler angles are expressed in the form of (0°, θ, -45° to +45°), that is, Ψ ranges from -45° to 45°, although Ψ = 0 in the above experiments. This is because if 6 of the Euler angles of a LiNbO3 substrate is within a specific range, a small propagation loss is obtained as described above when Ψ is 0° or is within the range of -45° to 45°. Not only in LiNbO3 but also in LiTaO3 used in a second experiment below, Ψ of Euler angles (0°, θ, Ψ) shows substantially the same results as those achieved when Ψ = 0°, if Ψ is within the range of -45° to 45°. [0056] When any of ranges shown in Table 12 below is satisfied, propagation loss can be further reduced. [0057] [0058] In the boundary acoustic wave device 5 of this embodiment, the electrode layers 3 including IDT electrodes are formed by filling the grooves 1b, disposed in the upper surface of the LiNbO3 substrate 1, with the metal material. According to this structure, the absolute value of a temperature coefficient of frequency TCF can be reduced and frequency-temperature characteristic can be improved as compared to those of comparative examples in which IDT electrodes are formed on LiNbO3 substrates without filling grooves with any metal material. This is shown in Fig, 14, Fig. 14 shows the temperature coefficient of frequency TCF of the boundary acoustic wave device of this embodiment, the boundary acoustic wave device being obtained in such a manner that the grooves are formed in the LiNbO3 substrate with Euler angles (0°, 103°, 0°), the IDT electrodes with a thickness of 0.04X are formed by filling the grooves with Au, and the SiO2 layer with a thickness of 1A, or 2\ is deposited over the IDT electrodes. For comparison, Fig. 14 also shows the temperature coefficient of frequency TCF of a boundary acoustic wave device which is obtained in such a manner that IDT electrodes made of Au having the same thickness are formed on a LiNbO3 substrate without forming any grooves and a SiO2 layer having the thickness of 1λ, or 2λ similar to the above described embodiment. [0059] As is clear from Fig. 14, according to the embodiment, the absolute value of the thermal coefficient of frequency TCF can be reduced and can be improved by about 5 ppm/°C as compared to comparative examples regardless of whether the normalized thickness H/λ of a dielectric layer made of SiO2 is 1λ or 2λ. [0060] In this embodiment, the dielectric layer is formed from the SiO2 layer 4 and may be made of silicon oxide other than SiO2. [0061] (Second experiment) Although the LiNbO3 substrates were used in the first experiment, LiTaO3 substrates were used in a second experiment. A plurality of grooves lb were formed in the upper surfaces of the LiTaO3 substrates in the same manner as that described with reference to Fig. 1, electrode layers 3 were formed by filling the grooves lb with various metal materials, and SiO2 layers defining dielectric layers were deposited. Figs. 15 to 19 are graphs illustrating the relationship between 0 of the Euler angles (0°, θ, 0°) of the LiTaO3 substrates, which are disposed in boundary acoustic wave devices obtained as described above, the thickness of the electrode layers, and the attenuation constant a of the boundary acoustic wave devices. [0062] Fig. 15 shows results obtained using Al as an electrode material, Fig. 16 shows results obtained using Cu as an electrode material, and Fig. 17 shows results obtained using Au as a metal material for forming electrodes. [0063] Electromechanical coefficients were determined in such a manner that LiTaO3 with Euler angles (0°, 126°, 0°) were used to prepare the LiTaO3 substrates and the thickness of electrodes and the type of a metal material for forming the electrodes were varied. The obtained results are shown in Figs. 20 to 24. Figs. 20 to 24 show results obtained using Al, Au, Cu, Ta, and Pt as metal materials for forming the electrodes. [0064] As is clear from Figs. 20 to 24, for the use of the LiTaO3 substrates, an increase in the thickness of SiO2 layers reduces the electromechanical coefficient k2. The thickness of SiO2 layers may be selected such that an electromechanical coefficient k2 suitable for the application is obtained. [0065] The results shown in Figs. 15 to 19 and 20 to 24 show that the use of a LiTaO3 substrate, as well as the LiNbO3 substrates, having Euler angles (0°, θ, -45° to +45°) provides a boundary acoustic wave device with low loss and utilizing an SiO-type boundary acoustic wave when θ of the Euler angles, the thickness of electrodes, and the thickness of a SiO2 layer are within any of ranges shown in Tables 13 to 22. [0066] [0076] The analysis of data in Tables 13 to 22 shows that such a boundary acoustic wave device with low loss is obtained if any of ranges shown in Tables 23 and 24 is satisfied. In particular, any of ranges shown in Table 24 is preferably satisfied because the loss thereof is reduced. [0079] In the first and second experiments, the IDT electrodes are made of a single metal such as Al or Au. The IDT electrodes may each have a multilayer structure in which an electrode layer principally containing such a metal is disposed on another electrode layer made of another metal material. [0080] The dielectric layers may be made of another dielectric material having an acoustic wave velocity of a transverse wave greater than that of the electrodes. Examples of such a dielectric material include glass, SixNy, SiC, and Al2O3. When the dielectric layers are made of any one of these materials, the thickness thereof may be determined in inverse proportion to the acoustic wave velocity of a transverse wave of SiO2. CLAIMS 1. A boundary acoustic wave device comprising: a LiNbO3 substrate which has a plurality of grooves formed in the upper surface thereof and which has Euler angles (0°, θ, -45° to +45°); electrodes formed by filling the grooves with a metal material; and a dielectric layer formed over the LiNbO3 substrate and the electrodes, wherein the upper surface of the dielectric layer is flat; the metal material used to form the electrodes is at least one selected from the group consisting of Al, Ti, Ni, Cr, Cu, W, Ta, Pt, Ag, and Au; Al and Ti are grouped into a first group; Ni and Cr are grouped into a second group; Cu, W, Ta, Pt, Ag, and Au are grouped into a third group; and the thickness of the electrodes made of the metal materials assigned to each group, 0 of the Euler angles of the LiNbO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 1 below. 2. The boundary acoustic wave device according to Claim 1, wherein the thickness of the electrodes, 0 of the Euler angles of the LiNbO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 2 below: 3. A boundary acoustic wave device comprising: a LiTaO3 substrate which has a plurality of grooves formed in the upper surface thereof and which has Euler angles (0°, θ, -45° to +45°); electrodes formed by filling the grooves with a metal material; and a dielectric layer formed over the LiTaO3 substrate and the electrodes, wherein the upper surface of the dielectric layer is flat; the metal material used to form the electrodes is at least one selected from the group consisting of Al, Cu, Au, Ta, and Pt; and the thickness of the electrodes, θ of the Euler angles of the LiTaO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 3 below: 4. The boundary acoustic wave device according to Claim 3, wherein the thickness of the electrodes, θ of the Euler angles of the LiTaO3 substrate, and the thickness of the dielectric layer are within any of ranges shown in Table 4 below: 5. The boundary acoustic wave device according to any one of Claims 1 to 4, wherein the dielectric layer is made of silicon dioxide. Provided is an elastic boundary-wave device, which utilizes elastic boundary-waves to propagate through a boundary between LiNbO3 or LiTaO3 and a dielectric layer so that the loss is reduced by making use of SH-type elastic boundary-waves although the electrode film is made thin. In the elastic boundary-wave device, a plurality of grooves (1b) are formed in the upper face of a LiNbO3 substrate (1) and are filled with a metallic material to form an electrode film (3) including IDT electrodes. A dielectric layer (4) such as a SiO2 film is formed to cover the upper face (1a) of the piezoelectric substrate (1) and the electrode film (3), and is flattened on its surface. The thickness of the electrode film (3), the Euler's angle (θ) (0 degrees, θ, -45 degrees - +45 degrees) of the LiNbO3 substrate and the thickness of the dielectric layer (4) are defined within any of the ranges tabulated in the following Table 1.

Documents:

908-KOLNP-2009-(04-05-2012)-CORRESPONDENCE.pdf

908-KOLNP-2009-(04-05-2012)-ENGLISH TRANSLATION.pdf

908-KOLNP-2009-(04-05-2012)-FORM-3.pdf

908-KOLNP-2009-(22-08-2014)-ABSTRACT.pdf

908-KOLNP-2009-(22-08-2014)-ANNEXURE TO FORM 3.pdf

908-KOLNP-2009-(22-08-2014)-CLAIMS.pdf

908-KOLNP-2009-(22-08-2014)-CORRESPONDENCE.pdf

908-KOLNP-2009-(22-08-2014)-DESCRIPTION (COMPLETE).pdf

908-KOLNP-2009-(22-08-2014)-DRAWINGS.pdf

908-KOLNP-2009-(22-08-2014)-FORM-1.pdf

908-KOLNP-2009-(22-08-2014)-FORM-2.pdf

908-KOLNP-2009-(22-08-2014)-PA.pdf

908-KOLNP-2009-(22-08-2014)-PETITION UNDER RULE 137.pdf

908-kolnp-2009-abstract.pdf

908-KOLNP-2009-ASSIGNMENT.pdf

908-kolnp-2009-claims.pdf

908-KOLNP-2009-CORRESPONDENCE 1.1.pdf

908-kolnp-2009-correspondence.pdf

908-kolnp-2009-description (complete).pdf

908-kolnp-2009-drawings.pdf

908-kolnp-2009-form 1.pdf

908-kolnp-2009-form 18.pdf

908-kolnp-2009-form 3.pdf

908-kolnp-2009-form 5.pdf

908-kolnp-2009-gpa.pdf

908-kolnp-2009-international publication.pdf

908-kolnp-2009-international search report.pdf

908-kolnp-2009-others pct form.pdf

908-kolnp-2009-pct priority document notification.pdf

908-kolnp-2009-specification.pdf

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