Title of Invention	METHOD FOR PRODUCING A DEVICE COMPRISING A TRANSPONDER ANTENNA CONNECTED TO CONTACT PINS AND DEVICE OBTAINED
Abstract	The invention relates to a method for producing a device comprising a transponder antenna connected to contact pins, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with a substrate, placing the contact pad (5, 6) on the substrate ad connecting the same to the terminal sections of the antenna (7b, 8b), the connection being produced by means of a soldering (38) by introducing energy between the pads (5, 6) and the terminal sections (7b, 8b). The method is characterised in that the pads (5, 6) are placed such as to provide a surface (40) facing an antenna terminal connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f) and the soldering energy being directly applied to the pads (5, 6). The invention also relates to the device obtained.

Title of Invention

METHOD FOR PRODUCING A DEVICE COMPRISING A TRANSPONDER ANTENNA CONNECTED TO CONTACT PINS AND DEVICE OBTAINED

Abstract

The invention relates to a method for producing a device comprising a transponder antenna connected to contact pins, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with a substrate, placing the contact pad (5, 6) on the substrate ad connecting the same to the terminal sections of the antenna (7b, 8b), the connection being produced by means of a soldering (38) by introducing energy between the pads (5, 6) and the terminal sections (7b, 8b). The method is characterised in that the pads (5, 6) are placed such as to provide a surface (40) facing an antenna terminal connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f) and the soldering energy being directly applied to the pads (5, 6). The invention also relates to the device obtained.

Full Text	Method for producing a device comprising a transponder antenna connected to contact pads and device obtained The invention more particularly relates to the field of radio frequency transponders. In particular, it relates to a method for producing a device including a transponder antenna connected to contact pads and the device obtained. The above method more particularly includes a step of connecting the antenna to contact pads, the latter being possibly connected to a microcircuit such as an electronic chip or a module. The invention aims at being used mainly in the process of the production of a low cost and low thickness radio frequency electronic inlay preferably having good communication properties, more particularly as regards the range. Such an inlay includes at least an antenna on a substrate connected to a microcircuit; it is more particularly intended to be inserted into a sheet lamination, the cover of an electronic passport, an identification card or any product provided with the radio frequency communication section; and thus the thickness thereof is very important. Among various connection techniques, the most currently used is known which consists of a wire bonding type connection, a wire soldering using an ultrasonic probe which feeds and solders a connection wire between the various points to be connected, the chip or a component being positioned close to the ends of the antenna to be connected. This technique has the drawback of requiring flat connection metallic surfaces, more particularly engraved, and a support of surfaces resisting the pressure of a soldering tool, a protection resin on the connections, so as to protect the same and a sheet for compensating the thickness of the resin. In another solution, the connection is provided by a conductive adhesive material positioned between the ends of the antenna and the connections of a component, a module or a chip being placed directly on the connection ends of an antenna, for example made of copper and engraved on a substrate. The utilisation of a conductive adhesive material has the drawback of requiring metallic tracks or windings which are stripped and the intersection of the windings requires double face etchings or a step of production of an isolating bridge. A method of production of an antenna connected by a sewing stitch is known from the application for a patent JP 2002 298110 A, wherein a module is first fixed on a substrate and the antenna is subsequently- fixed by sewing stitches on the substrate; and as for the connection of the modules to the antenna, the wire extends above the pads and clamps by contact the contact pads on the module. As an alternative, the connection can be provided by a thermo-com.pression of the antenna wire on the contact pads, with the probe pressing and bringing thermal energy directly onto the wire. In other cases, such as in patent EP 0880 754 Bl, the antenna wire made of a wire inlaid into a polymer sheet, lies above the contact pads of a chip which is already positioned or the corresponding position thereof, prior to a connection by, more particularly, an ultrasonic or a thermo-compression soldering directly by pressing and bringing energy directly onto the wire. When it is necessary to go beyond connection pads positions, the substrate is provided with a cavity for receiving an electronic chip or a module. During the production, the inlaying tool stops the inlaying before the cavity, goes beyond the cavity and fixes the wire again after the cavity; then, the chip or a module is introduced from under the cavity so that the pads of the chip are facing the wires prior to making the connection by soldering. This method has the drawback of being time- consuming and requiring a cavity prior to the production of the antenna. Thus, as regards the presence of the module on the substrate prior to the production of the antenna, it can be an obstacle to the mass production rate of the antenna for some antenna embodiments. In the patent EP 1328899 Bl, the antenna is produced using a metallic wire sewn onto a sheet and contact dies are previously positioned on the sheet and sewn with the antenna wire, A chip is placed on the substrate and more particularly connected by a link with a "wire bonding" soldered to the dies. This technique requires the prior positioning of the pellets and subsequent coating of the connections as mentioned above. The invention aims at solving the above-mentioned drawbacks of the connection of a microcircuit to an antenna, more particularly within the scope of the production of a low thickness and low cost radio frequency electronic inlay and ensuring having correct properties of communication, more particularly as regards the range. For this purpose, the invention aims at a method for producing a device including a transponder antenna connected to contact pads, said method including the following steps: - production of an antenna comprising connection terminal sections resting on a substrate, - placing contact pads on the substrate and the connection thereof to the antenna terminal sections, with the connection being carried out as a soldering by introduction of energy between the pads and the terminal sections; The method is characterised in that the pads are placed in such a way as to have a surface facing an antenna connection terminal section, said section being positioned on the substrate, the soldering energy being directly applied to the pads. In addition to solving the above-mentioned drawbacks, the invention gives flexibility to the production of the device, thanks to the separation of the production of the antenna from the other conventional inlay production operations, more particularly the previous positioning of the contact pads on a substrate, the prior production of a cavity under the antenna connection sections, the coating of the connections and preventing the soldering tool from being polluted. According to various characteristics of the implementation, the method is characterised: - in that the antenna is produced by embroidery or sewing on a flexible support including a fabric and in that it includes a step during which a reinforcing material is positioned more particularly as a sheet or a layer on a face of the substrate opposite the one carrying the terminal sections; - the reinforcing layer or sheet is positioned after the production of the antenna; - the method includes a step of forming a cavity in the substrate and/or the reinforcing sheet or layer close to the antenna connection terminal sections; - the method includes a step during which contact pads associated with a microcircuit are positioned facing the' antenna terminal sections, the microcircuit being inserted at least partly into the cavity; - the method includes a step according to which a soldering of the thermo-compression or ultrasonic type is carried out; - the soldering uses an anvil which rests against the recess of the antenna terminal section in the support; - the anvil goes through at least the reinforcing sheet or layer facing the connection terminal section so that the connection section is supported by the anvil during the soldering; - the antenna wire is a hybrid wire associated at least with a non conductive wire; Another object of the invention is a device including an antenna connected to contact pads, said device including a substrate and an antenna provided with connection terminal sections resting on the substrate, with said antenna being connected by soldering to the terminal sections. The device is characterised in that the electric contact pads have a surface facing an antenna connection terminal section with said section being positioned onto the substrate. According to other characteristics of the device: - the antenna is produced by embroidery or sewing on a flexible support including a fabric and it includes a reinforcing material as a sheet or a layer on one face of the substrate opposite the one supporting the terminal sections; - the device includes a cavity in the substrate and/or reinforcing sheet or layer close to the antenna connection terminal sections; - contact pads are associated with a microcircuit and positioned opposite the substrate and the antenna terminal sections resting on the substrate, whereas the microcircuit is inserted at least partially into the cavity; - the pads include a soldering mark across the pads on one face of the pads opposite the soldered one; the device includes perforations in the reinforcing material opposite each connected terminal section; - the antenna wire is a hybrid wire associated with at least one non conductive wire. Another object of the present invention is a radio frequency communication product such as a contactless chip card, a passport including the mentioned device or obtained according to the above- mentioned method. Other characteristics and advantages of the invention will appear while reading the following description given as an illustrative and in no way limitative example, and given more particularly while referring to the appended drawings wherein: Figure 1 illustrates a schematic view of a transponder which can be obtained according to one embodiment of the method of the invention; - Figure 2 illustrates in greater details the electronic circuit module of Figure 1, being connected to the antenna; Figure 3 illustrates a sectional view of a second embodiment, with the antenna being made of an incrusted wire; - Figure 4 illustrates a sectional view of a third embodiment wherein the behaviour of the substrate is reinforced with a sheet; Figure 5 illustrates a sectional view of a fourth embodiment showing a connection with an embroidered antenna wire; - Figure 6 illustrates a cross-sectional view of a fifth embodiment showing a connection with a hybrid antenna wire; - Figure 7 illustrates a step of lamination of a reinforcing sheet in a support including a plurality of antennas; - Figures 8 and 9 illustrate the prints left by the soldering tools and the anvil on the device complying with Figure 4; Figure 10 illustrates another print, with another orientation, of the connection terminal section with respect to the module and soldering tool and the prints obtained. Figures 11 and 12 illustrate another configuration of the pads opposite the antenna wire and the connections thereof; Figure 13 illustrates a woven support supporting an antenna wire fixed by an embroidery wire; - Figure 14 illustrates the steps of the method according to the preferred embodiment. Figure 1 illustrates a schematic view of a device 1 including an antenna 3 connected to contact pads 5, 6 which can be obtained according to one embodiment of the method of the invention. The device includes a substrate 2 and an antenna provided with connection terminal sections 7, 8 resting on the substrate. The antenna is connected to the terminal sections by soldering (S). The antenna is produced by electrochemical etching. The tracks are thin with respect to the pads, for example 2mm in width/5mm. The module may include or not a support dielectric film. Preferably, the metallic contact surfaces 11 on which a soldering tool T (thermode) has been applied (Fig. 2) have no material which could pollute the soldering tool. According to one embodiment of the invention in Figure 2, contrary to the prior art wherein connection sections lie above already positioned pads or are placed above a chip or a module recess, here the electric contact pads have a surface opposite an antenna connection terminal section which rests on the substrate 2. The pads rest on and in contact with the ends 7, 8 of the antenna during a connection operation with a device 1 resting on a plane P. Mainly in the prior art, the chip connections with etched antennas are produced with conductive or non conductive glue, but with pads on the chip, the latter being placed on the antenna, or through soldered wires, with the chip being positioned above the same. In Figure 3, with the same configuration for placing the pads or the module as in Figure 2, the antenna is produced by inlaying the conductive wire into a polymer sheet 2b. The conductive wire may be coated with a varnish or an isolating sheath 13. In Figure 4, still with the same placing configuration, the antenna is produced by embroidery or sewing on a flexible support including a fabric 2f. The support is flexible insofar as if has no behaviour or rigidity as all low thickness fabrics. The loose meshing (m) between warp and weft wires is, for example, between 200]jm and 300iam in both directions, with a SOpm thick or 48 dtex polyamide wire. In addition, the fabric 2f is not stable as regards its dimensions insofar as it can normally be stretched manually and more particularly in diagonal, for example by at least 3% to 20%. This extension is lower than 1% in the substrate warp or weft feeding direction with a feeding tension during the production. The handling of the supporting fabric of an embroidered antenna is very delicate (flexible and porous woven material), and so it is provided to stabilise it with a reinforcing material 15 in the form a sheet or a layer positioned on one face of the substrate opposite the one carrying the antenna terminal sections. The stabilising material 15 is fixed by adding a porous plastic sheet such as the one known under the trademark Teslin or synthetic paper. Preferably, the addition of the reinforcing sheet is carried out after the production of the antenna so as not to be an obstacle' for the production rates of embroidered antennas, but it could be carried out beforehand possibly with less interesting rates and a risk of deterioration of the needles on the embroidery or sewing frame. An effect sim.ilar to the addition of a sheet can be obtained by impregnating or coating a layer or spraying a product such as a coating, a primer, a resin, polymer foam, a gum able to stabilise the substrate as regards its dimension. The assembly can be carried out by lamination, thermo-soldering (melting of materials) or addition of an adhesive (as a film or a liquid), with the substrate being very low in thickness for productivity and easy implementation. This step also makes it possible to give a higher thickness to the substrate to enable the reception of at least a part of a component into the support during the placing of the latter. The device includes perforations 17, which may partially be closed, in the reinforcing material opposite each connection and terminal section 7b, 8b connected as results from the utilisation of a very low thickness anvil or needle applied under the conductive wire to be connected and which perforates the material as subsequently explained. In Figure 5, a single pad 16, not yet connected to the microcircuit, is placed on an embroidered wire antenna terminal section 18 with an embroidery wire 19 for fixing the antenna on the fibrous support 2f. The connection of a microcircuit 20 to the pad can be carried out subsequently by any known means and more particularly using a flip-chip. In Figure 6, a fifth embodiment of the device includes a connection with a hybrid antenna wire 22 insofar as the antenna wire 3 is associated with four non conductive wires 24; the association may however be made with at least one non conductive wire 24. The non conductive wires 24 are preferably thermo-fusible or thermo-plastic, so that they melt under the effect of a thermal or ultrasonic energy. Because of the presence of the non conductive wires 19 and 24 according to the invention, the tool (thermode) (T) is applied onto the metallic pad 16, which results in melting the fixing wire and/or associated wire going thereunder without polluting the soldering tool. Preferably, an anvil is supporting the antenna wire during the connection. In Figures 8 and 9, the device includes a cavity 26 provided in the substrate and/or reinforcing sheet or layer close the antenna connection terminal sections. The contact pads 5, 6 are associated with a coated microcircuit 28. The microcircuit is inserted at least partially into the cavity thus reducing the total thickness of the device. As can be seen, the pads 5, 6 include a mark 30 made by the soldering tool T and the soldering 38 carried out through the pads 5, 6 on one face 11 of the pads opposite the one 32 soldered to the wire. Figure 10 shows another configuration of the antenna wires 7a, 7b with respect to the contact pads 5, 6. The ends come face to face towards the chip. The application of the connection tool T is made transversally to the wire and to the pads and thus two corresponding marks 30 result on the top of the pads (free face 11) . The marks are parallel to each other and parallel to a line L separating the pads 5 and 6. In Figures 11 and 12, another configuration of the device is such that the antenna wire 8b is positioned in line with the pad but on the face of the support 15 or even 2f (if the fabric can be handled) opposite the one supporting the contact pad 16. In this case, the very low thickness anvil E pushes the antenna wire against the contact pad through the support while fluxing the material 15 on the support and/or pushing away the meshes of the fibrous support 2f associated or not with a reinforcing material 15. In Figure 13, a fabric includes warp and weft wires with a loose meshing (m) between 200]im and 300]im and composed of 48 dtex polyamide wires. While referring to Figure 14, a preferred embodiment of the method of the invention will now be described which meets the aims of the invention, but while describing, first, the difficulties met. To produce low cost inlays, the inventors more particularly selected wiring antennas for example sewn. embroidered or equivalents on the support including fabrics. More particularly, in embroidery, because of problems of productivity and easy implementation, several antennas are first produced at the same time on embroidery frames, preferably on a textile support such as a fibrous support like a fabric, woven, non woven or a support which can be accepted by embroidery or sewing machines. However, any material capable of being sewn or embroidered and for example including other isolating substrates such as a film or a sheet made of polymer material, PVC, PET (polyethylene), paper, polyimide, synthetic leather and more particularly fibrous/fabric and polymer sheet composites, are not excluded. As regards the discretion of the device, subsequently laminated or added to an object, but also because of productivity and ease of sewing or embroidery, the support is a very fine fabric. The substrate of the final device may have various thicknesses generally lower than or equal to those of a 0.76mm chip card, so that they can be used as an inlay between two films or sheets or be used as a support for a coating and/or a printing sheet. Typically, the substrate may have a thickness from for example 0.1mm to 0.5mm. The inventors noted the absence of stability as regards dimension or behaviour of some substrates more particularly made of fabric, which are appropriate for a mass production, more particularly when they are continuous or moving. The absence of behaviour makes it difficult or impossible to obtain a precise positioning of the modules, microcircuits or contact pads or cavities more particularly by an indexation on the substrate prior to or after the production of antennas. Adding a reinforcing sheet or material or another fabric to the substrate, with possibly predefined modules reception cavities such as imagined by the inventors, would bring dimensional stability to the substrate but also has drawbacks, because of the absence of behaviour of the substrate and a difficult indexation, the cavities might be incorrectly positioned. Adding a sheet prior to making the antenna is not favourable for productivity in embroidery. On the contrary, adding this reinforcement without any cavity will bring a dimension of stability to the substrate, but this would increase the difficulty of a ultrasonic or thermo-compression connection insofar as there is no cavity for introducing a chip or a module and bringing the contact pads of the antenna connection sections closer to each other and make a correct soldering. The inventors found out that the electronic component or contact pads must preferably be placed on the substrate after the antenna is produced to facilitate the sewing of the antenna to increase the production rate and because of the difficulty of placing and connecting the module, which make it possible to produce an economical antenna. In addition, the antenna can be sheathed with an isolating material, more particularly to make an isolating bridge which intersect the windings or which can be associated with non conductive wires or fibres for solidity reasons or for preventing the breaking of the wire, or for fixing it on the support. In this case, the soldering tool can be polluted or soiled during the connection for the ultrasonic or thermo- compression soldering since the soldering tool (thermode) is directly applied to the wire and is in contact with polluting materials surrounding the antenna wire in a configuration wherein the module is positioned adjacent to the windings of the antenna or below the same. In addition, as the wire antenna rests on the substrate and thus the inventors chose a position and a connection of the pads above the antenna, the latter may tend to sink into the sheet or fibrous mass added under the effect of pressure of the soldering means according to the nature of the material used. After such considerations, the method of the figure is composed as follows. At step 100, the method for producing a device including a transponder antenna connected to contact pads includes a step of providing or making an antenna with connection terminal sections supported by a substrate. The antenna is preferably produced by embroidery or sewing on a flexible support including a fabric. The antenna wire may include at least an isolation coating on the whole of its surface. It can also simultaneously or alternatively be in contact with isolating wires in places. The antenna wire is fixed on the substrate using a non conductive wire also called an embroidery or sewing wire. Preferably, the antenna wire is a hybrid wire associated with at least one non conductive wire so as to enable a better rate of productivity without the wire breaking. This non conductive wire surrounds the antenna wire at least in places and constitutes a kind of isolating sheath in places. Preferably, a non conductive wire is thermo- fusible or thermo-plastic to enable the removal or elimination thereof around the soldering zone. Non thermo-fusible wires may be appropriate insofar as the energy of the soldering is sufficient to remove the same, to deteriorate the same (or a sufficient soldering material is added to go through the same). However, other techniques for fixing the conductive wire on the substrate may be chosen among other less efficient ones such as inlay or etching. The production of the antenna by embroidery may preferably include a step of producing a barring stitch (not shown) of the antenna wire by sewing, embroidery, knitting at the end of one at least of said terminal sections. Then preferably, a step of removing said barring stitch including the removal of material from the support opposite the barring stitch and possible formation of a cavity. The antenna terminal sections or barring stitches may be superimposed or produced in a zone of the support intended to be removed. In case of removal of a barring stitch by punching, the corresponding terminal section extends up to the edge of a cavity. As previously mentioned. the support is preferably a very low thickness fabric but other low thickness supports can be considered. At step 200, then according to one characteristic, the method includes a step during which a reinforcing material is positioned as a sheet or a layer on one face of the substrate opposite the one supporting the terminal sections. The reinforcing layer or sheet is positioned in the example, directly after the production of the antenna. As already mentioned, an effect similar to the addition of a sheet can be obtained by impregnation or coating of a layer or spraying of a product such as a coating, a primer, a resin, a polymer foam, a gum capable of stabilising the substrate as regards its dimensions. At step 300, as the support is stabilised, it possible to handle it and to carry out more conventional operations such as more easily placing contact pads on the substrate. However, according to another characteristic, it is preferred to execute a step of forming a cavity in the substrate and/or reinforcing sheet or layer close to the antenna connection terminal sections, so as to introduce the chip or the module. The cavity is formed by punching, but a forming by pressure or embossing or any at least partial machining of the substrate could also be considered. At step 400, the pads are placed so as to have a surface opposite an antenna connection terminal section resting on the substrate. If need be, a chip can be placed more particularly using the flip-chip technology on the pads or on the rear face of the substrate or on a contact pad for a conventional connection by any known means or even with a soldered wire type. The opposite surface used in the description corresponds to a projection of the longitudinal section of a wire on a connection pad 8b, or a rectangle the width of which is generally equal to the diameter of the wire and length of which is equal to the length of the pad opposite. Preferably, the pads are already connected to an electronic microcircuit such as a chip. And the microcircuit is inserted at least partially into the cavity with the pads staying out of the cavity and resting on the sections of tracks or antenna terminal ends resting on the support. A step 500 the pads are connected to the antenna terminal sections. The connection is made by soldering with the introduction of energy between the pads and the terminal sections and the soldering energy is directly applied onto the pads using a thermode for a thermo-compression type soldering or an ultrasonic probe for an ultrasonic soldering. As regards soldering, an anvil is preferably used which rests against the recess of the antenna terminal section in the support. The anvil is all the more recommended as the antenna wire tends to sink into the substrate because of the fineness of the wire and/or softness of the substrate and/or reinforcing material. The anvil goes through at least the reinforcing sheet or layer opposite the terminal section to be connected so that the section to be connected is supported by the anvil during the soldering operation. The section of the anvil is rectangular or square for a section of the order of 0.3xlmm^ to lx5mm^. The invention more particularly applies as soon as a kind of "blind" connection of a metal pad must be performed directly on a track of an antenna or the terminal section of an antenna, which is also metallic, and positioned on a softer support than metal by soldering with or without addition of a soldering material, the reverse being a conventional operation. A priori, during the soldering operation, the pressure transmitted by a track or a terminal section to the support thereof is more important than the one transmitted by a pad because of the surface and pressure ratio. This makes the persons skilled in the art decide for a connection configuration which is the reverse of the conventional one. At step 600, the support is assembled with at least one sheet on the side opposite the reinforcing sheet. The sheets may for example be composed of materials used for the sheets or the cover of a passport or a chip card or any other object. Then they are cut to the desired format. If need be, the cutting may be carried out during other steps. CLAIMS 1. A method for producing a device comprising a transponder antenna connected to contact pads, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with a substrate, placing the contact pads (5, 6) on the substrate and connecting the same to the terminal sections of the antenna (7b, 8b) , the connection being produced by means of a soldering (38) while introducing energy between the pads (5, 6) and the terminal sections (7b, 8b), characterised in that the pads (5, 6) are placed so as to provide a surface (40) facing an antenna terminal connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f) and the soldering energy being applied directly to the pads (5, 6) . 2. A method according to claim 1, characterised in that the antenna is produced by embroidery or sewing on a flexible support (2f) including a fabric and in that it includes a step during which a reinforcing material (15) in the form of a sheet or a layer is positioned on a face (36) on the substrate opposite the one (34) bearing the terminal sections. 3. A method according to claim 2, characterised in that the reinforcing layer or sheet is positioned on after the production of the antenna. 4. A method according to one of the preceding claims, characterised in that the method includes a step of forming a cavity (26)- in the substrate and/or reinforcing sheet or layer close to the antenna connection terminal sections (7b, 8b). 5. A method according to claim 4, characterised in that the method includes a step during which the contact pads associated with a microcircuit (20) are placed facing the antenna terminal sections (7b, 8b), the microcircuit being inserted at least partially into the cavity (26). 6. A method according to one of the preceding claims, characterised in that the method includes a step during which a soldering (38) of the thermo- compression or ultrasonic type is executed. 7. A method according to claim 6, characterised in that the soldering utilises an anvil (E) which rests against the recess in the antenna terminal section in the support. 8. A method according to claim 7, characterised in that the anvil goes creates a hole (17) in the reinforcing sheet or layer (15) facing the connection terminal sections so that the connection section (7b, 8b) is supported by the anvil during the soldering. 9. A method according to one of the preceding claims, characterised in that the antenna wire (3) includes at least an isolating coating (13) on the whole surface thereof and/or is in contact with isolating wires in places. 10. A method according to one of the preceding claims, characterised in that the antenna wire is fixed on the substrate using a non conductive wire (19). 11. A method according to one of the preceding claim, characterised in that the antenna wire is a hybrid wire (22) associated with at least one non conductive wire. 12. A method according to the preceding claim, characterised in that the non conductive wire (19) surrounds the antenna wire at least in places. 13. A method according to one of claims 11 to 12, characterised in that the non conductive wire (19) is thermo-fusible or thermoplastic. 14. A method according to claim 10, characterised in that the technique for fixing a conductive wire to the substrate is selected among sewing, embroidery, inlay. 15. A device including an antenna (3) connected to contact pads (5, 6), said device including a substrate and an antenna provided with connection terminal sections (7b, 8b) resting on the substrate (2, 2b, 2f, 15), said antenna being connected by a soldering (38) to the terminal sections, characterised in that the electric contact pads have a surface (40) facing a antenna connection terminal section (7b, 8b), said section being positioned on the substrate. 16. A device according to claim 15, characterised in that the antenna (3) is produced by embroidery or sewing on a flexible support (2f) including a fabric and in that it includes a reinforcing material (15) in the form of a sheet or a layer on a face of the substrate opposite the one supporting the terminal sections. 17. A device according to one of claims 15 or 16, characterised in that it includes a cavity (26) in the substrate and/or the reinforcing sheet or layer close to the antenna connection terminal sections. 18. A device according to claim 17, characterised in that the contact pads are associated with a microcircuit (20) and facing the substrate and the antenna terminal sections resting on the substrate whereas the microcircuit is inserted at least partially into the cavity (26). 19. A device according to one of claims 15 to 18, characterised in that the pads include a soldering mark (30) across the pads on a face of the pads opposite the soldered one. 20. A device according to claim 15 to 19, characterised in that it includes perforations (17) in the reinforcing material opposite each of the connected terminal section. 21. A device according to claims 15 to 20, characterised in that the antenna wire is a hybrid wire (22) associated with at least one non conductive wire. 22. A device according to claim 15 to 21, characterised in that the non conductive wire is thermo-fusible or thermoplastic. 23. A radio frequency communication electronic product such as a contactless chip card, a passport containing the device according to one of claims 15 to 22. The invention relates to a method for producing a device comprising a transponder antenna connected to contact pins, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with a substrate, placing the contact pad (5, 6) on the substrate ad connecting the same to the terminal sections of the antenna (7b, 8b), the connection being produced by means of a soldering (38) by introducing energy between the pads (5, 6) and the terminal sections (7b, 8b). The method is characterised in that the pads (5, 6) are placed such as to provide a surface (40) facing an antenna terminal connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f) and the soldering energy being directly applied to the pads (5, 6). The invention also relates to the device obtained.

Full Text

Method for producing a device comprising a transponder
antenna connected to contact pads and device obtained
The invention more particularly relates to the
field of radio frequency transponders. In particular,
it relates to a method for producing a device including
a transponder antenna connected to contact pads and the
device obtained.
The above method more particularly includes a
step of connecting the antenna to contact pads, the
latter being possibly connected to a microcircuit such
as an electronic chip or a module.
The invention aims at being used mainly in the
process of the production of a low cost and low
thickness radio frequency electronic inlay preferably
having good communication properties, more particularly
as regards the range.
Such an inlay includes at least an antenna on a
substrate connected to a microcircuit; it is more
particularly intended to be inserted into a sheet
lamination, the cover of an electronic passport, an
identification card or any product provided with the
radio frequency communication section; and thus the
thickness thereof is very important.
Among various connection techniques, the most
currently used is known which consists of a wire
bonding type connection, a wire soldering using an
ultrasonic probe which feeds and solders a connection
wire between the various points to be connected, the
chip or a component being positioned close to the ends
of the antenna to be connected.
This technique has the drawback of requiring flat
connection metallic surfaces, more particularly
engraved, and a support of surfaces resisting the
pressure of a soldering tool, a protection resin on the
connections, so as to protect the same and a sheet for
compensating the thickness of the resin.
In another solution, the connection is provided
by a conductive adhesive material positioned between
the ends of the antenna and the connections of a
component, a module or a chip being placed directly on
the connection ends of an antenna, for example made of
copper and engraved on a substrate.
The utilisation of a conductive adhesive material
has the drawback of requiring metallic tracks or
windings which are stripped and the intersection of the
windings requires double face etchings or a step of
production of an isolating bridge.
A method of production of an antenna connected by
a sewing stitch is known from the application for a
patent JP 2002 298110 A, wherein a module is first
fixed on a substrate and the antenna is subsequently-
fixed by sewing stitches on the substrate; and as for
the connection of the modules to the antenna, the wire
extends above the pads and clamps by contact the
contact pads on the module.
As an alternative, the connection can be provided
by a thermo-com.pression of the antenna wire on the
contact pads, with the probe pressing and bringing
thermal energy directly onto the wire.
In other cases, such as in patent EP 0880 754 Bl,
the antenna wire made of a wire inlaid into a polymer
sheet, lies above the contact pads of a chip which is
already positioned or the corresponding position
thereof, prior to a connection by, more particularly,
an ultrasonic or a thermo-compression soldering
directly by pressing and bringing energy directly onto
the wire.
When it is necessary to go beyond connection pads
positions, the substrate is provided with a cavity for
receiving an electronic chip or a module. During the
production, the inlaying tool stops the inlaying before
the cavity, goes beyond the cavity and fixes the wire
again after the cavity; then, the chip or a module is
introduced from under the cavity so that the pads of
the chip are facing the wires prior to making the
connection by soldering.
This method has the drawback of being time-
consuming and requiring a cavity prior to the
production of the antenna.
Thus, as regards the presence of the module on
the substrate prior to the production of the antenna,
it can be an obstacle to the mass production rate of
the antenna for some antenna embodiments.
In the patent EP 1328899 Bl, the antenna is
produced using a metallic wire sewn onto a sheet and
contact dies are previously positioned on the sheet and
sewn with the antenna wire, A chip is placed on the
substrate and more particularly connected by a link
with a "wire bonding" soldered to the dies. This
technique requires the prior positioning of the pellets
and subsequent coating of the connections as mentioned
above.
The invention aims at solving the above-mentioned
drawbacks of the connection of a microcircuit to an
antenna, more particularly within the scope of the
production of a low thickness and low cost radio
frequency electronic inlay and ensuring having correct
properties of communication, more particularly as
regards the range.
For this purpose, the invention aims at a method
for producing a device including a transponder antenna
connected to contact pads, said method including the
following steps:
- production of an antenna comprising connection
terminal sections resting on a substrate,
- placing contact pads on the substrate and the
connection thereof to the antenna terminal sections,
with the connection being carried out as a soldering by
introduction of energy between the pads and the
terminal sections;
The method is characterised in that the pads are
placed in such a way as to have a surface facing an
antenna connection terminal section, said section being
positioned on the substrate, the soldering energy being
directly applied to the pads.
In addition to solving the above-mentioned
drawbacks, the invention gives flexibility to the
production of the device, thanks to the separation of
the production of the antenna from the other
conventional inlay production operations, more
particularly the previous positioning of the contact
pads on a substrate, the prior production of a cavity
under the antenna connection sections, the coating of
the connections and preventing the soldering tool from
being polluted.
According to various characteristics of the
implementation, the method is characterised:
- in that the antenna is produced by embroidery
or sewing on a flexible support including a fabric and
in that it includes a step during which a reinforcing
material is positioned more particularly as a sheet or
a layer on a face of the substrate opposite the one
carrying the terminal sections;
- the reinforcing layer or sheet is positioned
after the production of the antenna;
- the method includes a step of forming a cavity
in the substrate and/or the reinforcing sheet or layer
close to the antenna connection terminal sections;
- the method includes a step during which contact
pads associated with a microcircuit are positioned
facing the' antenna terminal sections, the microcircuit
being inserted at least partly into the cavity;
- the method includes a step according to which a
soldering of the thermo-compression or ultrasonic type
is carried out;
- the soldering uses an anvil which rests against
the recess of the antenna terminal section in the
support;
- the anvil goes through at least the reinforcing
sheet or layer facing the connection terminal section
so that the connection section is supported by the
anvil during the soldering;
- the antenna wire is a hybrid wire associated at
least with a non conductive wire;
Another object of the invention is a device
including an antenna connected to contact pads, said
device including a substrate and an antenna provided
with connection terminal sections resting on the
substrate, with said antenna being connected by
soldering to the terminal sections.
The device is characterised in that the electric
contact pads have a surface facing an antenna
connection terminal section with said section being
positioned onto the substrate.
According to other characteristics of the device:
- the antenna is produced by embroidery or sewing
on a flexible support including a fabric and it
includes a reinforcing material as a sheet or a layer
on one face of the substrate opposite the one
supporting the terminal sections;
- the device includes a cavity in the substrate
and/or reinforcing sheet or layer close to the antenna
connection terminal sections;
- contact pads are associated with a microcircuit
and positioned opposite the substrate and the antenna
terminal sections resting on the substrate, whereas the
microcircuit is inserted at least partially into the
cavity;
- the pads include a soldering mark across the
pads on one face of the pads opposite the soldered one;
the device includes perforations in the
reinforcing material opposite each connected terminal
section;
- the antenna wire is a hybrid wire associated
with at least one non conductive wire.
Another object of the present invention is a
radio frequency communication product such as a
contactless chip card, a passport including the
mentioned device or obtained according to the above-
mentioned method.
Other characteristics and advantages of the
invention will appear while reading the following
description given as an illustrative and in no way
limitative example, and given more particularly while
referring to the appended drawings wherein:
Figure 1 illustrates a schematic view of a
transponder which can be obtained according to one
embodiment of the method of the invention;
- Figure 2 illustrates in greater details the
electronic circuit module of Figure 1, being connected
to the antenna;
Figure 3 illustrates a sectional view of a
second embodiment, with the antenna being made of an
incrusted wire;
- Figure 4 illustrates a sectional view of a
third embodiment wherein the behaviour of the substrate
is reinforced with a sheet;
Figure 5 illustrates a sectional view of a
fourth embodiment showing a connection with an
embroidered antenna wire;
- Figure 6 illustrates a cross-sectional view of
a fifth embodiment showing a connection with a hybrid
antenna wire;
- Figure 7 illustrates a step of lamination of a
reinforcing sheet in a support including a plurality of
antennas;
- Figures 8 and 9 illustrate the prints left by
the soldering tools and the anvil on the device
complying with Figure 4;
Figure 10 illustrates another print, with
another orientation, of the connection terminal section
with respect to the module and soldering tool and the
prints obtained.
Figures 11 and 12 illustrate another
configuration of the pads opposite the antenna wire and
the connections thereof;
Figure 13 illustrates a woven support
supporting an antenna wire fixed by an embroidery wire;
- Figure 14 illustrates the steps of the method
according to the preferred embodiment.
Figure 1 illustrates a schematic view of a device
1 including an antenna 3 connected to contact pads 5, 6
which can be obtained according to one embodiment of
the method of the invention.
The device includes a substrate 2 and an antenna
provided with connection terminal sections 7, 8 resting
on the substrate. The antenna is connected to the
terminal sections by soldering (S). The antenna is
produced by electrochemical etching. The tracks are
thin with respect to the pads, for example 2mm in
width/5mm. The module may include or not a support
dielectric film.
Preferably, the metallic contact surfaces 11 on
which a soldering tool T (thermode) has been applied
(Fig. 2) have no material which could pollute the
soldering tool.
According to one embodiment of the invention in
Figure 2, contrary to the prior art wherein connection
sections lie above already positioned pads or are
placed above a chip or a module recess, here the
electric contact pads have a surface opposite an
antenna connection terminal section which rests on the
substrate 2. The pads rest on and in contact with the
ends 7, 8 of the antenna during a connection operation
with a device 1 resting on a plane P.
Mainly in the prior art, the chip connections
with etched antennas are produced with conductive or
non conductive glue, but with pads on the chip, the
latter being placed on the antenna, or through soldered
wires, with the chip being positioned above the same.
In Figure 3, with the same configuration for
placing the pads or the module as in Figure 2, the
antenna is produced by inlaying the conductive wire
into a polymer sheet 2b. The conductive wire may be
coated with a varnish or an isolating sheath 13.
In Figure 4, still with the same placing
configuration, the antenna is produced by embroidery or
sewing on a flexible support including a fabric 2f.
The support is flexible insofar as if has no behaviour
or rigidity as all low thickness fabrics. The loose
meshing (m) between warp and weft wires is, for
example, between 200]jm and 300iam in both directions,
with a SOpm thick or 48 dtex polyamide wire. In
addition, the fabric 2f is not stable as regards its
dimensions insofar as it can normally be stretched
manually and more particularly in diagonal, for example
by at least 3% to 20%. This extension is lower than 1%
in the substrate warp or weft feeding direction with a
feeding tension during the production.
The handling of the supporting fabric of an
embroidered antenna is very delicate (flexible and
porous woven material), and so it is provided to
stabilise it with a reinforcing material 15 in the form
a sheet or a layer positioned on one face of the
substrate opposite the one carrying the antenna
terminal sections. The stabilising material 15 is
fixed by adding a porous plastic sheet such as the one
known under the trademark Teslin or synthetic paper.
Preferably, the addition of the reinforcing sheet
is carried out after the production of the antenna so
as not to be an obstacle' for the production rates of
embroidered antennas, but it could be carried out
beforehand possibly with less interesting rates and a
risk of deterioration of the needles on the embroidery
or sewing frame.
An effect sim.ilar to the addition of a sheet can
be obtained by impregnating or coating a layer or
spraying a product such as a coating, a primer, a
resin, polymer foam, a gum able to stabilise the
substrate as regards its dimension.
The assembly can be carried out by lamination,
thermo-soldering (melting of materials) or addition of
an adhesive (as a film or a liquid), with the substrate
being very low in thickness for productivity and easy
implementation.
This step also makes it possible to give a higher
thickness to the substrate to enable the reception of
at least a part of a component into the support during
the placing of the latter.
The device includes perforations 17, which may
partially be closed, in the reinforcing material
opposite each connection and terminal section 7b, 8b
connected as results from the utilisation of a very low
thickness anvil or needle applied under the conductive
wire to be connected and which perforates the material
as subsequently explained.
In Figure 5, a single pad 16, not yet connected
to the microcircuit, is placed on an embroidered wire
antenna terminal section 18 with an embroidery wire 19
for fixing the antenna on the fibrous support 2f. The
connection of a microcircuit 20 to the pad can be
carried out subsequently by any known means and more
particularly using a flip-chip.
In Figure 6, a fifth embodiment of the device
includes a connection with a hybrid antenna wire 22
insofar as the antenna wire 3 is associated with four
non conductive wires 24; the association may however be
made with at least one non conductive wire 24. The non
conductive wires 24 are preferably thermo-fusible or
thermo-plastic, so that they melt under the effect of a
thermal or ultrasonic energy.
Because of the presence of the non conductive
wires 19 and 24 according to the invention, the tool
(thermode) (T) is applied onto the metallic pad 16,
which results in melting the fixing wire and/or
associated wire going thereunder without polluting the
soldering tool. Preferably, an anvil is supporting the
antenna wire during the connection.
In Figures 8 and 9, the device includes a cavity
26 provided in the substrate and/or reinforcing sheet
or layer close the antenna connection terminal
sections. The contact pads 5, 6 are associated with a
coated microcircuit 28. The microcircuit is inserted
at least partially into the cavity thus reducing the
total thickness of the device.
As can be seen, the pads 5, 6 include a mark 30
made by the soldering tool T and the soldering 38
carried out through the pads 5, 6 on one face 11 of the
pads opposite the one 32 soldered to the wire.
Figure 10 shows another configuration of the
antenna wires 7a, 7b with respect to the contact pads
5, 6. The ends come face to face towards the chip.
The application of the connection tool T is made
transversally to the wire and to the pads and thus two
corresponding marks 30 result on the top of the pads
(free face 11) . The marks are parallel to each other
and parallel to a line L separating the pads 5 and 6.
In Figures 11 and 12, another configuration of
the device is such that the antenna wire 8b is
positioned in line with the pad but on the face of the
support 15 or even 2f (if the fabric can be handled)
opposite the one supporting the contact pad 16. In
this case, the very low thickness anvil E pushes the
antenna wire against the contact pad through the
support while fluxing the material 15 on the support
and/or pushing away the meshes of the fibrous support
2f associated or not with a reinforcing material 15.
In Figure 13, a fabric includes warp and weft
wires with a loose meshing (m) between 200]im and 300]im
and composed of 48 dtex polyamide wires.
While referring to Figure 14, a preferred
embodiment of the method of the invention will now be
described which meets the aims of the invention, but
while describing, first, the difficulties met.
To produce low cost inlays, the inventors more
particularly selected wiring antennas for example sewn.
embroidered or equivalents on the support including
fabrics.
More particularly, in embroidery, because of
problems of productivity and easy implementation,
several antennas are first produced at the same time on
embroidery frames, preferably on a textile support such
as a fibrous support like a fabric, woven, non woven or
a support which can be accepted by embroidery or sewing
machines.
However, any material capable of being sewn or
embroidered and for example including other isolating
substrates such as a film or a sheet made of polymer
material, PVC, PET (polyethylene), paper, polyimide,
synthetic leather and more particularly fibrous/fabric
and polymer sheet composites, are not excluded.
As regards the discretion of the device,
subsequently laminated or added to an object, but also
because of productivity and ease of sewing or
embroidery, the support is a very fine fabric. The
substrate of the final device may have various
thicknesses generally lower than or equal to those of a
0.76mm chip card, so that they can be used as an inlay
between two films or sheets or be used as a support for
a coating and/or a printing sheet. Typically, the
substrate may have a thickness from for example 0.1mm
to 0.5mm.
The inventors noted the absence of stability as
regards dimension or behaviour of some substrates more
particularly made of fabric, which are appropriate for
a mass production, more particularly when they are
continuous or moving. The absence of behaviour makes
it difficult or impossible to obtain a precise
positioning of the modules, microcircuits or contact
pads or cavities more particularly by an indexation on
the substrate prior to or after the production of
antennas.
Adding a reinforcing sheet or material or another
fabric to the substrate, with possibly predefined
modules reception cavities such as imagined by the
inventors, would bring dimensional stability to the
substrate but also has drawbacks, because of the
absence of behaviour of the substrate and a difficult
indexation, the cavities might be incorrectly
positioned.
Adding a sheet prior to making the antenna is not
favourable for productivity in embroidery. On the
contrary, adding this reinforcement without any cavity
will bring a dimension of stability to the substrate,
but this would increase the difficulty of a ultrasonic
or thermo-compression connection insofar as there is no
cavity for introducing a chip or a module and bringing
the contact pads of the antenna connection sections
closer to each other and make a correct soldering.
The inventors found out that the electronic
component or contact pads must preferably be placed on
the substrate after the antenna is produced to
facilitate the sewing of the antenna to increase the
production rate and because of the difficulty of
placing and connecting the module, which make it
possible to produce an economical antenna.
In addition, the antenna can be sheathed with an
isolating material, more particularly to make an
isolating bridge which intersect the windings or which
can be associated with non conductive wires or fibres
for solidity reasons or for preventing the breaking of
the wire, or for fixing it on the support. In this
case, the soldering tool can be polluted or soiled
during the connection for the ultrasonic or thermo-
compression soldering since the soldering tool
(thermode) is directly applied to the wire and is in
contact with polluting materials surrounding the
antenna wire in a configuration wherein the module is
positioned adjacent to the windings of the antenna or
below the same.
In addition, as the wire antenna rests on the
substrate and thus the inventors chose a position and a
connection of the pads above the antenna, the latter
may tend to sink into the sheet or fibrous mass added
under the effect of pressure of the soldering means
according to the nature of the material used.
After such considerations, the method of the
figure is composed as follows.
At step 100, the method for producing a device
including a transponder antenna connected to contact
pads includes a step of providing or making an antenna
with connection terminal sections supported by a
substrate.
The antenna is preferably produced by embroidery
or sewing on a flexible support including a fabric.
The antenna wire may include at least an
isolation coating on the whole of its surface. It can
also simultaneously or alternatively be in contact with
isolating wires in places. The antenna wire is fixed
on the substrate using a non conductive wire also
called an embroidery or sewing wire.
Preferably, the antenna wire is a hybrid wire
associated with at least one non conductive wire so as
to enable a better rate of productivity without the
wire breaking.
This non conductive wire surrounds the antenna
wire at least in places and constitutes a kind of
isolating sheath in places.
Preferably, a non conductive wire is thermo-
fusible or thermo-plastic to enable the removal or
elimination thereof around the soldering zone.
Non thermo-fusible wires may be appropriate
insofar as the energy of the soldering is sufficient to
remove the same, to deteriorate the same (or a
sufficient soldering material is added to go through
the same).
However, other techniques for fixing the
conductive wire on the substrate may be chosen among
other less efficient ones such as inlay or etching.
The production of the antenna by embroidery may
preferably include a step of producing a barring stitch
(not shown) of the antenna wire by sewing, embroidery,
knitting at the end of one at least of said terminal
sections. Then preferably, a step of removing said
barring stitch including the removal of material from
the support opposite the barring stitch and possible
formation of a cavity. The antenna terminal sections
or barring stitches may be superimposed or produced in
a zone of the support intended to be removed. In case
of removal of a barring stitch by punching, the
corresponding terminal section extends up to the edge
of a cavity.
As previously mentioned. the support is
preferably a very low thickness fabric but other low
thickness supports can be considered.
At step 200, then according to one
characteristic, the method includes a step during which
a reinforcing material is positioned as a sheet or a
layer on one face of the substrate opposite the one
supporting the terminal sections.
The reinforcing layer or sheet is positioned in
the example, directly after the production of the
antenna.
As already mentioned, an effect similar to the
addition of a sheet can be obtained by impregnation or
coating of a layer or spraying of a product such as a
coating, a primer, a resin, a polymer foam, a gum
capable of stabilising the substrate as regards its
dimensions.
At step 300, as the support is stabilised, it
possible to handle it and to carry out more
conventional operations such as more easily placing
contact pads on the substrate.
However, according to another characteristic, it
is preferred to execute a step of forming a cavity in
the substrate and/or reinforcing sheet or layer close
to the antenna connection terminal sections, so as to
introduce the chip or the module.
The cavity is formed by punching, but a forming
by pressure or embossing or any at least partial
machining of the substrate could also be considered.
At step 400, the pads are placed so as to have a
surface opposite an antenna connection terminal section
resting on the substrate. If need be, a chip can be
placed more particularly using the flip-chip technology
on the pads or on the rear face of the substrate or on
a contact pad for a conventional connection by any
known means or even with a soldered wire type.
The opposite surface used in the description
corresponds to a projection of the longitudinal section
of a wire on a connection pad 8b, or a rectangle the
width of which is generally equal to the diameter of
the wire and length of which is equal to the length of
the pad opposite.
Preferably, the pads are already connected to an
electronic microcircuit such as a chip. And the
microcircuit is inserted at least partially into the
cavity with the pads staying out of the cavity and
resting on the sections of tracks or antenna terminal
ends resting on the support.
A step 500 the pads are connected to the antenna
terminal sections. The connection is made by soldering
with the introduction of energy between the pads and
the terminal sections and the soldering energy is
directly applied onto the pads using a thermode for a
thermo-compression type soldering or an ultrasonic
probe for an ultrasonic soldering.
As regards soldering, an anvil is preferably used
which rests against the recess of the antenna terminal
section in the support. The anvil is all the more
recommended as the antenna wire tends to sink into the
substrate because of the fineness of the wire and/or
softness of the substrate and/or reinforcing material.
The anvil goes through at least the reinforcing
sheet or layer opposite the terminal section to be
connected so that the section to be connected is
supported by the anvil during the soldering operation.
The section of the anvil is rectangular or square for a
section of the order of 0.3xlmm^ to lx5mm^.
The invention more particularly applies as soon
as a kind of "blind" connection of a metal pad must be
performed directly on a track of an antenna or the
terminal section of an antenna, which is also metallic,
and positioned on a softer support than metal by
soldering with or without addition of a soldering
material, the reverse being a conventional operation.
A priori, during the soldering operation, the pressure
transmitted by a track or a terminal section to the
support thereof is more important than the one
transmitted by a pad because of the surface and
pressure ratio. This makes the persons skilled in the
art decide for a connection configuration which is the
reverse of the conventional one.
At step 600, the support is assembled with at
least one sheet on the side opposite the reinforcing
sheet. The sheets may for example be composed of
materials used for the sheets or the cover of a
passport or a chip card or any other object. Then they
are cut to the desired format. If need be, the cutting
may be carried out during other steps.
CLAIMS
1. A method for producing a device comprising a
transponder antenna connected to contact pads, said
method comprising the steps of:
providing or producing an antenna (3) with
terminal connections (7b, 8b) in contact with a
substrate,
placing the contact pads (5, 6) on the
substrate and connecting the same to the terminal
sections of the antenna (7b, 8b) , the connection being
produced by means of a soldering (38) while introducing
energy between the pads (5, 6) and the terminal
sections (7b, 8b),
characterised in that the pads (5, 6) are placed
so as to provide a surface (40) facing an antenna
terminal connection section (7b, 8b), said section
being arranged on the substrate (2, 2b, 2f) and the
soldering energy being applied directly to the pads (5,
6) .
2. A method according to claim 1, characterised
in that the antenna is produced by embroidery or sewing
on a flexible support (2f) including a fabric and in
that it includes a step during which a reinforcing
material (15) in the form of a sheet or a layer is
positioned on a face (36) on the substrate opposite the
one (34) bearing the terminal sections.
3. A method according to claim 2, characterised
in that the reinforcing layer or sheet is positioned on
after the production of the antenna.
4. A method according to one of the preceding
claims, characterised in that the method includes a
step of forming a cavity (26)- in the substrate and/or
reinforcing sheet or layer close to the antenna
connection terminal sections (7b, 8b).
5. A method according to claim 4, characterised
in that the method includes a step during which the
contact pads associated with a microcircuit (20) are
placed facing the antenna terminal sections (7b, 8b),
the microcircuit being inserted at least partially into
the cavity (26).
6. A method according to one of the preceding
claims, characterised in that the method includes a
step during which a soldering (38) of the thermo-
compression or ultrasonic type is executed.
7. A method according to claim 6, characterised
in that the soldering utilises an anvil (E) which rests
against the recess in the antenna terminal section in
the support.
8. A method according to claim 7, characterised
in that the anvil goes creates a hole (17) in the
reinforcing sheet or layer (15) facing the connection
terminal sections so that the connection section (7b,
8b) is supported by the anvil during the soldering.
9. A method according to one of the preceding
claims, characterised in that the antenna wire (3)
includes at least an isolating coating (13) on the
whole surface thereof and/or is in contact with
isolating wires in places.
10. A method according to one of the preceding
claims, characterised in that the antenna wire is fixed
on the substrate using a non conductive wire (19).
11. A method according to one of the preceding
claim, characterised in that the antenna wire is a
hybrid wire (22) associated with at least one non
conductive wire.
12. A method according to the preceding claim,
characterised in that the non conductive wire (19)
surrounds the antenna wire at least in places.
13. A method according to one of claims 11 to 12,
characterised in that the non conductive wire (19) is
thermo-fusible or thermoplastic.
14. A method according to claim 10, characterised
in that the technique for fixing a conductive wire to
the substrate is selected among sewing, embroidery,
inlay.
15. A device including an antenna (3) connected
to contact pads (5, 6), said device including a
substrate and an antenna provided with connection
terminal sections (7b, 8b) resting on the substrate (2,
2b, 2f, 15),
said antenna being connected by a soldering (38)
to the terminal sections, characterised in that the
electric contact pads have a surface (40) facing a
antenna connection terminal section (7b, 8b), said
section being positioned on the substrate.
16. A device according to claim 15, characterised
in that the antenna (3) is produced by embroidery or
sewing on a flexible support (2f) including a fabric
and in that it includes a reinforcing material (15) in
the form of a sheet or a layer on a face of the
substrate opposite the one supporting the terminal
sections.
17. A device according to one of claims 15 or 16,
characterised in that it includes a cavity (26) in the
substrate and/or the reinforcing sheet or layer close
to the antenna connection terminal sections.
18. A device according to claim 17, characterised
in that the contact pads are associated with a
microcircuit (20) and facing the substrate and the
antenna terminal sections resting on the substrate
whereas the microcircuit is inserted at least partially
into the cavity (26).
19. A device according to one of claims 15 to 18,
characterised in that the pads include a soldering mark
(30) across the pads on a face of the pads opposite the
soldered one.
20. A device according to claim 15 to 19,
characterised in that it includes perforations (17) in
the reinforcing material opposite each of the connected
terminal section.
21. A device according to claims 15 to 20,
characterised in that the antenna wire is a hybrid wire
(22) associated with at least one non conductive wire.
22. A device according to claim 15 to 21,
characterised in that the non conductive wire is
thermo-fusible or thermoplastic.
23. A radio frequency communication electronic
product such as a contactless chip card, a passport
containing the device according to one of claims 15 to
22.

The invention relates to a method for producing a device comprising a transponder antenna connected to contact
pins, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with
a substrate, placing the contact pad (5, 6) on the substrate ad connecting the same to the terminal sections of the antenna (7b, 8b),
the connection being produced by means of a soldering (38) by introducing energy between the pads (5, 6) and the terminal sections
(7b, 8b). The method is characterised in that the pads (5, 6) are placed such as to provide a surface (40) facing an antenna terminal
connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f) and the soldering energy being directly applied
to the pads (5, 6). The invention also relates to the device obtained.

Documents:

http://ipindiaonline.gov.in/patentsearch/GrantedSearch/viewdoc.aspx?id=k/B05wCn9XOYHtfX8duqTA==&loc=wDBSZCsAt7zoiVrqcFJsRw==

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Patent Number

270576

Indian Patent Application Number

3902/KOLNP/2009

PG Journal Number

01/2016

Publication Date

01-Jan-2016

Grant Date

31-Dec-2015

Date of Filing

10-Nov-2009

Name of Patentee

GEMALTO SA

Applicant Address

6, RUE DE LAVERRERIE, F-92190 MEUDON FRANCE

Inventors:

#	Inventor's Name	Inventor's Address
1	ROBLES, LAURENCE	ROUTE SOURCE DES NAYES, F-83640 SAINT ZACHARIE FRANCE
2	MARTINENT, JEAN-FRANCOIS	RÉSIDENCE L'EMPYRÉE, BT B, 2, RUE PASCAL FIESCHI, F-13090 AIX EN PROVENCE FRANCE
3	ROUSSEL, FRANCOIS	9, CHEMIN DU RU D'AULNAY, F-92330 SCEAUX FRANCE

PCT International Classification Number

H01Q1/22;G06K19/077;H01Q1/22

PCT International Application Number

PCT/EP2008/055859

PCT International Filing date

2008-05-13

PCT Conventions:

#	PCT Application Number	Date of Convention	Priority Country
1	07301057.1	2007-05-21	EUROPEAN UNION