Title of Invention

AN APPARATUS FOR CHEMICALLY PROCESSING A SEMICONDUCTOR WAFER

Abstract A semiconductor wafer processing and analysis apparatus (20) includes a processing micro chamber (22) for closely receiving a semiconductor wafer (27) therein. The chamber may be opened for loading and removing the semiconductor wafers and then closed for processing of the wafer wherein chemical reagents and other fluids are introduced into the chamber. Small clearances are provided between the upper surface, the lower surfaces, and the perimeter edge of the wafer and the corresponding portions of the processing chamber. A high-speed collection system is provided for collecting and removing the spent reagents and fluids from the chamber for either on-line or off-line analysis or for waste treatment.
Full Text

Documents:

0120-chenp-2006 complete specification as granted.pdf

120-CHENP-2006 CORRESPONDENCE OTHERS.pdf

120-CHENP-2006 CORRESPONDENCE PO.pdf

120-CHENP-2006 FORM-1.pdf

120-CHENP-2006 FORM-18.pdf

120-CHENP-2006 FORM-3.pdf

120-CHENP-2006 FORM-5.pdf

120-CHENP-2006 PCT.pdf

120-CHENP-2006 PETITIONS.pdf

120-CHENP-2006 POWER OF ATTORNEY.pdf


Patent Number 234195
Indian Patent Application Number 120/CHENP/2006
PG Journal Number 24/2009
Publication Date 12-Jun-2009
Grant Date 08-May-2009
Date of Filing 10-Jan-2006
Name of Patentee WEN, Sophia
Applicant Address 16262 S.E. Bluff Road, Sandy, OR 97055,
Inventors:
# Inventor's Name Inventor's Address
1 WEN, Sophia 16262 S.E. Bluff Road, Sandy, OR 97055,
PCT International Classification Number H01L 21/00
PCT International Application Number PCT/US2004/018516
PCT International Filing date 2004-06-10
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 60/478,384 2003-06-13 U.S.A.