Title of Invention | “PROCESS FOR MANUFACTURING MICROMECHANICAL DEVICES CONTAINING A GETTER MATERIAL AND DEVICES SO MANUFACTURED” |
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Abstract | A process for manufacturing micromechanical devices is described, said devices being formed by joining two parts together by direct bonding, one of the parts (12) being made of silicon and the other one being made of a material chosen between silicon and a semiconductor ceramic or oxidic material, such that the joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13). |
Full Text | The present invention relates to a process for manufacturing micromechanical devices containing a getter material and to the devices manufacturred through this process.............. |
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2136-CHENP-2008 AMENDED CLAIMS 18-11-2014.pdf
2136-CHENP-2008 AMENDED PAGES OF SPECIFICATION 18-11-2014.pdf
2136-CHENP-2008 EXAMINATION REPORT REPLY RECEIVED 18-11-2014.pdf
2136-CHENP-2008 FORM-1 18-11-2014.pdf
2136-CHENP-2008 FORM-3 18-11-2014.pdf
2136-CHENP-2008 OTHERS 18-11-2014.pdf
2136-CHENP-2008 POWER OF ATTORNEY 18-11-2014.pdf
2136-CHENP-2008 FORM-18 12-08-2009.pdf
Patent Number | 265764 | ||||||||
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Indian Patent Application Number | 2136/CHENP/2008 | ||||||||
PG Journal Number | 12/2015 | ||||||||
Publication Date | 20-Mar-2015 | ||||||||
Grant Date | 13-Mar-2015 | ||||||||
Date of Filing | 29-Apr-2008 | ||||||||
Name of Patentee | SAES GETTERS S.P.A. | ||||||||
Applicant Address | Viale Italia 77 I-20020 Lainate MI Italy | ||||||||
Inventors:
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PCT International Classification Number | N/A | ||||||||
PCT International Application Number | PCT/IT2006/000824 | ||||||||
PCT International Filing date | 2006-11-28 | ||||||||
PCT Conventions:
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